PERIPHERAL CIRCUIT OF TOUCH PANEL AND MANUFACTURING METHOD THEREOF
First Claim
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1. A method for manufacturing a peripheral circuit of a touch panel comprising:
- printing a radiation curable conductive material on a substrate having a transparent conductive pattern;
irradiating the radiation curable conductive material with a radiated ray, in order to cure parts of the radiation curable conductive material; and
removing uncured parts of the radiation curable conductive material, in order to form the peripheral circuit.
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Abstract
A method for manufacturing a peripheral circuit of a touch panel includes: printing a radiation curable conductive material on a substrate having a transparent conductive pattern; irradiating the radiation curable conductive material with a radiated ray, in order to cure parts of the radiation curable conductive material; and removing uncured parts of the radiation curable conductive material, in order to form the peripheral circuit.
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Citations
20 Claims
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1. A method for manufacturing a peripheral circuit of a touch panel comprising:
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printing a radiation curable conductive material on a substrate having a transparent conductive pattern; irradiating the radiation curable conductive material with a radiated ray, in order to cure parts of the radiation curable conductive material; and removing uncured parts of the radiation curable conductive material, in order to form the peripheral circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A touch panel, comprising:
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a substrate, having a transparent conductive pattern; and a peripheral circuit, connected with the transparent conductive pattern; wherein a material of the peripheral circuit comprises a radiation curable conductive material. - View Dependent Claims (10, 11, 12)
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13. A method for manufacturing a peripheral circuit of a touch panel comprising:
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printing a photosensitive conductive material on a substrate by screen printing; disposing a photomask on the photosensitive conductive material; irradiating the photosensitive conductive material with a beam, in order to cure parts of the photosensitive conductive material; and etching uncured parts of the photosensitive conductive material, in order to form the peripheral circuit. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification