Compact Camera Module

• US 20130270419A1
• Filed: 04/12/2012
• Published: 10/17/2013
• Est. Priority Date: 04/12/2012
• Status: Active Grant

• Current Assignee: Nan Chang O-Film Optoelectronics Technology, Ltd.
• Original Assignee: DigitalOptics Corporation (Adeia, Inc.)
• Inventors: Singh, Harpuneet, Humpston, Giles, Chau, Ellis, Ward, Ocie, Azuma, Eddie, Pietrangelo, Peter
• Granted Patent: US 9,029,759 B2
• Time in Patent Office: Days
• US Class Current: 250/208.1
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Claims

1. A solid state camera module, comprising:

an over-moulded circuit board containing an aperture;

an image sensor coupled in flip-chip orientation to the circuit board and including an optically

active area that is aligned to the aperture;

a lens barrel coupled to the circuit board and physically aligned to the image sensor; and

electrical interconnections between the circuit board and the image sensor.

2. The solid state camera module of claim 1, wherein the lens barrel is configured with physical tilt alignment to the image sensor by touching the lens barrel to the image sensor through the aperture.

3. The solid state camera module of claim 1, wherein the electrical interconnections comprise one or more μ

PILR interconnects.

4. The solid state camera module of claim 3, wherein at least one μ

PILR interconnect has a height that exceeds a thickness of the image sensor.

5. The solid state camera module of claim 3, wherein at least one μ

PILR interconnect comprises copper.

6. A solid state camera module, comprising:

a printed circuit containing an aperture;

an image sensor coupled in flip-chip orientation to the circuit board and including an optically active area that is aligned to the aperture;

a lens barrel coupled to the circuit board, the lens barrel being physically aligned to the image sensor through the aperture; and

electrical interconnections between the circuit board and the image sensor.

7. The solid state camera module of claim 6, wherein the lens barrel is configured with physical alignment to the image sensor by touching the lens barrel to the image sensor through the aperture.

8. The solid state camera module of claim 6, wherein the lens barrel is configured with physical tilt alignment by said touching.

9. The solid state camera module of claim 6, wherein the electrical interconnections comprise one or more μ

PILR interconnects.

10. The solid state camera of claim 9, wherein at least one μ

PILR interconnect has a height that exceeds a thickness of the image sensor.

11. The solid state camera of claim 9, wherein at least one μ

PILR interconnect comprises copper.

12. The solid state camera of claim 6, wherein the printed circuit comprises a flexible printed circuit (FPC).

13. The solid state camera of claim 6, wherein the printed circuit comprises a rigid-flexible printed circuit (RFPC).

14. A miniature camera module, comprising:

a substrate;

an image sensor coupled to the substrate;

an optical train including one or more lenses coupled to the substrate and aligned with the image sensor to define an optical path of the camera module;

an aperture defined along the optical path between at least one lens of the optical train and the image sensor; and

a printed circuit coupled to the image sensor such that a thickness of a printed circuit does not contribute to a physical Z height in addition to a thickness of the substrate.

15. The miniature camera module of claim 14, wherein the printed circuit defines said aperture or a different aperture and is electronically coupled to an active image sensor surface of the image sensor such that the aperture of the printed circuit overlaps an active sensor area along an optical path of the miniature camera.

16. The miniature camera module of claim 14, wherein the printed circuit is electrically coupled to an active image sensor surface of the image sensor at one or both ends such that the printed circuit does not occlude the optical path of the camera module.

17. The miniature camera module of claim 14, further comprising a protective cover over the image sensor that does not contribute to a physical Z height in addition to a thickness of the substrate.

18. The miniature camera module of claim 17, wherein the protective cover comprises an IR filter.

19. The miniature camera module of claim 17, wherein the image sensor also does not contribute to a physical Z height in addition to a thickness of the substrate.

20. The miniature camera module of claim 17, wherein the protective cover further comprises a closest lens of the optical train to the image sensor.

