SEMICONDUCTOR PACKAGE MODULE

• US 20130285232A1
• Filed: 07/11/2012
• Published: 10/31/2013
• Est. Priority Date: 04/27/2012
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Ha, Job
• Application Number:
  US13/546,433
• Publication Number:
  US 20130285232A1
• Time in Patent Office: Days
• US Class Current: 257/696
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/15322 being a pin array, e.g. PGA
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/1059 Connections made by press-fit insertion
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence

Abstract

Disclosed herein is a semiconductor package module, including: a circuit board having connection pads formed on one surface thereof; a semiconductor package including lead terminals protruded out of a housing; and an interposer positioned between the circuit board and the semiconductor package, the interposer including a body allowing the circuit board and the semiconductor package to be spaced apart from each other and elastic members contacted with the connection pads and the lead terminals.

Claims

1. A semiconductor package module, comprising:

a circuit board having connection pads formed on one surface thereof;

a semiconductor package including lead terminals protruded out of a housing; and

an interposer positioned between the circuit board and the semiconductor package, the interposer including a body allowing the circuit board and the semiconductor package to be spaced apart from each other and elastic members contacted with the connection pads and the lead terminals.

2. The semiconductor package module as set forth in claim 1, wherein the body includes elastic member mounting parts for mounting the elastic members therein, respectively.

3. The semiconductor package module as set forth in claim 2, wherein the elastic member mounting part is in a penetration hole type penetrating through the body.

4. The semiconductor package module as set forth in claim 2, wherein the elastic member mounting part includes an elastic member fixing portion fixing the elastic member.

5. The semiconductor package module as set forth in claim 4, wherein the elastic member fixing portion includes one pair of first and second elastic member fixing elements protruded from both internal walls of the elastic member mounting part toward a center thereof.

6. The semiconductor package module as set forth in claim 5, wherein the elastic member includes:

a pad connection portion contacted with the connection pads of the circuit board;

a lead insertion portion inserting the lead terminals of the semiconductor package thereinto;

a fixing portion fixed to the elastic member fixing portion of the body.

7. The semiconductor package module as set forth in claim 6, wherein the elastic member is formed in an integral type.

8. The semiconductor package module as set forth in claim 6, wherein the pad connection portion, the lead insertion portion, and the fixing portion of the elastic member are bent toward one another and connected with one another.

9. The semiconductor package module as set forth in claim 8, wherein the elastic member includes:

a first lower fixing element fixed to a lower surface of the first elastic member fixing element formed on one internal wall of the elastic member mounting part;

a first bending element bent from one side of the first lower fixing element to the inside upwardly;

a second bending element bent from one side of the first bending element to the outside downwardly;

a first upper fixing element bent from one side of the second bending element to the outside upwardly, and fixed to an upper surface of the first elastic member fixing element;

a first pad connection element bent from one side of the first upper fixing element to the inside thereof;

a second lower fixing element fixed to a lower surface of the second elastic member fixing element formed on the other internal wall of the elastic member mounting part;

a third bending element bent from one side of the second lower fixing element to the inside upwardly;

a fourth bending element bent from one side of the third bending element to the outside downwardly;

a second upper fixing element bent from one side of the fourth bending element to the outside upwardly, and fixed to an upper surface of the second elastic member fixing element; and

a second pad connection element bent from one side of the second upper fixing element to the inside thereof, one side of the second upper fixing element being connected with one side of the first pad connection element.

10. The semiconductor package module as set forth in claim 9, wherein in the elastic member, the lead terminal of the semiconductor package is inserted and fixed between the second bending element and the fourth bending element.

11. The semiconductor package module as set forth in claim 9, wherein the first pad connection element and the second pad connection element are contacted with the connection pad of the circuit board.

12. The semiconductor package module as set forth in claim 1, wherein the body is formed of an insulating material, and the elastic member is formed of a conductive material.

13. The semiconductor package module as set forth in claim 1, further comprising at least one protrusion protruded from at least one of an upper surface and a lower surface of the body in a thickness direction of the body.

14. The semiconductor package module as set forth in claim 1, wherein the semiconductor package includes at least one of a power device and a control device.

15. The semiconductor package module as set forth in claim 1, wherein the semiconductor package includes:

a first semiconductor package including a power device and the lead terminals protruded out of the housing; and

a second semiconductor package including a control device and a control substrate electrically connected with the lead terminals.

16. The semiconductor package module as set forth in claim 15, wherein the lead terminals are penetration-inserted into the control substrate.

17. The semiconductor package module as set forth in claim 15, wherein the control device is inserted into the body of the interposer.

18. The semiconductor package module as set forth in claim 1, further comprising a heat radiating unit formed below the semiconductor package.

19. The semiconductor package module as set forth in claim 18, wherein the circuit board, the semiconductor package, the interposer, and the heat radiating unit are fixed to one another by a coupling unit.

20. The semiconductor package module as set forth in claim 19, wherein the coupling unit is a bolt.