SUBSTRATE STRUCTURE

• US 20130277093A1
• Filed: 08/13/2012
• Published: 10/24/2013
• Est. Priority Date: 04/24/2012
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Su, Po-Jen, Sun, Sheng-Yuan
• Granted Patent: US 8,895,862 B2
• Time in Patent Office: Days
• US Class Current: 174/252
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches.

Claims

1. A substrate structure, adapted to carry a plurality of heat generating elements, the substrate structure comprising:

a board, having an upper surface;

a patterned metal layer, disposed on the board, and comprising a first electrode, a second electrode, a plurality of first pads and a plurality of second pads, wherein the first electrode does not contact the second electrode, the first pads and the second pads are alternately disposed on the upper surface in parallel, parts of the first pads are electrically connected to the first electrode, and parts of the second pads are electrically connected to the second electrode, the other parts of the first pads and the other parts of second pads are electrically connected to each other, respectively, each of the first pads and the adjacent second pad define a device bonding area, the heat generating elements are respectively disposed in the device bonding areas, and there is a plurality of trenches between the adjacent two device bonding areas; and

a plurality of heat dissipating channels, disposed in the trenches.

2. The substrate structure as claimed in claim 1, wherein the first electrode and the second electrode are located on the upper surface of the board, and the first pads and the second pads are located between the first electrode and the second electrode.

3. The substrate structure as claimed in claim 2, wherein the patterned metal layer further comprises a plurality of first connection lines and a plurality of second connection lines disposed on the upper surface of the board, the parts of the first pads are electrically connected to the first electrode through the first connection lines, and the parts of the second pads are electrically connected to the second electrode through the second connection lines.

4. The substrate structure as claimed in claim 1, wherein the board further has a lower surface opposite to the upper surface, and the first electrode and the second electrode are disposed on the lower surface.

5. The substrate structure as claimed in claim 4, further comprising a plurality of first conductive channels and a plurality of second conductive channels, wherein the first conductive channels and the second conductive channels penetrate through the board, the parts of the first pads are electrically connected to the first electrode through the first conductive channels, and the parts of the second pads are electrically connected to the second electrode through the second conductive channels.

6. The substrate structure as claimed in claim 5, further comprising a heat dissipating ring surrounding the device bonding areas.

7. The substrate structure as claimed in claim 1, wherein the patterned metal layer further comprises a plurality of bridge lines disposed on the upper surface of the board, the other parts of the first pads are electrically connected to the other parts of the second pads through the bridge lines, respectively.

8. The substrate structure as claimed in claim 1, wherein at least one of the heat dissipating channels is connected to the first electrode or the second electrode.

9. The substrate structure as claimed in claim 1, wherein the heat dissipating channels are disposed on the upper surface of the board.

10. The substrate structure as claimed in claim 1, wherein the heat dissipating channels are embedded in the upper surface of the board.

11. The substrate structure as claimed in claim 1, wherein the heat dissipating channels penetrate through the board, and a top surface of each of the heat dissipating channels is aligned to the upper surface of the board, and a bottom surface of each of the heat dissipating channels is aligned to a lower surface of the board opposite to the upper surface.

12. The substrate structure as claimed in claim 1, wherein the heat dissipating channels comprise a plurality of first heat dissipating channels extended along a first axial line and a plurality of second heat dissipating channels extended along a second axial line, the first axial line is perpendicular to the second axial line, and the first heat dissipating channels are partially overlapped or non-overlapped to the second heat dissipating channels.

13. The substrate structure as claimed in claim 1, wherein an edge shape of each of the heat dissipating channels present a continuous straight-line shape, a wave shape or a zigzag shape.

14. The substrate structure as claimed in claim 1, wherein the heat dissipating channels are composed of a plurality of non-continuous block patterns.

15. The substrate structure as claimed in claim 1, wherein each of the heat generating elements is a light-emitting diode chip, each of the light-emitting diode chips has a first conductive contact and a second conductive contact, the first conductive contact and the second conductive contact are electrically connected to the first pad and the second pad of the corresponding device bonding area, respectively.