MOISTURE SENSOR ARRANGEMENT
First Claim
1. A moisture sensor arrangement, comprising:
- a plate-like semiconductor substrate;
an integrated signal processing component disposed on a first side of said semiconductor substrate;
a capacitive moisture sensor connected electrically conductively to said integrated signal processing component, wherein said capacitive moisture sensor is disposed on either said first side or a second side of said semiconductor substrate that is opposite said first side of said semiconductor substrate, whereinsaid plate-like semiconductor substrate comprises;
plated through-holes, by way of which elements on said first side and said second side of said semiconductor substrate are electrically connectable to one another; and
a temperature sensor integrated with said integrated signal processing component.
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Abstract
A moisture sensor arrangement including a plate-like semiconductor substrate and an integrated signal processing component disposed on a first side of the semiconductor substrate. The moisture sensor arrangement including a capacitive moisture sensor connected electrically conductively to the integrated signal processing component, wherein the capacitive moisture sensor is disposed on either the first side or a second side of the semiconductor substrate that is opposite the first side of the semiconductor substrate. In addition, the plate-like semiconductor substrate includes 1) plated through-holes, by way of which elements on the first side and the second side of the semiconductor substrate are electrically connectable to one another; and 2) a temperature sensor integrated with the integrated signal processing component.
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Citations
16 Claims
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1. A moisture sensor arrangement, comprising:
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a plate-like semiconductor substrate; an integrated signal processing component disposed on a first side of said semiconductor substrate; a capacitive moisture sensor connected electrically conductively to said integrated signal processing component, wherein said capacitive moisture sensor is disposed on either said first side or a second side of said semiconductor substrate that is opposite said first side of said semiconductor substrate, wherein said plate-like semiconductor substrate comprises; plated through-holes, by way of which elements on said first side and said second side of said semiconductor substrate are electrically connectable to one another; and a temperature sensor integrated with said integrated signal processing component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification