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Thermal management system containing an integrated graphene film for electronic devices

  • US 20130264041A1
  • Filed: 04/09/2012
  • Published: 10/10/2013
  • Est. Priority Date: 04/09/2012
  • Status: Active Grant
First Claim
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1. A graphene-based heat dissipation system for an electronic device, comprising:

  • (a) an electronic device comprising a heat source, wherein the heat source transmits heat to a second component or an external surface of the electronic device;

    (b) a heat-conducting layer comprising two major surfaces, the heat-conducting layer being positioned such that one of its major surfaces is in operative contact with the heat source such that it is interposed between the heat source and the second component or the external surface of the electronic device;

    wherein the heat-conducting layer comprises at least one sheet of integrated graphene film which thermally shields the second component or the external surface of the electronic device from heat generated by the heat source.

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