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Power Module and Power Conversion Device Using Power Module

  • US 20130265724A1
  • Filed: 06/29/2011
  • Published: 10/10/2013
  • Est. Priority Date: 06/30/2010
  • Status: Active Grant
First Claim
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1. A power module, comprising:

  • a power unit equipped with a plurality of power semiconductor devices;

    heat sinks; and

    a housing case, whereinthe power unit includes the power semiconductor devices, lead frames, and a sealing resin;

    the lead frames are coupled to the surfaces of each of the power semiconductor devices, and parts of the external surfaces of the upper and lower lead frames are bared out of the sealing resin;

    the housing case includes a housing base and a housing cover, and the housing base, heat sink, power unit, heat sink, and housing cover are layered in that order;

    assuming that S1 denotes the outline size of the housing base, S2 denotes the outline size of the housing cover, and S3 denotes the size of a lead frame bared part of the power unit, the relationship of S1>

    S2>

    S3 is established; and

    the housing cover is pressed and fixed to a receiving part of the housing base.

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