LIGHT-EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

• US 20130292719A1
• Filed: 05/03/2013
• Published: 11/07/2013
• Est. Priority Date: 05/04/2012
• Status: Abandoned Application

• Current Assignee: Chi Mei Lighting Technology Corp. (InnoLux Corporation)
• Original Assignee: Chi Mei Lighting Technology Corp. (InnoLux Corporation)
• Inventors: Lee, Hsueh Lin, Chu, Chang Hsin, Chen, Yuan Tze, Hsu, Chih Kuei
• Application Number:
  US13/886,588
• Publication Number:
  US 20130292719A1
• Time in Patent Office: Days
• US Class Current: 257/93
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting diode (LED) structure includes an insulation substrate; LED chips each includes an epitaxial layer having a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer stacked on the insulation substrate, and comprises a mesa structure and an exposed portion of the first conductivity type semiconductor layer adjacent to each other, and a first isolation trench within the mesa structure; interconnection layers connect the LED chips; electrode pads respectively connected to exposed portions of the semiconductor layers; a reflective insulating layer covering the interconnection layers, the mesa structures and the electrode pads, and having penetration holes respectively exposing a portion of the electrode pads; and bonding pads located on a portion of the reflective insulating layer and connected to the electrode pads through the penetrating holes. A method of manufacturing the LED structure.

Claims

1. A light-emitting diode (LED) structure, comprising:

an insulation substrate;

a plurality of LED chips, wherein each of the LED chips comprises an epitaxial layer, the epitaxial layer comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer sequentially stacked on a surface of the insulation substrate, wherein each of the LED chips comprises a mesa structure and an exposed portion of the first conductivity type semiconductor layer adjacent to each other, wherein a first isolation trench is defined by two adjacent LED chips in a first direction, and wherein the first isolation trench is disposed in the mesa structure;

a plurality of interconnection layers, connecting two adjacent LED chips of the LED chips, respectively;

a first conductive type electrode pad and a second conductive type electrode pad, disposed on a first LED chip and a second LED chip of the LED chips, respectively, and electrically connected to the exposed portion of the first conductivity type semiconductor layer of the first LED chip and the second conductivity type semiconductor layer of the second LED chip, respectively;

a reflective insulating layer, covering the interconnection layers, the mesa structures, the first conductive type electrode pad, and the second conductive type electrode pad, wherein the reflective insulating layer has at least one first penetration hole and at least one second penetration hole exposing a portion of the first conductive type electrode pad and a portion of the second conductive type electrode pad, respectively;

a first conductive type bonding pad, located on a portion of the reflective insulating layer, and electrically connected to the first conductive type electrode pad through the at least one first penetration hole; and

a second conductive type bonding pad, located on another portion of the reflective insulating layer, separated from the first conductive type bonding pad, and electrically connected to the second conductive type electrode pad through the at least one second penetration hole.

2. The LED structure according to claim 1, wherein each of the LED chips further comprises an insulating layer, and the insulating layer is filled in the first isolation trench, so as to seal an opening of the first isolation trench.

3. The LED structure according to claim 2, wherein each of the LED chips further comprises a current blocking layer between the interconnection layer on the mesa structure and the insulating layer.

4. The LED structure according to claim 3, wherein each of the LED chips further comprises a transparent conductive layer extending on the second conductivity type semiconductor layer of the mesa structure, and being between the interconnection layer on the mesa structure and the current blocking layer.

5. The LED structure according to claim 1,

wherein each of the LED chips further comprises a dielectric layer disposed on the epitaxial layer, and each of the LED chips is provided with a first electrical contact hole and a second electrical contact hole penetrating the dielectric layer;

wherein the first isolation trench is between the second electrical contact hole of the LED chip and the first electrical contact hole of the adjacent LED chip;

wherein each of the interconnection layers extends, from the second electrical contact hole of each of the LED chips, above the first isolation trench, into the first electrical contact hole of the adjacent LED chip; and

wherein the reflective insulating layer further covers the dielectric layer.

6. The LED structure according to claim 5,

wherein each of the LED chips further comprises a transparent conductive layer between the dielectric layer and the epitaxial layer;

wherein a bottom of the first electrical contact hole exposes the exposed portion of the first conductivity type semiconductor layer; and

wherein a bottom of the second electrical contact hole exposes the transparent conductive layer.

