PERIPHERAL CIRCUIT OF TOUCH PANEL AND MANUFACTURING METHOD THEREOF

• US 20130269988A1
• Filed: 04/08/2013
• Published: 10/17/2013
• Est. Priority Date: 04/13/2012
• Status: Active Grant

• Current Assignee: Wistron Corporation
• Original Assignee: Wistron Corporation
• Inventors: Wang, Kuei-Ching, Lin, Ta-Hu
• Granted Patent: US 9,253,892 B2
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: H05K 1/0296 Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2203/0514 Photodevelopable thick film, e.g. conductive or insulating paste
• CPC Class Codes: H05K 2203/1131 Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/02 in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/1283 After-treatment of the printed patterns, e.g. sintering or curing methods

Abstract

A method for manufacturing a peripheral circuit of a touch panel includes: printing a radiation curable conductive material on a substrate having a transparent conductive pattern; irradiating the radiation curable conductive material with a radiated ray, in order to cure parts of the radiation curable conductive material; and removing uncured parts of the radiation curable conductive material, in order to form the peripheral circuit.

Claims

1. A method for manufacturing a peripheral circuit of a touch panel comprising:

printing a radiation curable conductive material on a substrate having a transparent conductive pattern;

irradiating the radiation curable conductive material with a radiated ray, in order to cure parts of the radiation curable conductive material; and

removing uncured parts of the radiation curable conductive material, in order to form the peripheral circuit.

2. The method of claim 1, wherein a wavelength of the radiated ray is approximately within a range from 230 nanometers to 600 nanometers.

3. The method of claim 1, wherein the transparent conductive pattern is connected with the peripheral circuit.

4. The method of claim 1, wherein a wire width of the peripheral circuit is less than or equal to about 70 micrometers.

5. The method of claim 1, wherein the radiation curable conductive material comprises radiation curable silver glue, radiation curable silver paste or radiation curable ink.

6. The method of claim 1, wherein the step of curing parts of the radiation curable conductive material comprises selectively curing the radiation curable conductive material by disposing a photomask on the radiation curable conductive material.

7. The method of claim 1, wherein the radiated ray irradiates the radiation curable conductive material with at least two different wavelength ranges.

8. The method of claim 1, wherein the radiation curable conductive material is printed on the substrate by screen printing.

9. A touch panel, comprising:

a substrate, having a transparent conductive pattern; and

a peripheral circuit, connected with the transparent conductive pattern;

wherein a material of the peripheral circuit comprises a radiation curable conductive material.

10. The touch panel of claim 9, wherein a wire width of the peripheral circuit is less than or equal to about 70 micrometers.

11. The touch panel of claim 9, wherein the radiation curable conductive material comprises radiation curable silver glue, radiation curable silver paste or radiation curable ink.

12. The touch panel of claim 9, wherein the substrate is a transparent plastic substrate, a transparent glass substrate or a PET thin film substrate.

13. A method for manufacturing a peripheral circuit of a touch panel comprising:

printing a photosensitive conductive material on a substrate by screen printing;

disposing a photomask on the photosensitive conductive material;

irradiating the photosensitive conductive material with a beam, in order to cure parts of the photosensitive conductive material; and

etching uncured parts of the photosensitive conductive material, in order to form the peripheral circuit.

14. The method of claim 13, wherein the photosensitive conductive material comprises a plurality of silver particles.

15. The method of claim 14, wherein a diameter of the plurality of silver particles is within a range from 1 micrometer to 10 micrometers.

16. The method of claim 13, wherein a wire width of the peripheral circuit is less than 100 micrometers.

17. The method of claim 13, further comprising:

adhering the peripheral circuit to a flexible printed circuit board (FPC) by using a conductive adhesive, and the conductive adhesive is an anisotropic conductive film (ACF) or anisotropic conductive past (ACP).

18. The method of claim 13, further comprising:

disposing a protective film on the peripheral circuit.

19. The method of claim 18, wherein the step of disposing the protective film on the peripheral circuit comprises disposing the protective film utilizing a pasting method or a printing method.

20. The method of claim 13, wherein the beam comprises a visible light with a wavelength within a range from 350 micrometers to 780 micrometers.