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Semiconductor Module With a Semiconductor Chip and a Passive Component and Method for Producing the Same

  • US 20130285132A1
  • Filed: 05/30/2013
  • Published: 10/31/2013
  • Est. Priority Date: 07/24/2006
  • Status: Active Grant
First Claim
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1. A semiconductor module comprising:

  • a semiconductor chip including;

    a control electrode disposed on a portion of an external face of the semiconductor chip, anda contact having a two-dimensional extent that substantially covers a remaining portion of the external face; and

    a passive discrete component arranged in a package and stacked on the contact, the passive discrete component comprising;

    an electrode having a side that contacts the contact of the semiconductor chip such that the electrode is electrically connected to and fixed on the contact, anda counter electrode electrically connected to the control electrode of the semiconductor chip.

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