7. The LED structure according to claim 6, wherein each of the LED chips further comprises at least one current blocking layer between the bottom of the second electrical contact hole and the epitaxial layer.

8. The LED structure according to claim 5, wherein in each of the LED chips, the epitaxial layer has a groove, a bottom of the groove exposes the exposed portion of the first conductivity type semiconductor layer, the first electrical contact hole exposes a portion of the bottom of the groove, and the dielectric layer covers a sidewall of the groove.

9. The LED structure according to claim 5, wherein each of the LED chips further comprises at least one insulating lining layer covering a sidewall of the first electrical contact hole.

10. The LED structure according to claim 1,

wherein a second isolation trench is defined by two adjacent LED chips in a second direction;

wherein the first isolation trenches abut the second isolation trenches; and

wherein an epitaxial layer of each LED chip is separated from an epitaxial layer of an adjacent LED chip by the first isolation trench and the second isolation trench.

11. A method for manufacturing a light-emitting diode (LED) structure, comprising:

providing an insulation substrate;

forming an epitaxial structure, wherein the epitaxial structure comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer sequentially stacked on a surface of the insulation substrate;

forming a plurality of first isolation trenches and a plurality of second isolation trenches in the epitaxial structure, so as to define a plurality of epitaxial layers of a plurality of LED chips, wherein the first isolation trenches abut the second isolation trenches, respectively;

removing a portion of the second conductivity type semiconductor layer and a portion of the active layer, so as to define a mesa structure and an exposed portion of the first conductivity type semiconductor layer of each of the LED chips, wherein each of the LED chips comprises one of the first isolation trenches, and the one of the first isolation trenches is disposed in the mesa structure;

forming a plurality of interconnection layers, a first conductive type electrode pad, and a second conductive type electrode pad, wherein the interconnection layers connect two adjacent LED chips of the LED chips, respectively, the first conductive type electrode pad and the second conductive type electrode pad are disposed on a first and a second of the LED chips, respectively, and the first conductive type electrode pad and the second conductive type electrode pad are electrically connected to the exposed portion of the first conductivity type semiconductor layer of the first LED chip and the second conductivity type semiconductor layer of the second LED chip, respectively;

forming a reflective insulating layer covering the interconnection layers, the mesa structures, the first conductive type electrode pad, and the second conductive type electrode pad, wherein the reflective insulating layer has at least one first penetration hole and at least one second penetration hole exposing a portion of the first conductive type electrode pad and a portion of the second conductive type electrode pad, respectively;

forming a first conductive type bonding pad on a portion of the reflective insulating layer, wherein the first conductive type bonding pad is electrically connected to the first conductive type electrode pad through the at least one first penetration hole; and

forming a second conductive type bonding pad on another portion of the reflective insulating layer, wherein the second conductive type bonding pad and the first conductive type bonding pad are separated from each other, and the second conductive type bonding pad is electrically connected to the second conductive type electrode pad through the at least one second penetration hole.

12. The method according to claim 11, after forming the first isolation trenches and the second isolation trenches in the epitaxial structure, further comprising forming a plurality of dielectric layers covering the epitaxial layers, respectively, wherein each of the LED chips has a first electrical contact hole and a second electrical contact hole penetrating the dielectric layer, and the first isolation trench is between the second electrical contact hole of the LED chip and the first electrical contact hole of an adjacent LED chip.

13. The method according to claim 12, before forming the dielectric layers, further comprising:

forming a plurality of transparent conductive layers between the dielectric layers and the epitaxial layers, respectively; and

forming a plurality of current blocking layers located between the epitaxial layers and the transparent conductive layers, respectively;

wherein in each of the LED chips, a bottom of the first electrical contact hole exposes the first conductivity type semiconductor layer, a bottom of the second electrical contact hole exposes the transparent conductive layer, and the current blocking layers are correspondingly disposed at positions below the bottoms of the second electrical contact holes.

