Thermal Interface Materials with Thin Film or Metallization

• US 20130265721A1
• Filed: 05/20/2013
• Published: 10/10/2013
• Est. Priority Date: 11/05/2007
• Status: Active Grant

• Current Assignee: Laird Technologies Incorporated (DuPont de Nemours, Inc.)
• Original Assignee: Laird Technologies Incorporated (DuPont de Nemours, Inc.)
• Inventors: Strader, Jason L., Wisniewski, Mark, Bruzda, Karen, Craig, Michael D.
• Granted Patent: US 9,795,059 B2
• Time in Patent Office: Days
• US Class Current: 361/705
• CPC Class Codes: B22F 7/04 with one or more layers not made from powder, e.g. made from solid metal
• CPC Class Codes: B29C 39/14 for making articles of indefinite length by depositing material on a substrate and stripping off the shaped article B29C41/24
• CPC Class Codes: B29C 39/20 Making multilayered or multicoloured articles B29C39/142 takes precedence
• CPC Class Codes: B29C 41/24 for making articles of indefinite length
• CPC Class Codes: B29C 41/32 Making multilayered or multicoloured articles
• CPC Class Codes: B29C 43/22 of articles of indefinite length
• CPC Class Codes: B29C 43/30 Making multilayered or multicoloured articles B29C43/26 takes precedence
• CPC Class Codes: B29C 43/44 Compression means for making articles of indefinite length
• CPC Class Codes: B32B 2255/205 Metallic coating
• CPC Class Codes: B32B 2307/30 having particular thermal properties
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2307/402 Coloured
• CPC Class Codes: B32B 2307/404 Multi-coloured
• CPC Class Codes: B32B 2307/51 Elastic
• CPC Class Codes: B32B 2307/748 Releasability
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 25/08 of synthetic resin
• CPC Class Codes: B32B 25/20 comprising silicone rubber
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/10 of paper or cardboard
• CPC Class Codes: B32B 27/28 : comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
• CPC Class Codes: B32B 27/283 : comprising polysiloxanes
• CPC Class Codes: B32B 3/10 : characterised by a discontinuous layer, i.e. formed of separate pieces of material
• CPC Class Codes: B32B 3/14 : characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side B32B5/02 takes precedence
• CPC Class Codes: B32B 37/00 : Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
• CPC Class Codes: B32B 37/10 : characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: B32B 37/12 : characterised by using adhesives
• CPC Class Codes: B32B 37/14 : characterised by the properties of the layers
• CPC Class Codes: B32B 37/15 : with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
• CPC Class Codes: B32B 7/00 : Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
• CPC Class Codes: B32B 7/04 : Interconnection of layers
• CPC Class Codes: B32B 7/06 : permitting easy separation
• CPC Class Codes: B32B 7/12 : using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C09J 183/04 : Polysiloxanes
• CPC Class Codes: C09J 2203/00 : Applications of adhesives in processes or use of adhesives in the form of films or foils
• CPC Class Codes: C09J 2203/326 : for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 7/20 : characterised by their carriers
• CPC Class Codes: C09J 7/21 : Paper; Textile fabrics
• CPC Class Codes: C09J 7/22 : Plastics; Metallised plastics
• CPC Class Codes: C09J 7/30 : characterised by the adhesive composition
• CPC Class Codes: C09J 7/40 : characterised by release liners
• CPC Class Codes: H01L 2023/4037 : characterised by thermal path or place of attachment of heatsink
• CPC Class Codes: H01L 23/34 : Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/36 : Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/373 : Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 23/3735 : Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/3737 : Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/40 : Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs
• CPC Class Codes: H01L 23/42 : Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20 : Modifications to facilitate cooling, ventilating, or heating
• CPC Class Codes: H05K 7/2039 : characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20454 : with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
• CPC Class Codes: H05K 7/20472 : Sheet interfaces
• CPC Class Codes: H05K 7/20481 : characterised by the material composition exhibiting specific thermal properties
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/14 : Layer or component removable to expose adhesive
• CPC Class Codes: Y10T 428/1471 : Protective layer
• CPC Class Codes: Y10T 428/1476 : Release layer
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/265 : 1 mil or less
• CPC Class Codes: Y10T 428/2839 : with release or antistick coating
• CPC Class Codes: Y10T 428/2852 : Adhesive compositions

Abstract

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Claims

1. A thermal interface material assembly comprising:

a thermal interface material having a first side and a second side, and which is conformable to a mating surface; and

a dry material having a thickness of about 0.0005 inches or less, the dry material disposed along at least a portion of the first side of the thermal interface material,

wherein the dry material is configured to be releasable from a mating component when in contact therewith, thereby allowing the thermal interface material assembly after being positioned with the dry material against the mating component to release from the mating component and with the dry material remaining disposed along the thermal interface material.

2. The thermal interface material assembly of claim 1, wherein the thermal interface material is conformable at room temperature without having to undergo a phase change.

3. The thermal interface material assembly of claim 1, wherein the thermal interface material comprises a non-phase change gap filler, gap pad, or putty that is conformable without having to undergo a phase change.

4. The thermal interface material assembly of claim 1, wherein the thermal interface material comprises a nonmetal that is conformable without having to undergo a phase change.

5. The thermal interface material assembly of claim 1, wherein the dry material comprises a dry film, plastic, or paper that does not include electrically-conductive filler.

