BUILT-IN SELF-TEST METHOD AND STRUCTURE
First Claim
1. A method of testing a semiconductor wafer, the method comprising:
- placing a probe on a first chip on the semiconductor wafer;
testing a scribe line automatic built-in self-test (ABIST) for the first chip to search for a fault;
progressively testing a subsequent scribe line ABIST for a subsequent chip on the semiconductor wafer in response to determining the ABIST for the first chip does not indicate the fault;
moving the probe point to the subsequent chip and retesting the subsequent scribe line ABIST in response to determining the ABIST for the subsequent chip indicates a fault; and
testing a further subsequent scribe line ABIST for a further subsequent chip on the semiconductor wafer in response to determining the retesting of the subsequent scribe line ABIST does not indicate a fault in the subsequent scribe line ABIST.
1 Assignment
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Accused Products
Abstract
A method of testing a semiconductor wafer and a related structure. In various embodiments, a method includes: placing a probe on a first chip on the semiconductor wafer; testing a scribe line automatic built-in self-test (ABIST) for the first chip to search for a fault; progressively testing a subsequent scribe line ABIST for a subsequent chip on the semiconductor wafer in response to determining the ABIST for the first chip does not indicate the fault; moving the probe point to the subsequent chip and retesting the subsequent scribe line ABIST in response to determining the ABIST for the subsequent chip indicates a fault; and testing a further subsequent scribe line ABIST for a further subsequent chip on the semiconductor wafer in response to determining the retesting of the subsequent scribiline ABIST does not indicate a fault in the subsequent scribe line ABIST.
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Citations
20 Claims
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1. A method of testing a semiconductor wafer, the method comprising:
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placing a probe on a first chip on the semiconductor wafer; testing a scribe line automatic built-in self-test (ABIST) for the first chip to search for a fault; progressively testing a subsequent scribe line ABIST for a subsequent chip on the semiconductor wafer in response to determining the ABIST for the first chip does not indicate the fault; moving the probe point to the subsequent chip and retesting the subsequent scribe line ABIST in response to determining the ABIST for the subsequent chip indicates a fault; and testing a further subsequent scribe line ABIST for a further subsequent chip on the semiconductor wafer in response to determining the retesting of the subsequent scribe line ABIST does not indicate a fault in the subsequent scribe line ABIST. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor wafer structure, comprising:
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a plurality of chips; and a plurality of scribe lines, each scribe line separating two adjacent chips in the plurality of chips, wherein each scribe line includes a built-in self-test (BIST) engine configured to provide identity information about the scribe line in response to contact from a probe. - View Dependent Claims (12, 13, 14, 15)
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16. A method of testing a semiconductor wafer, the method comprising:
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placing a probe on a chip on the semiconductor wafer; testing a scribe line automatic built-in self-test (ABIST) for the chip to search for a fault; progressively testing a subsequent scribe line ABIST for each of a plurality of subsequent chips on the semiconductor wafer in response to determining the ABIST for the first chip does not indicate the fault; moving the probe point to a first subsequent chip and retesting the subsequent scribe line ABIST for the first subsequent chip in response to determining the ABIST for the first subsequent chip indicates a fault; moving the probe point to a further subsequent chip in the plurality of subsequent chips and testing a further subsequent scribe line ABIST for the further subsequent chip in response to the retesting of the subsequent scribe line ABIST indicating a fault; and testing a remainder of the plurality of subsequent chips to search for an additional fault. - View Dependent Claims (17, 18, 19, 20)
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Specification