Light Emitting Diode Package and Method of Manufacturing the Same

• US 20130270586A1
• Filed: 06/10/2013
• Published: 10/17/2013
• Est. Priority Date: 02/23/2006
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: SON, Won-Jin
• Granted Patent: US 9,029,903 B2
• Time in Patent Office: Days
• US Class Current: 257/89
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are P electrodes and the second electrodes are N electrodes.

Claims

1. A light emitting diode package comprising:

a package body with a cavity;

a plurality of light emitting diode (LED) chips in the cavity;

a plurality of wires connected to the plurality of LED chips; and

a plurality of lead frames in the package body,

wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip,

wherein ends of the lead frames are exposed outside of the package body and penetrate the package body, and

wherein the first electrodes of the LED chips are P electrodes and the second electrodes of the LED chips are N electrodes.

2. The light emitting diode package according to claim 1, wherein the LED chips are LED chips of three colors (red, green, and blue) or blue LED chips.

3. The light emitting diode package according to claim 1, further comprising a mold member formed in the cavity and including a phosphor.

4. The light emitting diode package according to claim 3, wherein the mold member is formed of silicon or epoxy resin and has one of a flat shape, a concave lens shape, or a convex lens shape.

5. The light emitting diode package according to claim 1, wherein a number of the plurality of lead frames is smaller than a number of electrodes of the LED chips.

6. The light emitting diode package according to claim 1, wherein the plurality of lead frames are disposed in a line such that they are spaced from each other on a bottom of the cavity of the package body.

7. The light emitting diode package according to claim 1, wherein the package body is formed of at least one material selected from the group consisting of PC (polycarbonate), PCABS (polycarbonate acrylonitrile butadiene styrene), PPA (polyphthalamide), nylon, PET (polyethylene terephtalate), or PBT (polybutylene terephtalate).

8. The light emitting diode package according to claim 1, wherein each side surface of the cavity is formed so as to lean outward at a 105-120 degree angle.

9. The light emitting diode package according to claim 1, further comprising a fifth lead frame electrically connected to a first electrode of the third LED chip.

10. The light emitting diode package according to claim 1, wherein at least one of the plurality of LED chip is a vertical LED chips with the first and second electrodes disposed in a vertical structure.

11. A light emitting diode package comprising:

a package body with a cavity;

a plurality of LED chips mounted in the cavity;

a plurality of wires connected to an electrode of at least one of the plurality of LED chips; and

a plurality of lead frames formed on a bottom of the cavity of the package body,

wherein the plurality of lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and a fourth lead frame electrically connected to a second electrode of a third LED chip,

wherein at least one of the plurality of LED chips is bonded to the at least one of the plurality of lead frames using a conductive adhesive.

12. The light emitting diode package according to claim 11, further comprising a mold member formed in the cavity and including a phosphor.

13. The light emitting diode package according to claim 12, wherein the mold member is formed of silicon or epoxy resin and has one of a flat shape, a concave lens shape, and a convex lens shape.

14. The light emitting diode package according to claim 11, wherein at least two of the plurality of LED chips are a horizontal LED chip with the first and second electrodes disposed in a horizontal structure, and at least one of the plurality of LED chips is a vertical LED chip with the first and second electrodes disposed in a vertical structure.

15. The light emitting diode package according to claim 11, wherein the plurality of the LED chips are spaced from each other by a predetermined distance and disposed in a line in the cavity.

16. The light emitting diode package according to claim 11, wherein the first electrodes of the LED chips are N electrodes and the second electrodes of the LED chips are P electrodes.

17. The light emitting diode package according to claim 11, wherein the first electrodes of the LED chips are P electrodes and the second electrodes of the LED chips are N electrodes.

18. The light emitting diode package according to claim 11, wherein the plurality of LED chips are LED chips of three colors (red, green, and blue) or blue LED chips.

19. The light emitting diode package according to claim 11, further comprising a fifth lead frame electrically connected to a first electrode of the third LED chip.