TWO- AND THREE-SUBSTRATE LEVEL PROCESSES FOR PRODUCING EVANESCENT MODE ELECTROMAGNETIC WAVE CAVITY RESONATORS

• US 20130278359A1
• Filed: 04/19/2012
• Published: 10/24/2013
• Est. Priority Date: 04/19/2012
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Stephanou, Philip Jason, Park, Sang-June, Shenoy, Ravindra V.
• Application Number:
  US13/451,400
• Publication Number:
  US 20130278359A1
• Time in Patent Office: Days
• US Class Current: 333/232
• CPC Class Codes: H01P 1/2088 Integrated in a substrate
• CPC Class Codes: H01P 7/065 integrated in a substrate
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems, and related processes. In one aspect, a method includes providing a first substrate and a second substrate. In some implementations, the first substrate includes a cavity ceiling, an array of dielectric spacers, and an assembly platform arranged adjacent the array of dielectric spacers opposite the cavity ceiling surface. The assembly platform includes a plurality of post tops. In some implementations, the second substrate has an array of cavities and an array of resonator posts. In some implementations, the method includes mating the first substrate with the second substrate, connecting the post tops with the posts to form an array that includes a plurality of evanescent-mode electromagnetic wave cavity resonators, wherein at least a statically-defined magnitude of a gap distance between the distal surface of each post top and the cavity ceiling is defined by the dielectric spacers.

Claims

1. A method comprising:

providing a first substrate having a mating side that includes;

a cavity ceiling surface;

an array of dielectric spacers arranged adjacent the cavity ceiling surface; and

an assembly platform arranged adjacent the array of dielectric spacers opposite the cavity ceiling surface, the assembly platform including a plurality of post tops, each post top having a distal surface adjacent the dielectric spacers and a mating surface opposite the distal surface, the assembly platform being formed of a conductive material or having a conductive layer deposited or patterned thereon;

providing a second substrate having a mating side that includes;

an array of cavities, each cavity including an inner cavity surface having a conductive layer deposited or patterned thereon; and

an array of resonator posts, each post being formed within or arranged within a corresponding one of the cavities, each post being formed of a conductive material or having a conductive layer deposited or patterned thereon, each post further including a mating surface at a distal end of the post;

mating the mating side of the first substrate with the mating side of the second substrate; and

connecting the mating surfaces of the post tops with the mating surfaces of the posts to form an array that includes a plurality of evanescent-mode electromagnetic wave cavity resonators.

2. The method of claim 1, wherein at least a statically-defined magnitude of a gap distance between the distal surface of each post top and the cavity ceiling surface is defined by the dielectric spacers.

3. The method of claim 2, wherein the first substrate further includes an array of tuning elements arranged between the cavity ceiling surface and the distal surfaces of the post tops, each tuning element including at least one electrostatically- or piezoelectrically-actuatable micro-electro-mechanical system (MEMS).

4. The method of claim 3, wherein:

the actual magnitude of the gap distance is statically defined by the thickness of the dielectric spacers and dynamically dependent on an actuation of the tuning elements between the post tops and the cavity ceiling surface;

the capacitance between the post top and cavity ceiling surface of each cavity resonator is dependent on the actual magnitude of the gap distance, and

one or more resonant electromagnetic-wave modes of each cavity resonator are dependent on the capacitance.

5. The method of claim 3, wherein:

the mating side of the first substrate further includes one or more sacrificial layers arranged between the distal surfaces of the post tops and the cavity ceiling surface; and

the method further includes removing the sacrificial layers to release the MEMS such that the MEMS are operable to change the actual magnitude of the gap distance upon actuation.

6. The method of claim 5, wherein:

removing the sacrificial layers includes etching the sacrificial layers; and

etching the sacrificial layers includes etching the sacrificial layers through release vents arranged on or over the first substrate.

7. The method of claim 5, wherein removing the sacrificial layers includes removing the sacrificial layers such that the post tops are not in direct contact with the MEMS, such that the parts of the mating side of the first substrate that the post tops directly contact are the dielectric spacers, and such that the dielectric spacers connect to the cavity ceiling surface via the MEMS.

