REMOTE MONITORING SYSTEM FOR POLISHING END POINT DETECTION UNITS

• US 20130268106A1
• Filed: 02/26/2013
• Published: 10/10/2013
• Est. Priority Date: 02/29/2012
• Status: Abandoned Application

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: MITANI, Ryuichiro
• Application Number:
  US13/777,035
• Publication Number:
  US 20130268106A1
• Time in Patent Office: Days
• US Class Current: 700/121
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: G05B 19/406 characterised by monitoring or safety G05B19/19 takes precedence
• CPC Class Codes: G05B 19/4183 characterised by data acquisition, e.g. workpiece identification
• CPC Class Codes: G05B 2219/31457 Factory remote control, monitoring through internet
• CPC Class Codes: G05B 2219/49085 CMP end point analysis, measure parameters on points to detect end of polishing process

Abstract

The present invention relates to a remote monitoring system for polishing end point detection units mounted to polishing apparatuses for polishing wafers, such as substrates. The remote monitoring system includes: polishing end point detection units each configured to detect a polishing end point of a substrate; and a host computer coupled to the polishing end point detection units via a network. The host computer includes a memory configured to store polishing end point detection data sent from the polishing end point detection units and a display screen configured to display the polishing end point detection data. The host computer is configured to send a new polishing end point detection recipe to at least one polishing end point detection unit selected from the polishing end point detection units to rewrite a polishing end point detection recipe of the least one polishing end point detection unit.

Claims

1. A remote monitoring system, comprising:

a plurality of polishing end point detection units each configured to detect a polishing end point of a substrate; and

a host computer coupled to the polishing end point detection units via a network, the host computer including a memory configured to store polishing end point detection data sent from the polishing end point detection units and a display screen configured to display the polishing end point detection data,

wherein the host computer is configured to send a new polishing end point detection recipe to at least one polishing end point detection unit selected from the polishing end point detection units to rewrite a polishing end point detection recipe of the least one polishing end point detection unit.

2. The remote monitoring system according to claim 1, wherein the host computer is configured to display on the display screen an alarm in a manner to identify a polishing end point detection unit in which a polishing end point detection error has occurred.

3. The remote monitoring system according to claim 1, wherein the host computer includes a polishing end point detection recipe management tool configured to create and change the new polishing end point detection recipe.

4. The remote monitoring system according to claim 3, wherein each of the polishing end point detection units includes a polishing end point detection recipe management tool configured to create and change the polishing end point detection recipe.

5. The remote monitoring system according to claim 1, wherein the polishing end point detection data includes a polishing index value indicating a film thickness of the substrate, and

wherein the host computer is configured to perform simulation of a polishing end point detection of a substrate with use of a preset replay recipe and the polishing index value.

6. The remote monitoring system according to claim 1, wherein each of the polishing end point detection units is configured to send a new polishing end point detection recipe to at least one polishing end point detection unit selected from the polishing end point detection units to rewrite a polishing end point detection recipe of the least one polishing end point detection unit.

7. The remote monitoring system according to claim 1, wherein each of the polishing end point detection units has a display screen configured to display an end point detection window showing the polishing end point detection data.

8. The remote monitoring system according to claim 7, wherein the host computer is configured to display an end point detection window which is the same as the end point detection window displayed on each polishing end point detection unit.

9. The remote monitoring system according to claim 8, wherein the host computer is configured to be able to change a structure of the end point detection window on the display screen of the host computer.

10. The remote monitoring system according to claim 7, wherein each of the polishing end point detection units is configured to be able to display on its own display screen an end point detection window which is the same as the end point detection window displayed on other polishing end point detection unit.

11. The remote monitoring system according to claim 10, wherein each of the polishing end point detection units is configured to be able to change a structure of the end point detection window of the other polishing end point detection unit displayed on its own display screen.

12. The remote monitoring system according to claim 1, wherein the host computer is capable of remotely controlling the polishing end point detection units.

13. The remote monitoring system according to claim 1, wherein each of the polishing end point detection units is capable of remotely controlling other polishing end point detection unit.