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Light Emitting Diode Package and Method of Manufacturing the Same

  • US 20130270586A1
  • Filed: 06/10/2013
  • Published: 10/17/2013
  • Est. Priority Date: 02/23/2006
  • Status: Active Grant
First Claim
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1. A light emitting diode package comprising:

  • a package body with a cavity;

    a plurality of light emitting diode (LED) chips in the cavity;

    a plurality of wires connected to the plurality of LED chips; and

    a plurality of lead frames in the package body,wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip,wherein ends of the lead frames are exposed outside of the package body and penetrate the package body, andwherein the first electrodes of the LED chips are P electrodes and the second electrodes of the LED chips are N electrodes.

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