21. The miniature camera module of claim 14, wherein the printed circuit comprises a flexible printed circuit (FPC).

22. The miniature camera module of claim 14, wherein the printed circuit comprises a rigid-flexible printed circuit (RFPC).

23. A miniature camera module, comprising:

a substrate;

an image sensor coupled to the substrate;

an optical train including one or more lenses coupled to the substrate and aligned with the image sensor to define an optical path of the camera module;

an aperture defined along the optical path between at least one lens of the optical train and the image sensor; and

a printed circuit coupled to the image sensor;

wherein at least one lens, of the optical train, that is closest to the image sensor is formed from a protective cover that is disposed over the image sensor, such that a physical Z height is reduced compared with a camera having separate optical elements for protective cover and closest lens to the image sensor.

24. The miniature camera module of claim 23, wherein the at least one lens formed from the protective cover comprises an infrared (IR) filter.

25. The miniature camera module of claim 23, wherein the image sensor and protective cover are coupled together at wafer stage prior to dicing.

26. The miniature camera module of claim 23, wherein the miniature camera module is configured such that the printed circuit also does not contribute to physical Z height in addition to a thickness of the substrate.

27. The miniature camera module of claim 23, wherein the miniature camera module is configured such that the image sensor also does not contribute to a physical Z height in addition to a thickness of the substrate.

28. The miniature camera module of claim 27, wherein the miniature camera module is configured such that the printed circuit also does not contribute to physical Z height in addition to a thickness of the substrate.

29. The miniature camera module of claim 23, wherein the printed circuit comprises a fold-over flexible printed circuit.

35. The miniature camera module of claim 23, wherein the printed circuit comprises a fold-over flexible printed circuit.

30. A miniature camera module, comprising:

a substrate defining a cavity;

an image sensor coupled to the substrate;

an optical train including one or more lenses coupled to the substrate and aligned with the image sensor to define an optical path of the camera module;

an aperture defined along the optical path between at least one lens of the optical train and the image sensor;

a printed circuit coupled to the image sensor; and

a protective cover over an active sensor area of the image sensor and disposed within said cavity of said substrate such that at least a significant portion of a thickness of the protective cover does not contribute to a physical Z height in addition to a thickness of the substrate.

31. The miniature camera module of claim 30, wherein an entire thickness of the protective cover is disposed within said cavity and does not contribute to the physical Z height in addition to the thickness of the substrate.

32. The miniature camera module of claim 31, wherein the protective cover comprises a closest optic to the image sensor of the optical train.

33. The miniature camera module of claim 30, wherein the protective cover comprises an IR filter.

34. The miniature camera module of claim 30, wherein the miniature camera module is configured such that the printed circuit also does not contribute to the physical Z height of the camera module in addition to the thickness of the substrate.

36. A miniature camera module, comprising:

a substrate defining a cavity;

an image sensor coupled to the substrate and disposed within said cavity such that at least a significant portion of a thickness of the image sensor does not contribute to a physical Z height in addition to a thickness of the substrate;

an optical train including one or more lenses coupled to the substrate and aligned with the image sensor to define an optical path of the camera module;

an aperture defined along the optical path between at least one lens of the optical train and the image sensor;

a printed circuit coupled to the image sensor; and

a protective cover over an active sensor area of the image sensor.

37. The miniature camera module of claim 36, wherein an entire thickness of the image sensor is disposed within said cavity and does not contribute to the physical Z height in addition to the thickness of the substrate.

38. The miniature camera module of claim 37, wherein at least a significant portion of the protective cover is also disposed within said cavity and does not contribute to the physical Z height in addition to the thickness of the substrate.

39. The miniature camera module of claim 37, wherein an entire thickness of the protective cover is also disposed within said cavity and does not contribute to the physical Z height in addition to the thickness of the substrate.

40. The miniature camera module of claim 36, wherein the miniature camera module is configured such that a thickness of the printed circuit does not contribute to physical Z height in addition to the thickness of the substrate.

