ELECTRONIC DEVICE, SYSTEM, AND METHOD COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES

• US 20130264662A1
• Filed: 05/31/2013
• Published: 10/10/2013
• Est. Priority Date: 01/24/2007
• Status: Active Grant

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: BALDO, Lorenzo, COMBI, Chantal, CORTESE, Mario Francesco
• Granted Patent: US 8,847,340 B2
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: G01L 19/141 Monolithic housings, e.g. molded or one-piece housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.

Claims

1. An apparatus, comprising:

a support;

a sensor structure disposed over the support, including a sensor element, and including a sensor opening aligned with the sensor element; and

a package disposed over the support and adjacent to the sensor structure and having a package opening aligned with the sensor opening.

2. The apparatus of claim 1, further comprising a layer disposed between the sensor structure and the support.

3. The apparatus of claim 1, further comprising a plurality of sensor elements aligned with the sensor opening.

4. The apparatus of claim 1, wherein the sensor structure comprises a semiconductor die.

5. The apparatus of claim 1, wherein the sensor opening comprises a side wall substantially orthogonal to a surface of the support.

6. The apparatus of claim 5, wherein the support further comprises a substrate.

7. The apparatus of claim 1, further comprising a permeable cover disposed over the sensor opening.

8. The apparatus of claim 1, wherein the sensor structure is electrically connected to the support through conductive structures between the sensor structure and the support.

9. The apparatus of claim 1, wherein the support further comprises conductive lands disposed on the support.

10. The apparatus of claim 1, wherein the package is contiguous with a portion of sensor structure and contiguous with the support.

11. The apparatus of claim 1, wherein the package opening further comprises a cylindrical projection.

12. The apparatus of claim 1, further comprising a layer contiguous with the sensor structure, the support, and the package.

13. The apparatus of claim 1, wherein the package further comprises a protective substance formed from resin-injection molding.

14. The apparatus of claim 1, wherein the sensor structure further comprises:

a first layer;

a second layer disposed over the first layer; and

an adhesive layer disposed between the first and second layers.

15. A system, comprising:

a sensor, including;

a support;

a sensor structure disposed over the support, including a sensor element, and including a sensor opening aligned with the sensor element; and

a package disposed over the support and adjacent to the sensor structure and having a package opening aligned with the sensor opening; and

a controller coupled to the sensor

16. The system of claim 15, wherein the controller further comprises a processor.

17. The system of claim 15, further comprising a memory coupled to the controller.

18. The system of claim 15, wherein the sensor comprises an integrated circuit.

19. An integrated circuit, comprising:

a support;

a sensor structure disposed over the support, including a sensor element, and including a sensor opening aligned with the sensor element; and

a package disposed over the support and adjacent to the sensor structure and having a package opening aligned with the sensor opening.

20. The integrated circuit of claim 19, further comprising a single integrated circuit die.