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ELECTRONIC DEVICES

  • US 20130260058A1
  • Filed: 02/11/2013
  • Published: 10/03/2013
  • Est. Priority Date: 12/14/2002
  • Status: Abandoned Application
First Claim
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1. A method for solution deposition of at least one pattern of material on a substrate comprising:

  • (a) depositing onto a surface of a substrate an intermediate layer, wherein the substrate is one of hydrophobic and hydrophilic and the intermediate layer is the other of hydrophilic and hydrophobic;

    (b) depositing a sacrificial layer onto a surface of the intermediate layer;

    (c) embossing the sacrificial layer so as to define at least one depressed region and at least one raised region;

    (d) etching the sacrificial layer and the intermediate layer so as to reveal the surface of the substrate in the areas defined by the one or more depressed regions, and leaving the intermediate layer in the areas defined by the one or more raised regions;

    (e) removing any remainder of the sacrificial layer in the areas defined by the one or more raised regions; and

    (f) using the etched intermediate layer to control the deposition of a solution of said material on to the substrate.

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