METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
First Claim
1. A method of fabricating a semiconductor device, the method comprising:
- forming a plurality of semiconductor stack structures on a first surface of a support substrate, wherein each of the semiconductor stack structures comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and an active region interposed between the first and second conductive semiconductor layers;
forming a member comprising a plurality of first lead electrodes and second lead electrodes, wherein a first and second lead electrode of the plurality of first and second lead electrodes respectively corresponds to a semiconductor stack structure of the plurality of semiconductor stack structures;
bonding the plurality of semiconductor stack structures to the member while maintaining the plurality of semiconductor stack structures on the support substrate; and
dividing the member after the plurality of semiconductor stack structures are bonded to the member.
0 Assignments
0 Petitions
Accused Products
Abstract
A method of fabricating a semiconductor device using gang bonding and a semiconductor device fabricated by the same, the method comprising preparing a support substrate having a plurality of semiconductor stack structures aligned on a top thereof. Each of the semiconductor stack structures comprises a first conductive semiconductor layer, a second conductive semiconductor layer and an active region interposed between the first and second conductive semiconductor layers. A member having first lead electrodes and second lead electrodes is prepared to correspond to the plurality of semiconductor stack structures. Then, the semiconductor stack structures are bonded to the member while maintaining the semiconductor stack structures on the support substrate. After the semiconductor stack structures are bonded to the member, the member is divided.
-
Citations
38 Claims
-
1. A method of fabricating a semiconductor device, the method comprising:
-
forming a plurality of semiconductor stack structures on a first surface of a support substrate, wherein each of the semiconductor stack structures comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and an active region interposed between the first and second conductive semiconductor layers; forming a member comprising a plurality of first lead electrodes and second lead electrodes, wherein a first and second lead electrode of the plurality of first and second lead electrodes respectively corresponds to a semiconductor stack structure of the plurality of semiconductor stack structures; bonding the plurality of semiconductor stack structures to the member while maintaining the plurality of semiconductor stack structures on the support substrate; and dividing the member after the plurality of semiconductor stack structures are bonded to the member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
-
-
23. A semiconductor device, comprising:
-
a member comprising a first lead electrode and a second lead electrode; a semiconductor stack structure disposed on the member, the semiconductor stack structure comprising a first conductive semiconductor layer, a second conductive semiconductor layer, and an active region interposed between the first and second conductive semiconductor layers; and a plating layer configured to bond the semiconductor stack structure to the member. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 38)
-
-
33. A semiconductor device, comprising:
-
a member comprising a first lead electrode and a second lead electrode; a semiconductor stack structure disposed on the member, the semiconductor stack structure comprising a first conductive semiconductor layer, a second conductive semiconductor layer, and an active region interposed between the first and second conductive semiconductor layers; a first electrode electrically connected to the first conductive semiconductor layer; a second electrode electrically connected to the second conductive semiconductor layer; a first conductive adhesive configured to bond the first electrode to the first lead electrode; and a second conductive adhesive configured to bond the second electrode to the second lead electrode. - View Dependent Claims (34, 35, 36, 37)
-
Specification