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PLASMA PROCESSING APPARATUS

  • US 20130264014A1
  • Filed: 03/12/2013
  • Published: 10/10/2013
  • Est. Priority Date: 03/12/2012
  • Status: Active Grant
First Claim
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1. A plasma processing apparatus comprising:

  • a processing chamber configured to accommodate a substrate;

    a mounting table provided in the processing chamber and configured to mount thereon the substrate;

    an applied antenna provided outside the processing chamber opposite to the mounting table and configured to supply a high frequency power or a microwave into the processing chamber; and

    a window member made of a conductor, which forms a part of a wall of the processing chamber and is disposed between the mounting table and the applied antenna,wherein the window member includes transmission units configured to transmit the high frequency power or the microwave in a thickness direction of the window member, andwherein each of the transmission units includes a slit extending through the window member in the thickness direction, and a width adjustment mechanism for adjusting a width of the slit.

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