DUAL-SUBSTRATE CAPACITIVE TOUCH PANEL

• US 20130271205A1
• Filed: 06/17/2013
• Published: 10/17/2013
• Est. Priority Date: 05/11/2010
• Status: Active Grant

• Current Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Original Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Inventors: MI, David
• Granted Patent: US 8,947,398 B2
• Time in Patent Office: Days
• US Class Current: 327/517
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H03K 17/962 Capacitive touch switches

Abstract

A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.

Claims

1. A capacitive touch panel, comprising:

a lower panel module comprising;

a first glass substrate having a first circuit surface;

a lower touch sensitive layer mounted on the first circuit surface of the first glass substrate;

a lower conductor layer mounted on an edge portion of the first glass substrate and electrically connecting the lower touch sensitive layer;

a lower insulation layer mounted on the lower conductor layer and having a lower indentation to partially expose the lower conductor layer; and

a lower conductive adhesive layer mounted in the lower indentation of the lower insulation layer to cover the exposed portion of the lower conductor layer;

an upper panel module comprising;

a second glass substrate having a second circuit surface;

an upper touch sensitive layer mounted on the second circuit surface of the second glass substrate;

an upper insulation ink layer mounted on an edge portion of the upper touch sensitive layer, and having a plurality of upper through slots formed through the upper insulation ink layer and each filled in with a upper conductive layer having a color identical to that of the upper insulation ink layer;

an upper conductor layer mounted on the upper insulation ink layer and electronically connecting the upper touch sensitive layer via the upper conductive layer;

an upper insulation layer mounted on the upper conductor layer and having an upper indentation to partially expose the upper conductor layer; and

an upper conductive adhesive layer mounted in the upper indentation of the upper insulation layer;

a flexible circuit board mounted on the lower conductive adhesive layer, extending outwardly beyond the first glass substrate, and electrically connected with the lower touch sensitive layer through the lower conductive adhesive layer; and

a transparent insulation adhesive layer interposed between the upper panel module and the lower panel module.

2. The capacitive touch panel as claimed in claim 1, further comprising an upper protection layer.

3. The capacitive touch panel as claimed in claim 2, wherein the flexible circuit board has a top surface and a bottom surface, wherein the bottom surface is attached on the lower conductive adhesive layer and the upper protection layer is bonded to the top surface of the flexible circuit board and a side of the second glass substrate.

4. The capacitive touch panel as claimed in claim 1, further comprising a lower protection layer.

5. The capacitive touch panel as claimed in claim 4, wherein the flexible circuit board has a bottom surface, wherein the bottom surface is attached on the lower conductive adhesive layer and the lower protection layer is bonded to the bottom surface of the flexible circuit board and a side of the first glass substrate.

6. The capacitive touch panel as claimed in claim 3, further comprising a lower protection layer bonded to the bottom surface of the flexible circuit board and a side of the first glass substrate.

7. The capacitive touch panel as claimed in claim 1, wherein the lower conductive adhesive layer is formed by at least one chosen from anisotropic conductive film (ACT) and anisotropic conductive paste (ACP).

8. A capacitive touch panel, comprising:

a lower panel module comprising;

a first glass substrate having a first circuit surface;

a lower touch sensitive layer mounted on the first circuit surface of the first glass substrate;

a lower conductor layer mounted on an edge portion of the first glass substrate and electrically connecting the lower touch sensitive layer;

a lower insulation layer mounted on the lower conductor layer and having a lower indentation to partially expose the lower conductor layer; and

a lower conductive adhesive layer mounted in the lower indentation of the lower insulation layer to cover the exposed portion of the lower conductor layer;

an upper panel module comprising;

a second glass substrate having a second circuit surface;

an upper touch sensitive layer mounted on the second circuit surface of the second glass substrate;

an upper insulation ink layer mounted on an edge portion of the upper touch sensitive layer, and having a plurality of upper through slots formed through the upper insulation ink layer and each filled in with a upper conductive layer having a color identical to that of the upper insulation ink layer;

an upper conductor layer mounted on the upper insulation ink layer and electronically connecting the upper touch sensitive layer via the upper conductive layer;

an upper insulation layer mounted on the upper conductor layer and having an upper indentation to partially expose the upper conductor layer; and

an upper conductive adhesive layer mounted in the upper indentation of the upper insulation layer to cover the exposed portion of the upper conductor layer;

a flexible circuit board mounted on the upper conductive adhesive layer and electrically connected with the upper touch sensitive layer through the upper conductive adhesive laver; and

a transparent insulation adhesive layer interposed between the upper panel module and the lower panel module.

9. The capacitive touch panel as claimed in claim 8, further comprising an upper protection layer.

10. The capacitive touch panel as claimed in claim 9, Wherein the flexible circuit board has a top surface, wherein the top surface is configured on the upper conductive adhesive layer and the upper protection layer is bonded to the top surface of the flexible circuit board and a side of the second glass substrate.

11. The capacitive touch panel as claimed in claim 8, further comprising a lower protection layer.

12. The capacitive touch panel as claimed in claim 11, wherein the flexible circuit board has a top surface and a bottom surface, wherein the top surface is configured on the upper conductive adhesive layer and the lower protection layer is bonded to the bottom surface of the flexible circuit board and a side of the first glass substrate.

13. The capacitive touch panel as claimed in claim 10, further comprising a lower protection layer, wherein

the flexible circuit hoard has a bottom surface, wherein the bottom surface is attached on the lower conductive adhesive layer;

and

the lower protection layer is bonded to the bottom surface of the flexible circuit board and a side of the first glass substrate.

14. The capacitive touch panel as claimed in claim 8, wherein the upper conductive adhesive layer is formed by at least one chosen from anisotropic conductive film (ACE) and anisotropic conductive paste (ACP).