×

Semiconductor Method and Device of Forming a Fan-Out Device with PWB Vertical Interconnect Units

  • US 20130277851A1
  • Filed: 06/14/2013
  • Published: 10/24/2013
  • Est. Priority Date: 03/23/2012
  • Status: Active Grant
First Claim
Patent Images

1. A method of making a semiconductor device, comprising:

  • providing a semiconductor die;

    disposing a modular interconnect unit adjacent to the semiconductor die;

    depositing an encapsulant over the semiconductor die and modular interconnect unit;

    forming a first insulating layer over the semiconductor die and modular interconnect unit;

    forming a plurality of openings in the first insulating layer over the modular interconnect unit; and

    depositing a conductive layer over the first insulating layer.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×