OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES
First Claim
Patent Images
1. An interposer, comprising:
- a land side including land-side ball-grid array (BGA) including two adjacent, spaced-apart land-side pads, wherein the land-side BGA is configured to interface with a first-level interconnect; and
a package-on-package (POP) side including a POP-side BGA including two adjacent, spaced-apart POP-side pads, wherein the POP-side BGA is configured to interface with a POP interconnect, wherein each of the two land-side pads are coupled respectively to the two POP-side pads through the interposer, and wherein the two land-side pads each have a different footprint than the respective two POP-side pads.
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Accused Products
Abstract
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.
18 Citations
38 Claims
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1. An interposer, comprising:
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a land side including land-side ball-grid array (BGA) including two adjacent, spaced-apart land-side pads, wherein the land-side BGA is configured to interface with a first-level interconnect; and a package-on-package (POP) side including a POP-side BGA including two adjacent, spaced-apart POP-side pads, wherein the POP-side BGA is configured to interface with a POP interconnect, wherein each of the two land-side pads are coupled respectively to the two POP-side pads through the interposer, and wherein the two land-side pads each have a different footprint than the respective two POP-side pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An interposer, comprising:
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a land side including land-side hall-grid array (BGA) including two adjacent, spaced-apart land-side pads, wherein the land-side BGA is configured to interface with a first-level interconnect; a package-on-package (POP) side including a POP-side BGA including two adjacent, spaced-apart POP-side pads, wherein the POP-side BGA is configured to interface with a POP interconnect, wherein each of the two land-side pads are coupled respectively to the two POP-side pads through the interposer, and wherein the two land-side pads each have a different footprint than the respective two POP-side pads, wherein the two adjacent, spaced-apart land-side pads are configured at a first pitch, wherein the two adjacent, spaced-apart POP-side pads are configured at a second pitch, further including the die-side BGA is arranged with alternating two- and three-pad occurrences and the land-side BGA is arranged only with two-pad occurrences. - View Dependent Claims (15, 16, 17, 18)
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19. A package-on-package (POP) chip package comprising:
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an offset interposer including; a land side including land-side ball-grid array (BGA) including two adjacent, spaced-apart land-side pads, wherein the land-side BGA is configured to interface with a first-level interconnect; and a package-on-package (POP) side including a POP-side BGA including two adjacent, spaced-apart POP-side pads, wherein the POP-side BGA is configured to interface with a POP interconnect, wherein each of the two land-side pads are coupled respectively to the two POP-side pads through the interposer, and wherein the two land-side pads each have a different footprint than the respective two POP-side pads; a POP substrate coupled to POP interconnects on the POP-side BGA; and a microelectronic device disposed on the POP substrate, wherein the microelectronic device is electrically coupled to the offset interposer through the POP substrate. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28)
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20. The POP chip package 19, wherein a given land-side pad is coupled to corresponding POP-side pad by direct contact with a via.
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29. A process of building an offset interposer, comprising:
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forming a land side including land-side ball-grid array (BGA) including two adjacent, spaced-apart land-side pads, wherein the land-side BGA is configured to interface with a first-level interconnect; and forming a package-on-package (POP) side including a POP-side BGA including two adjacent, spaced-apart POP-side pads, wherein the POP-side BGA is configured to interface with a POP interconnect, wherein each of the two land-side pads are coupled respectively to the two POP-side pads through the interposer, and wherein the two land-side pads each have a different footprint than the respective two POP-side pads. - View Dependent Claims (30, 31, 32)
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33. A computer system comprising:
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an offset interposer including; a land side including land-side ball-grid array (BGA) including two adjacent, spaced-apart land-side pads, wherein the land-side BGA is configured to interface with a first-level interconnect; and a package-on-package (POP) side including a POP-side BGA including two adjacent, spaced-apart POP-side pads, wherein the POP-side BGA is configured to interface with a POP interconnect, wherein each of the two land-side pads are coupled respectively to the two POP-side pads through the interposer, and wherein the two land-side pads each have a different footprint than the respective two POP-side pads; a POP substrate coupled to POP interconnects on the POP-side BGA; a microelectronic device disposed on the POP substrate, wherein the microelectronic device is electrically coupled to the offset interposer through the POP substrate; a first-level interconnect coupled to the offset interposer at the land side; an electronic device disposed on the first-level interconnect; and a foundation substrate that supports the first-level interconnect. - View Dependent Claims (34, 35, 36, 37, 38)
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Specification