Micromechanical sensor element and sensor device having this type of sensor element

• US 20130276537A1
• Filed: 04/24/2013
• Published: 10/24/2013
• Est. Priority Date: 04/24/2012
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Ulbrich, Nicolaus, Emmerich, Harald, SCHAEFER, Frank
• Application Number:
  US13/869,346
• Publication Number:
  US 20130276537A1
• Time in Patent Office: Days
• US Class Current: 73/504.12
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01C 19/5776 Signal processing not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values

Abstract

A micromechanical sensor element for detecting lateral acceleration, having at least two boundaries situated essentially orthogonally with respect to one another, and also having at least one spring element, in which the spring element is oriented at an angle relative to at least one of the boundaries.

Claims

1. A micromechanical sensor element for detecting a lateral acceleration, comprising:

at least two boundaries situated essentially orthogonally with respect to one another; and

at least one spring element, wherein the spring element is oriented at an angle relative to at least one of the boundaries.

2. The micromechanical sensor element of claim 1, wherein the spring element has an orientation of approximately 45 degrees relative to the at least one of the boundaries.

3. The micromechanical sensor element of claim 1, wherein the at least two boundaries include four boundaries that essentially form a square.

4. A micromechanical sensor device, comprising:

at least two micromechanical sensor elements, each of the micromechanical sensor elements being for detecting a lateral acceleration, and including at least two boundaries situated essentially orthogonally with respect to one another, and including at least one spring element, wherein the spring element is oriented at an angle relative to at least one of the boundaries; and

a micromechanical Z acceleration sensor element.

5. The micromechanical sensor device of claim 4, wherein the two sensor elements for detecting lateral acceleration are situated skewed by approximately 90 degrees with respect to one another.

6. The micromechanical sensor device of claim 5, wherein the sensor device has at least two boundaries situated orthogonally with respect to one another, at least one of the boundaries being situated essentially parallel to at least one of the boundaries of at least one of the sensor elements for detecting lateral acceleration.

7. A sensor system, comprising:

a micromechanical sensor device, including;

at least two micromechanical sensor elements, each of the micromechanical sensor elements being for detecting a lateral acceleration, and including at least two boundaries situated essentially orthogonally with respect to one another, and including at least one spring element, wherein the spring element is oriented at an angle relative to at least one of the boundaries; and

a micromechanical Z acceleration sensor element;

a yaw rate sensor device; and

a shared evaluation device for evaluating data of the sensor device and of the yaw rate sensor device.

8. The sensor system of claim 7, wherein the data of the sensor device and of the yaw rate sensor device are transmitted via a digital serial data bus.

9. The sensor system of claim 8, wherein the data of the sensor device and of the yaw rate sensor device each have a bit increment of at least 14 bits.