8. The method of claim 1, wherein:

providing the second substrate includes applying solder to the mating surfaces of the posts; and

connecting the mating surfaces of the post tops with the mating surfaces of the posts includes soldering the mating surfaces of the post tops with the mating surfaces of the posts.

9. The method of claim 1, further including singulating the connected first and second substrates to produce the plurality of individual evanescent-mode electromagnetic cavity resonators.

10. The method of claim 1, wherein providing the second substrate includes isotropically etching or otherwise isotropically defining the second substrate to produce the array of cavities and the array of posts simultaneously.

11. The method of claim 1, wherein providing the second substrate includes anisotropically etching or otherwise anisotropically defining the second substrate to produce the array of cavities and the array of posts.

12. A method comprising:

providing a first substrate having a mating side that includes;

a cavity ceiling surface;

an array of dielectric spacers arranged adjacent the cavity ceiling surface; and

an assembly platform arranged adjacent the array of dielectric spacers opposite the cavity ceiling surface, the assembly platform including a plurality of post tops, each post top having a distal surface adjacent the dielectric spacers and a mating surface opposite the distal surface, the assembly platform being formed of a conductive material or having a conductive layer deposited or patterned thereon;

providing a second substrate that includes an array of cavities, each cavity including an inner cavity surface having a conductive layer deposited or patterned thereon, the array further including a first mating surface arranged around a first periphery of each cavity on a first mating side of the second substrate, the array further including a second mating surface arranged around a second periphery of each cavity on a second mating side of the second substrate opposite the first mating side; and

providing a third substrate having a mating side that includes an array of resonator posts, each post being formed of a conductive material or having a conductive layer deposited or patterned thereon, each post further including a mating surface at a distal end of the post;

mating the mating side of the third substrate with the second mating side of the second substrate such that each of the posts is positioned centrally within a corresponding one of the cavities of the second substrate;

mating the mating side of the first substrate with the first mating side of the second substrate; and

connecting the mating surfaces of the post tops with the mating surfaces of the posts to form an array that includes a plurality of evanescent-mode electromagnetic wave cavity resonators.

13. The method of claim 12, wherein at least a statically-defined magnitude of a gap distance between the distal surface of each post top and the cavity ceiling surface is defined by the dielectric spacers.

14. The method of claim 13, wherein the first substrate further includes an array of tuning elements arranged between the cavity ceiling surface and the distal surfaces of the post tops, each tuning element including at least one electrostatically- or piezoelectrically-actuatable micro-electro-mechanical system (MEMS).

15. The method of claim 14, wherein:

the actual magnitude of the gap distance is statically defined by the thickness of the dielectric spacers and dynamically dependent on an actuation of the tuning elements between the post tops and the cavity ceiling surface;

the capacitance between the post top and cavity ceiling surface of each cavity resonator is dependent on the actual magnitude of the gap distance, and

one or more resonant electromagnetic-wave modes of each cavity resonator are dependent on the capacitance.

16. The method of claim 14, wherein:

the mating side of the first substrate further includes one or more sacrificial layers arranged between the distal surfaces of the post tops and the cavity ceiling surface; and

the method further includes removing the sacrificial layers to release the MEMS such that the MEMS are operable to change the actual magnitude of the gap distance upon actuation.

17. The method of claim 16, wherein:

removing the sacrificial layers includes etching the sacrificial layers; and

etching the sacrificial layers includes etching the sacrificial layers through release vents arranged on the first substrate.

18. The method of claim 16, wherein removing the sacrificial layers includes removing the sacrificial layers such that the post tops are not in direct contact with the MEMS, such that the parts of the mating side of the first substrate that the post tops directly contact are the dielectric spacers, and such that the dielectric spacers connect to the cavity ceiling surface via the MEMS.

