HEAT TREATMENT SYSTEM, HEAT TREATMENT METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

• US 20130260039A1
• Filed: 03/28/2013
• Published: 10/03/2013
• Est. Priority Date: 03/29/2012
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: TAKENAGA, Yuichi, WANG, Wenling
• Granted Patent: US 9,259,761 B2
• Time in Patent Office: Days
• US Class Current: 427/314
• CPC Class Codes: B05C 9/14 the auxiliary operation involving heating or cooling
• CPC Class Codes: B05D 3/0218 Pretreatment, e.g. heating the substrate
• CPC Class Codes: H01L 21/324 Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering H01L21/20 - H01L21/288 and H01L21/302 - H01L21/322 take precedence

Abstract

According to an embodiment of the present invention, a heat treatment system is provided. The heat treatment system includes a heating unit, a heat treatment condition memory unit, a power change model memory unit, a heat treatment change model memory unit, a heat treatment result reception unit, and an optimal temperature calculation unit. In the heat treatment system, the optimal temperature calculation unit calculates the power of the heating unit at a corresponding temperature based on the model stored in the power change model memory unit and the calculated temperature, and an optimal temperature is a temperature at which a heat treatment result is closest to the targeted heat treatment result within a range in which the calculated power of the heating unit is not saturated.

Claims

1. A heat treatment system, comprising:

a heating unit configured to heat an inside of a processing chamber which receives a plurality of objects to be processed;

a heat treatment condition memory unit configured to store a heat treatment condition based on processing details, wherein the heat treatment condition includes a temperature inside the processing chamber heated by the heating unit;

a power change model memory unit configured to store a model showing a relationship between a temperature change inside the processing chamber and a power change of the heating unit;

a heat treatment change model memory unit configured to store a heat treatment change model showing a relationship between the temperature change inside the processing chamber and a change of a heat treatment result;

a heat treatment result reception unit configured to receive information on a heat treatment result in the heat treatment condition stored by the heat treatment condition memory unit and a targeted heat treatment result; and

an optimal temperature calculation unit configured to calculate an optimal temperature corresponding to the targeted heat treatment result based on the heat treatment result in the heat treatment condition and the heat treatment change model stored in the heat treatment change model memory unit, wherein the heat treatment result is received by the heat treatment result reception unit,

wherein the optimal temperature calculation unit calculates power of the heating unit at a corresponding temperature on the basis of the model stored in the power change model memory unit and the calculated temperature, and an optimal temperature is a temperature at which a heat treatment result is closest to the targeted heat treatment result within a range in which the calculated power of the heating unit is not saturated.

2. The heat treatment system of claim 1, wherein,

the processing chamber is divided into a plurality of zones,

in the heating unit, a temperature is set in each zone inside the processing chamber,

the heat treatment condition stored in the heat treatment condition memory unit is set in each zone inside the processing chamber,

the power change model stored in the power change model memory unit shows a relationship between a temperature change inside the processing chamber in each zones and a power change of the heating unit in each zone,

the heat treatment change model stored in the heat treatment change model memory unit shows a relationship between the temperature change inside the processing chamber in each zone and a change of the heat treatment result for each zone,

the heat treatment result reception unit receives information on a targeted heat treatment result for each zone, and

the optimal temperature calculation unit calculates an optimal temperature of each zone.

3. The heat treatment system of claim 1, wherein,

the processing details include a film formation processing, and

the heat treatment result includes a film thickness of a thin film formed on an object to be processed.

4. A heat treatment method, comprising:

storing a heat treatment condition based on processing details, wherein the heat treatment condition includes a temperature inside a processing chamber heated by a heating unit that heats an inside of the processing chamber which receives a plurality of objects to be processed;

storing a power change model showing a relationship between a temperature change inside the processing chamber and a power change of the heating unit;

storing a heat treatment change model showing a relationship between the temperature change inside the processing chamber and a change of a heat treatment result;

receiving a heat treatment result which is information on the heat treatment result in the heat treatment condition stored by the storing of the heat treatment condition and a targeted heat treatment result; and

calculating an optimal temperature corresponding to the targeted heat treatment result, on the basis of the heat treatment result in the heat treatment condition and the heat treatment change model stored by the storing of the heat treatment change model, wherein the heat treatment result is received by the receiving of the heat treatment result,

wherein the calculating of an optimal temperature calculates power of the heating unit at a corresponding temperature on the basis of the model stored by the storing of the power change model and the calculated temperature, and an optimal temperature is a temperature at which a heat treatment result is closest to the targeted heat treatment result within a range in which the calculated power of the heating unit is not saturated.

5. A non-transitory computer-readable recording medium that causes a computer to perform as:

a heat treatment condition memory unit configured to store a heat treatment condition based on processing details, wherein the heat treatment condition includes a temperature inside a processing chamber heated by a heating unit that heats an inside of the processing chamber which receives a plurality of objects to be processed;

a power change model memory unit configured to store a model showing a relationship between a temperature change inside the processing chamber and a power change of the heating unit;

a heat treatment change model memory unit configured to store a heat treatment change model showing a relationship between the temperature change inside the processing chamber and a change of a heat treatment result;

a heat treatment result reception unit configured to receive information on a heat treatment result in the heat treatment condition stored by the heat treatment condition memory unit and a targeted heat treatment result; and

an optimal temperature calculation unit configured to calculate an optimal temperature corresponding to the targeted heat treatment result, on the basis of the heat treatment result in the heat treatment condition and the heat treatment change model stored in the heat treatment change model memory unit, wherein the heat treatment result is received by the heat treatment result reception unit,

wherein the optimal temperature calculation unit calculates power of the heating unit at a corresponding temperature on the basis of the model stored in the power change model memory unit and the calculated temperature, and an optimal temperature is a temperature at which a heat treatment result is closest to the targeted heat treatment result within a range in which the calculated power of the heating unit is not saturated.