41. The miniature camera module of claim 36, wherein the protective cover comprises an infrared (IR) filter.

42. A miniature camera module, comprising:

a substrate;

an image sensor coupled to the substrate;

an optical train including one or more lenses coupled to the substrate and aligned with the image sensor to define an optical path of the camera module;

an aperture defined along the optical path between at least one lens of the optical train and the image sensor;

a printed circuit coupled to the image sensor for carrying electronic signals corresponding to image data from the image sensor; and

a protective cover over an active sensor area of the image sensor, and

wherein the miniature camera module is configured such that neither a thickness of (i) the image sensor, (ii) the protective cover, (iii) the printed circuit, nor (iv) a lens of the optical train that is closest to the image sensor contributes to a physical Z height in addition to a thickness of the substrate.

43. The miniature camera module of claim 42, wherein the lens that is closest to the image sensor is formed from the protective cover at wafer stage before dicing.

44. A miniature camera module, comprising:

a substrate;

an image sensor coupled to the substrate;

an optical train including one or more lenses coupled to the substrate and aligned with the image sensor to define an optical path of the camera module;

an aperture defined along the optical path between at least one lens of the optical train and the image sensor;

a printed circuit coupled to the image sensor for carrying electronic signals corresponding to image data; and

a protective cover over an active sensor area of the image sensor, and

wherein the miniature camera module is configured such that a thickness of (i) the image sensor, (ii) the protective cover, (iii) the printed circuit, or (iv) a lens of the optical train that is closest to the image sensor, or combinations thereof, does not contribute to a physical Z height in addition to a thickness of the substrate.

45. The miniature camera module of claim 44, wherein the lens that is closest to the image sensor is formed from the protective cover.

46. The miniature camera module of claim 45, wherein said closest lens is formed from the protective cover at wafer stage before dicing.

47. A miniature camera module, comprising:

a substrate defining a cavity including an aperture;

an image sensor coupled to the substrate at least partially within the cavity and including an active sensor area overlapping the aperture;

a transparent protective cover coupled to the image sensor over the active sensor area;

an optical housing coupled to the substrate containing therein a train of one or more imaging optics overlapping the aperture and forming an optical path from a first optic of the train through the aperture and transparent protective cover to the active sensor area; and

a flexible printed circuit coupled to the image sensor to carry electrical signals corresponding to image data from the image sensor.

48. The miniature camera module of claim 47, wherein the cover comprises a closest optic to the image sensor of the train of one or more imaging optics.

49. The miniature camera module of claim 47, wherein the printed circuit comprises a fold-over flexible printed circuit.

50. A method of forming a miniature camera module component, comprising:

forming multiple replicated lens shapes on a protective cover wafer;

providing material onto the protective cover wafer to form multiple cavities with respective multiple replicated lens shapes therein;

coupling a carrier wafer to the protective cover wafer on the side with the deposited material;

dicing the protective cover wafer;

coupling an intermediate wafer to the protective cover wafer on the side opposite the deposited material;

removing the carrier wafer;

coupling an image sensor wafer to the protective cover wafer on the side with the deposited material; and

removing the intermediate wafer.

51. The method of claim 50, further comprising dicing the image sensor wafer to form multiple singulated sensors with replicated lens shape protective covers.

52. The method of claim 51, further comprising coupling a singulated sensor to a printed circuit or a rigid substrate or both.

53. The method of claim 50, wherein the depositing material to form the multiple cavities comprises masking active image areas of the multiple replicated lens shapes.

54. The method of claim 50, wherein the depositing material to form the multiple cavities comprises depositing epoxy onto the protective cover wafer other than over the active image areas protected by the masking.

55. The method of claim 50, wherein the dicing comprises wafer cleaning.

56. The method of claim 55, wherein the wafer cleaning comprises removing protective cover material along dicing lines.

57. The method of claim 50, wherein the protective cover wafer comprises an IR filter.

58. The method of claim 57, wherein the IR filter comprises one or both of blue glass material or an IR coating.

59. The method of claim 50, wherein the providing material onto the protective cover wafer comprises depositing the material thereon.