19. The method of claim 12, wherein:

providing the third substrate includes applying solder to the mating surfaces of the posts; and

connecting the mating surfaces of the post tops with the mating surfaces of the posts includes soldering the mating surfaces of the post tops with the mating surfaces of the posts.

20. The method of claim 12, further including singulating the connected first, second and third substrates to produce the plurality of individual evanescent-mode electromagnetic cavity resonators.

21. The method of claim 12, wherein providing the second substrate includes isotropically etching or otherwise isotropically defining the second substrate to produce the array of cavities.

22. The method of claim 21, wherein isotropically etching or otherwise isotropically defining the second substrate includes isotropically etching both the first mating side and the second mating side of the second substrate to produce the array of cavities such that the cavities are symmetrical relative to a mid-plane of the second substrate equidistant from the first mating side and the second mating side.

23. The method of claim 12, wherein producing the second substrate includes anisotropically etching or otherwise anisotropically defining the second substrate to produce the array of cavities.

24. The method of claim 12, wherein producing the third substrate includes isotropically etching or otherwise isotropically defining the third substrate to produce the array of posts.

25. The method of claim 12, further including connecting the mating side of the third substrate with the second mating side of the second substrate.

26. The method of claim 25, wherein connecting the mating side of the third substrate with the second mating side of the second substrate includes bonding the second mating surfaces of the cavities with corresponding portions of the mating side of the third substrate with epoxy.

27. An arrangement comprising:

a first substrate having a mating side that includes;

a cavity ceiling surface;

an array of dielectric spacers arranged adjacent the cavity ceiling surface; and

an assembly platform arranged adjacent the array of dielectric spacers opposite the cavity ceiling surface, the assembly platform including a plurality of post tops, each post top having a distal surface adjacent the dielectric spacers and a mating surface opposite the distal surface, the assembly platform being formed of a conductive material or having a conductive layer deposited or patterned thereon; and

a second substrate having a mating side that includes;

an array of cavities, each cavity including an inner cavity surface having a conductive layer deposited or patterned thereon; and

an array of resonator posts, each post being formed within or arranged within a corresponding one of the cavities, each post being formed of a conductive material or having a conductive layer deposited or patterned thereon, each post further including a mating surface at a distal end of the post;

wherein the mating surfaces of the post tops are connected with the mating surfaces of the posts to form an array that includes a plurality of evanescent-mode electromagnetic wave cavity resonators.

28. The arrangement of claim 27, wherein at least a statically-defined magnitude of a gap distance between the distal surface of each post top and the cavity ceiling surface is defined by the dielectric spacers.

29. The arrangement of claim 28, wherein the first substrate further includes an array of tuning elements arranged between the cavity ceiling surface and the distal surfaces of the post tops, each tuning element including at least one electrostatically- or piezoelectrically-actuatable micro-electro-mechanical system (MEMS).

30. The arrangement of claim 29, wherein:

the actual magnitude of the gap distance is statically defined by the thickness of the dielectric spacers and dynamically dependent on an actuation of the tuning elements between the post tops and the cavity ceiling surface;

the capacitance between the post top and cavity ceiling surface of each cavity resonator is dependent on the actual magnitude of the gap distance, and

one or more resonant electromagnetic-wave modes of each cavity resonator are dependent on the capacitance.

31. The arrangement of claim 29, wherein:

the post tops are not in direct contact with the MEMS;

the parts of the mating side of the first substrate that the post tops directly contact are the dielectric spacers; and

the dielectric spacers connect to the cavity ceiling surface via the MEMS.

32. The arrangement of claim 27, wherein the mating surfaces of the post tops are soldered to the mating surfaces of the posts.

