Bump-on-Trace Interconnect
First Claim
1. A semiconductor device comprising:
- a first substrate;
a bump disposed on the first substrate;
a second substrate;
a conductive trace disposed on the second substrate and having a sidewall; and
solder electrically connecting the bump and the conductive trace, wherein the solder covers at least half the height of the sidewall of the conductive trace;
wherein the bump is separated from the conductive trace by a distance less than the height of the sidewall of the conductive trace.
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Accused Products
Abstract
Disclosed herein is a bump-on-trace interconnect with a wetted trace sidewall and a method for fabricating the same. A first substrate having conductive bump with solder applied is mounted to a second substrate with a trace disposed thereon by reflowing the solder on the bump so that the solder wets at least one sidewall of the trace, with the solder optionally wetting between at least half and all of the height of the trace sidewall. A plurality of traces and bumps may also be disposed on the first substrate and second substrate with a bump pitch of less than about 100 μm, and volume of solder for application to the bump calculated based on at least one of a joint gap distance, desired solder joint width, predetermined solder joint separation, bump geometry, trace geometry, minimum trace sidewall wetting region height and trace separation distance.
57 Citations
20 Claims
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1. A semiconductor device comprising:
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a first substrate; a bump disposed on the first substrate; a second substrate; a conductive trace disposed on the second substrate and having a sidewall; and solder electrically connecting the bump and the conductive trace, wherein the solder covers at least half the height of the sidewall of the conductive trace; wherein the bump is separated from the conductive trace by a distance less than the height of the sidewall of the conductive trace. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A device comprising:
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a first bump; a first conductive trace having a sidewall; and a conductive material joint electrically connecting the first bump and the first conductive trace, wherein the conductive material covers at least half the height of the sidewall of the conductive trace; wherein the first bump is separated from the first conductive trace by a distance less than the height of the sidewall of the first conductive trace. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method comprising:
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providing a first substrate having a bump disposed thereon, and the bump having a volume of conductive material disposed thereon; providing a second substrate having a conductive trace, the conductive trace having a sidewall; and mounting the first substrate on the second substrate, the mounting resulting in an electrical connection from the bump to the conductive trace; wherein the bump is separated from the trace by a distance less than the height of the trace; and wherein the conductive material covers at least half the sidewall of the conductive trace. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification