LOW RESISTANCE BIDIRECTIONAL JUNCTIONS IN WIDE BANDGAP SEMICONDUCTOR MATERIALS

• US 20130270514A1
• Filed: 04/16/2012
• Published: 10/17/2013
• Est. Priority Date: 04/16/2012
• Status: Abandoned Application

• Current Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Saxler, Adam William
• Application Number:
  US13/447,915
• Publication Number:
  US 20130270514A1
• Time in Patent Office: Days
• US Class Current: 257/13
• CPC Class Codes: H01L 25/0756 Stacked arrangements of devices
• CPC Class Codes: H01L 29/2003 Nitride compounds
• CPC Class Codes: H01L 29/861 Diodes
• CPC Class Codes: H01L 29/868 PIN diodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/42 Transparent materials

Abstract

A light emitting diode device includes a first diode structure, a second diode structure on the first diode structure, and a conductive junction between the first diode structure and the second diode structure. The conductive junction includes a transparent conductive layer between the first diode structure and the second diode structure. Low resistance heterojunction tunnel junction structures including delta-doped layers are also disclosed.

Claims

1. A light emitting diode device, comprising:

a first diode structure;

a second diode structure on the first diode structure; and

a conductive junction between the first diode structure and the second diode structure;

wherein the conductive junction comprises a transparent conductive layer between the first diode structure and the second diode structure.

2. The light emitting diode device of claim 1, wherein the transparent conductive layer comprises a transparent conductive oxide.

3. The light emitting diode device of claim 2, wherein the transparent conductive oxide comprises indium tin oxide and/or zinc oxide.

4. The light emitting diode device of claim 1, wherein the first diode structure comprises a p-type semiconductor layer, the second diode structure comprises an n-type semiconductor layer, and the transparent conductive layer is interposed between and contacts the p-type semiconductor layer and the n-type semiconductor layer.

5. The light emitting diode device of claim 4, wherein the transparent conductive layer forms an ohmic contact to the p-type semiconductor layer and the n-type semiconductor layer.

6. The light emitting diode device of claim 4, wherein the transparent conductive layer comprises a layered structure including a first transparent conductive layer and a second transparent conductive layer on the first transparent conductive layer, wherein the second transparent conductive layer comprises a different material than the first transparent conductive layer.

7. The light emitting diode device of claim 6, wherein the first transparent conductive layer comprises a metal layer and the second transparent conductive layer comprises a transparent conductive oxide.

8. The light emitting diode device of claim 7, wherein the first transparent conductive layer comprises a first transparent conductive oxide and the second transparent conductive layer comprises a second transparent conductive oxide.

9. The light emitting diode device of claim 6, wherein the first transparent conductive layer forms an ohmic contact to the p-type semiconductor layer and the second transparent conductive layer forms an ohmic contact to the n-type semiconductor layer.

10. The light emitting diode device of claim 4, wherein the transparent conductive layer comprises a plurality of apertures, wherein the p-type semiconductor layer contacts the n-type semiconductor layer through the apertures.

11. The light emitting diode device of claim 10, wherein the transparent conductive layer comprises a first transparent conductive layer, the device further comprising a third diode structure on the second diode structure and a second transparent conductive layer between the second diode structure and the third diode structure.

12. The light emitting diode device of claim 11, wherein the plurality of apertures comprises a first plurality of apertures, the second transparent conductive layer comprises a second plurality of apertures, and the second diode structure contacts the third diode structure through the second plurality of apertures.

13. The light emitting diode device of claim 12, wherein the first plurality of apertures are horizontally offset from the second plurality of apertures.

14. The light emitting diode device of claim 13, wherein the material of the first diode structure and the second diode structure has a first index of refraction, and wherein a material of the first transparent conductive layer and the second transparent conductive layer has a second index of refraction that is different than the first index of refraction.

15. The light emitting diode device of claim 11, further comprising a fourth diode structure on the third diode structure and a third transparent conductive layer between the third diode structure and the fourth diode structure, wherein a distance between the first transparent conductive layer and the second transparent conductive layer is different than a distance between the second transparent conductive layer and the third transparent conductive layer.

16. The light emitting device of claim 11, wherein the first plurality of apertures and the second plurality of apertures are configured to cause the first transparent conductive layer and the second transparent conductive layer to scatter light passing within the light emitting diode device.

17. The light emitting diode device of claim 11, wherein thicknesses of the first second and third diode structures and the first and second transparent conductive layers are selected to cause an effective index of refraction of the light emitting diode device to be less than index of refraction of the material of the first second and third lightning diode structures.

18. The light emitting diode device of claim 11, wherein thicknesses of the first second and third diode structures and the first and second transparent conductive layers are selected to reduce the reflectivity of the structure at a predetermined wavelength of light.

19. The light emitting diode device of claim 1, further comprising a trench through the second light emitting diode structure.

20. The light emitting diode device of claim 19, wherein the trench extends to the first light emitting diode structure.

21. The light emitting diode device of claim 1, further comprising a void between the first light emitting diode structure and the second light emitting diode structure adjacent the transparent conductive layer.

22. A light emitting diode device, comprising:

a diode structure including an n-type layer, an active layer on the n-type layer, and a p-type layer on the active layer; and

a conductive junction on p-type layer opposite the active layer;

wherein the conductive junction comprises a transparent conductive layer.

23. A low resistance tunnel junction structure, comprising:

first and second semiconductor layers, wherein the first layer is non-degenerately doped with n-type dopants, and wherein the second layer is non-degenerately doped with p-type dopants; and

a third semiconductor layer between the first and second semiconductor layers and forming first and second heterojunctions with the first and second layers respectively, the third semiconductor layer having a narrower bandgap than the first and second layers;

wherein the first, second and third layers have an associated natural polarization dipole that causes a tunneling distance between the first and second semiconductor layers to be smaller than it would be in the absence of the third layer; and

a delta-doped region in the first semiconductor layer adjacent the first heterojunction, wherein the first delta-doped region is doped with n-type dopants at a doping concentration greater than 5E18 cm<sup>−

3</sup>.

24. The low resistance tunnel junction structure of claim 23, wherein the delta-doped region comprises a first delta-doped region, the structure further comprising:

a second delta-doped region in the second semiconductor layer adjacent the second heterojunction, wherein the second delta-doped region is doped with p-type dopants at a doping concentration greater than 5E18 cm<sup>−

3</sup>.

25. The junction structure of claim 23, wherein the third layer is about 0.5 to 10 nanometers thick.

26. The junction structure of claim 23, wherein the structure comprises a periodic table group III-nitride material system.

27. The junction structure of claim 23, wherein the third layer comprises indium gallium nitride (InxGayN), where x+y=1 and x>

0 or aluminum gallium nitride (AlxGayN), where x+y=1 and x>

0.

28. The junction structure of claim 23, wherein the third layer forms abrupt transitions with the first and second layers.

29. The junction structure of claim 23, wherein the third layer forms graded transitions with the first and second layers.

30. The junction structure of claim 23, wherein the third layer comprises an impurity that forms both deep level and shallow level bandgap states within the third layer that further reduces the tunneling distance between the first and second semiconductor layers.

31. The junction structure of claim 23, wherein the third layer comprises a first sub-layer doped with a double p-type dopant that forms both deep level and shallow level acceptor states and a second sub-layer doped with a double n-type dopant that forms both deep level and shallow level donor states.

32. The junction structure of claim 23, wherein the first and second sub-layers are about 0.3 to 5 nanometers thick.