6. The thermal interface material of claim 1, wherein:

the thermal interface material comprises polymer; and

the thermal interface material has a thermal conductivity of at least 0.3 Watts per meter per Kelvin, a Young'"'"'s module less than 1 gigapascal, and a Shore 00 hardness value less than 100 such that the thermal interface material is able to adjust for tolerance or gaps by deflecting at room temperature of 20°

C. to 25°

C.

7. The thermal interface material assembly of claim 1, wherein the dry material is configured to allow for a clean release of the thermal interface material assembly from a surface in contact with the dry material without leaving residue on the surface.

8. The thermal interface material assembly of claim 1, wherein the dry material comprises a dry material configured to release from a carrier liner for transfer to the first side of the thermal interface material, whereupon removal of the carrier liner, the dry material remains disposed along the thermal interface material and is exposed for positioning against a mating component.

9. The thermal interface material assembly of claim 1, wherein the dry material is disposed along two or more portions of the first side of the thermal interface material in a predetermined pattern tailored for a custom release of the thermal interface material assembly such that tack on the thermal interface material is deadened where the dry material is located.

10. The thermal interface material assembly of claim 1, wherein the dry material has a thickness of 0.0005 inches or 5 angstroms.

11. The thermal interface material assembly of claim 1, further comprising a substrate supporting the dry material, and wherein the substrate is laminated to the thermal interface material such that the dry material is between the substrate and the first side of the thermal interface material, and wherein the substrate is removable from the thermal interface material assembly to thereby expose the dry material, which remains disposed along the first side of the thermal interface material for positioning against a mating component.

12. The thermal interface material assembly of claim 1, further comprising a release liner having a release side with a release coating thereon, and wherein:

the dry material is disposed on the release coating on the release side of the release liner;

the release liner is laminated to the thermal interface material such that the dry material is between the release side of the release liner and the first side of the thermal interface material without any intervening layers; and

the release liner is configured to be removable from the thermal interface material assembly such that removal of the release liner exposes the dry material which remains disposed along the first side of the thermal interface material for positioning against a mating component.

13. The thermal interface material assembly of claim 1, wherein the dry material is deposited directly onto the thermal interface material.

14. An apparatus comprising the thermal interface material assembly of claim 1, a heat-generating component, and a heat sink, wherein the thermal interface material assembly is disposed between the heat-generating component and the heat sink such that a thermally-conducting heat path is defined by the heat-generating component, the thermal interface material assembly, and the heat sink.

15. A method of making a thermal interface material assembly, the method comprising providing a thermal interface material with a dry material along at least a portion of a first side of the thermal interface material such that the dry material has a thickness of about 0.0005 inches or less, wherein:

the thermal interface material is conformable to a mating surface; and

the dry material is configured to be releasable from a mating component when in contact therewith, thereby allowing the thermal interface material assembly after being positioned with the dry material against the mating component to release from the mating component and with the dry material remaining disposed along the thermal interface material.

16. The method of claim 15, wherein providing the thermal interface material with the dry material includes:

depositing material directly onto a surface portion of the thermal interface material or onto a surface portion of a release liner for subsequent transfer to the thermal interface material; and

/or

transferring a dry material from a carrier liner to the thermal interface material;

and/or providing the thermal interface material with a dry film having a thickness of about 0.0005 inches or about 5 angstroms.

17. The method of claim 15, wherein the thermal interface material comprises a phase change material, and wherein providing the thermal interface material with the dry material includes:

heating the phase change material to a temperature above a melting temperature of the phase change material; and

extruding the molten phase change material while using a transfer film as a liner.

18. The method of claim 15, wherein the thermal interface material comprises a phase change material, and wherein providing the thermal interface material with the dry material includes:

heating the phase change material to a temperature above a melting temperature of the phase change material;

heating a lamination nip and a table;

placing one of a release liner or a transfer film on the heated table;

spreading the heated molten phase change material generally across a width of at least one edge of said one of the release liner or transfer film that was placed on the heated table;

placing the other one of said release liner and transfer film on the phase change material such that the phase change material is between the release liner and transfer film;

drawing the release liner, phase change material, and transfer film through the heated lamination nip and allowing the phase change material to flow laterally and coat the transfer film and release liner; and

allowing the release liner, phase change material, and transfer film to cool to room temperature.

19. The method of claim 15, wherein the thermal interface material comprises a gap pad material, and wherein providing the thermal interface material with the dry material includes:

drawing uncured bulk gap material sandwiched between a dry film, and a release liner through a gapped nip and into a oven; and

allowing the uncured bulk gap pad material to cure in the oven.

20. A method associated with heat transfer from a heat-generating component, the method comprising installing a thermal interface material assembly between a surface of the heat-generating component and a surface of a heat sink to thereby establish a thermally conducting heat path defined by the heat-generating component, the thermal interface material assembly, and the heat sink, the thermal interface material assembly including:

a thermal interface material that is conformable to the surface of the heat-generating component and the surface of the heat sink; and

a dry material having a thickness of about 0.0005 inches or less disposed along at least a portion of the thermal interface material, wherein the dry material is configured to be releasable from a mating component when in contact therewith, thereby allowing the thermal interface material assembly after being positioned with the dry material against the mating component to release from the mating component and with the dry material remaining disposed along the thermal interface material.