HEAT-SINK/CONNECTOR SYSTEM FOR LIGHT EMITTING DIODE
First Claim
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1. An LED assembly comprising:
- an LED dissipating during operation at least 500 mW;
a ceramic heat sink providing a first surface supporting the LED and in thermal communication with the LED;
a first and second conductor in electrical communication with the LED;
a sealed housing receiving the ceramic heat sink and LED therein, the sealed housing having a first portion fitting over the LED to permit the passage of light therethrough and a second portion providing for sealed ingress of the first and second electrical conductors through a housing wall for providing power to the LED; and
a compression element extending between a portion of the housing and ceramic heat sink to provide a predetermined range of biasing force locating the ceramic heat sink against the portion of the housing with dimensional changes in the ceramic heat sink caused by thermal expansion of the ceramic heat sink.
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Abstract
An assembly for high-powered LEDs provides a direct attachment of the LED to a ceramic thermal conductor/electrical insulator sealed in a housing with a compression element between a portion of the housing and ceramic heat sink to provide a predetermined range of biasing force locating the ceramic heat sink against the portion of the housing with dimensional changes in the ceramic heat sink caused by thermal expansion of the ceramic heat sink.
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Citations
18 Claims
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1. An LED assembly comprising:
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an LED dissipating during operation at least 500 mW; a ceramic heat sink providing a first surface supporting the LED and in thermal communication with the LED; a first and second conductor in electrical communication with the LED; a sealed housing receiving the ceramic heat sink and LED therein, the sealed housing having a first portion fitting over the LED to permit the passage of light therethrough and a second portion providing for sealed ingress of the first and second electrical conductors through a housing wall for providing power to the LED; and a compression element extending between a portion of the housing and ceramic heat sink to provide a predetermined range of biasing force locating the ceramic heat sink against the portion of the housing with dimensional changes in the ceramic heat sink caused by thermal expansion of the ceramic heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of fabricating an LED assembly including:
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an LED dissipating during operation at least 500 mW; a ceramic heat sink providing a first surface supporting the LED in thermal communication with the LED; a first and second conductor in electrical communication with the LED; a sealed housing receiving the ceramic heat sink and LED therein, the sealed housing having a first portion fitting over the LED to permit the passage of light therethrough and a second portion providing for sealed ingress of the first and second electrical conductors through a housing wall for providing power to the LED; and a compression element extending between a portion of the housing and ceramic heat sink to provide a predetermined range of biasing force pressing the ceramic heat sink against the portion of the housing with dimensional changes in the ceramic heat sink caused by thermal expansion of the ceramic heat sink; the method comprising the steps of; (a) attaching the LED to the first surface of the ceramic heat sink; (b) fitting the assembled LED and ceramic heat sink into one the first portion of the housing and retaining the ceramic heat sink in the first portion with the spring clamp; (c) overmolding the first portion and the conductors with a thermoplastic material providing the second portion of the housing providing a sealed volume holding the ceramic substrate and LED. - View Dependent Claims (16, 17, 18)
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Specification