33. An arrangement comprising:

a first substrate having a mating side that includes;

a cavity ceiling surface;

an array of dielectric spacers arranged adjacent the cavity ceiling surface; and

an assembly platform arranged adjacent the array of dielectric spacers opposite the cavity ceiling surface, the assembly platform including a plurality of post tops, each post top having a distal surface adjacent the dielectric spacers and a mating surface opposite the distal surface, the assembly platform being formed of a conductive material or having a conductive layer deposited or patterned thereon;

a second substrate that includes an array of cavities, each cavity including an inner cavity surface having a conductive layer deposited or patterned thereon, the array further including a first mating surface arranged around a first periphery of each cavity on a first mating side of the second substrate, the array further including a second mating surface arranged around a second periphery of each cavity on a second mating side of the second substrate opposite the first mating side; and

a third substrate having a mating side that includes an array of resonator posts, each post being centrally arranged with a corresponding cavity, each post being formed of a conductive material or having a conductive layer deposited or patterned thereon, each post further including a mating surface at a distal end of the post;

wherein the mating surfaces of the post tops are connected with the mating surfaces of the posts to form an array that includes a plurality of evanescent-mode electromagnetic wave cavity resonators.

34. The arrangement of claim 33, wherein at least a statically-defined magnitude of a gap distance between the distal surface of each post top and the cavity ceiling surface is defined by the dielectric spacers

35. The arrangement of claim 34, wherein the first substrate further includes an array of tuning elements arranged between the cavity ceiling surface and the distal surfaces of the post tops, each tuning element including at least one electrostatically- or piezoelectrically-actuatable micro-electro-mechanical system (MEMS).

36. The arrangement of claim 35, wherein:

the actual magnitude of the gap distance is statically defined by the thickness of the dielectric spacers and dynamically dependent on an actuation of the tuning elements between the post tops and the cavity ceiling surface;

the capacitance between the post top and cavity ceiling surface of each cavity resonator is dependent on the actual magnitude of the gap distance, and

one or more resonant electromagnetic-wave modes of each cavity resonator are dependent on the capacitance.

37. The arrangement of claim 33, wherein:

the post tops are not in direct contact with the MEMS;

the parts of the mating side of the first substrate that the post tops directly contact are the dielectric spacers; and

the dielectric spacers connect to the cavity ceiling surface via the MEMS.

38. The arrangement of claim 33, wherein the mating surfaces of the post tops are soldered to the mating surfaces of the posts.

39. The arrangement of claim 33, wherein the second mating surfaces of the cavities are bonded with corresponding portions of the mating side of the third substrate with epoxy.

40. A device comprising:

an evanescent-mode electromagnetic-wave cavity resonator including;

a first substrate having a mating side that includes;

a cavity ceiling surface;

one or more dielectric spacers arranged adjacent the cavity ceiling surface; and

a post top having a distal surface adjacent the dielectric spacers and a mating surface opposite the distal surface, the post top being formed of a conductive material or having a conductive layer deposited or patterned thereon; and

a second substrate that includes a cavity having an inner cavity surface that has a conductive layer deposited or patterned thereon; and

a resonator post formed of a conductive material or having a conductive layer deposited or patterned thereon, the post being centrally arranged with the cavity, the post further including a mating surface at a distal end of the post;

wherein the mating surface of the post top is connected with the mating surface of the post.

41. The device of claim 40, wherein at least a statically-defined magnitude of a gap distance between the distal surface of each post top and the cavity ceiling surface is defined by the dielectric spacers.

42. The device of claim 41, wherein the first substrate further includes one or more tuning elements arranged between the cavity ceiling surface and the distal surface of the post top, each tuning element including at least one electrostatically- or piezoelectrically-actuatable micro-electro-mechanical system (MEMS).

43. The device of claim 42, wherein:

the actual magnitude of the gap distance is statically defined by the thickness of the dielectric spacers and dynamically dependent on an actuation of the tuning elements between the post top and the cavity ceiling surface;

the capacitance between the post top and cavity ceiling surface is dependent on the actual magnitude of the gap distance, and

one or more resonant electromagnetic-wave modes are dependent on the capacitance.

44. The device of claim 42, wherein:

the post top is not in direct contact with the MEMS;

the parts of the mating side of the first substrate that the post top directly contacts are the dielectric spacers; and

the dielectric spacers connect to the cavity ceiling surface via the MEMS.