14. A light-emitting diode (LED) structure, comprising:

an insulation substrate;

a plurality of LED chips, wherein each of the LED chips comprises an epitaxial layer, the epitaxial layer comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer sequentially stacked on a surface of the insulation substrate, wherein each of the LED chips comprises a mesa structure and an exposed portion of the first conductivity type semiconductor layer adjacent to each other, and a first isolation trench, and wherein the first isolation trench is disposed in the mesa structure;

a plurality of interconnection layers, connecting two adjacent LED chips of the LED chips, respectively;

a first conductive type electrode pad and a second conductive type electrode pad disposed on a first LED chip and a second LED chip of the LED chips, respectively, and electrically connected to the exposed portion of the first conductivity type semiconductor layer of the first LED chip and the second conductivity type semiconductor layer of the second LED chip, respectively;

an insulating layer, covering the interconnection layers, the mesa structures, the first conductive type electrode pad, and the second conductive type electrode pad, wherein the insulating layer has at least one first penetration hole and at least one second penetration hole exposing a portion of the first conductive type electrode pad and the second conductive type electrode pad, respectively;

a first conductive type bonding pad, located on a portion of the insulating layer, and electrically connected to the first conductive type electrode pad through the at least one first penetration hole; and

a second conductive type bonding pad, located on another portion of the insulating layer, separated from the first conductive type bonding pad, and electrically connected to the second conductive type electrode pad through the at least one second penetration hole.

15. The LED structure according to claim 14, wherein the insulating layer is a distributed Bragg reflector (DBR).

16. The LED structure according to claim 14, further comprising a reflective insulating layer,

wherein each of the LED chips further comprises a dielectric layer disposed on the epitaxial layer, each of the LED chips is provided with a first electrical contact hole and a second electrical contact hole penetrating the dielectric layer, and the first isolation trench is between the second electrical contact hole of the LED chip and the first electrical contact hole of the adjacent LED chip;

wherein the reflective insulating layer covers a sidewall of the first electrical contact hole, a sidewall of the second electrical contact hole, and an upper surface of the dielectric layer of each of the LED chips; and

wherein each of the interconnection layers extends, from the second electrical contact hole of each of the LED chips, above the first isolation trench, into the first electrical contact hole of the adjacent LED chip.

17. The LED structure according to claim 14, further comprising a reflective insulating layer,

wherein each of the LED chips further comprises a dielectric layer disposed on the epitaxial layer, each of the LED chips is provided with a first electrical contact hole and a second electrical contact hole penetrating the dielectric layer, the first isolation trench is between the second electrical contact hole of the LED chip and the first electrical contact hole of the adjacent LED chip, the epitaxial layer has a groove, a bottom of the groove exposes the exposed portion of the first conductivity type semiconductor layer, and the first electrical contact hole exposes a portion of the bottom of the groove;

wherein the reflective insulating layer covers a sidewall of each of the grooves and an upper surface of each of the epitaxial layers; and

wherein each of the interconnection layers extends, from the second electrical contact hole of each of the LED chips, above the first isolation trench, into the first electrical contact hole of the adjacent LED chip.

18. The LED structure according to claim 14, further comprising a reflective insulating layer,

wherein each of the LED chips further comprises a dielectric layer disposed on the epitaxial layer, each of the LED chips is provided with a first electrical contact hole and a second electrical contact hole penetrating the dielectric layer, the first isolation trench is between the second electrical contact hole of the LED chip and the first electrical contact hole of the adjacent LED chip, the epitaxial layer has a groove, a bottom of the groove exposes the exposed portion of the first conductivity type semiconductor layer, the first electrical contact hole exposes a portion of the bottom of the groove, and the dielectric layer covers a sidewall of the groove;

wherein the reflective insulating layer covers an upper surface of each of the epitaxial layers; and

wherein each of the interconnection layers extends, from the second electrical contact hole of each of the LED chips, above the first isolation trench, to the first electrical contact hole of the adjacent LED chip.

19. The LED structure according to claim 14, further comprising a reflective insulating layer,

wherein each of the LED chips further comprises a dielectric layer disposed on the epitaxial layer, each of the LED chips is provided with a first electrical contact hole and a second electrical contact hole penetrating the dielectric layer, the first isolation trench is between the second electrical contact hole of the LED chip and the first electrical contact hole of the adjacent LED chip, the epitaxial layer has a groove, a bottom of the groove exposes the exposed portion of the first conductivity type semiconductor layer, the first electrical contact hole exposes a portion of the bottom of the groove, and the dielectric layer covers a sidewall of the groove;

wherein the reflective insulating layer covers an upper surface of each of the dielectric layers; and

wherein each of the interconnection layers extends, from the second electrical contact hole of each of the LED chips, above the first isolation trench, to the first electrical contact hole of the adjacent LED chip.