SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS
First Claim
Patent Images
1. An apparatus, comprising:
- an integrated circuit including at least one electrical interconnect disposed on an elongate arm extending away from a main portion of the integrated circuit; and
a microelectromechanical layer including an oscillating portion, the micro electromechanical layer coupled to the main portion of the integrated circuit,wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.
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Abstract
One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.
79 Citations
15 Claims
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1. An apparatus, comprising:
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an integrated circuit including at least one electrical interconnect disposed on an elongate arm extending away from a main portion of the integrated circuit; and a microelectromechanical layer including an oscillating portion, the micro electromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method, comprising:
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forming a through-silicon-via in an integrated circuit; forming the integrated circuit to define a plurality of elongate arms that extend away from a main portion of the integrated circuit to which the microelectromechanical layer is coupled; stacking the integrated circuit onto a substrate; electrically and physically coupling the integrated circuit to the substrate using a plurality of electrical interconnects; stacking a microelectromechanical layer onto the integrated circuit and electrically and physically coupling the microelectromechanical layer to the integrated circuit such that the microelectromechanical layer is electrically coupled to the substrate via the through-silicon-via, wherein electrically and physically coupling the integrated circuit to the substrate using a plurality of electrical interconnects includes electrically and physically coupling the integrated circuit to the substrate using the plurality of elongate arms; and disposing a seal between the microelectromechanical layer and the integrated circuit to define a hermetically sealed void between the microelectromechanical layer and the integrated circuit. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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Specification