Programmable Semiconductor Interposer for Electronic Package and Method of Forming
First Claim
1. A method of forming a semiconductor interposer, the method comprising:
- forming an array of semiconductor devices having a plurality of electrical parameters in an insulating material on a first surface of a substrate, each semiconductor device of the array of semiconductor devices having a vertical interconnect extending to a first surface of the insulating material;
forming one or more first contact pads on a second surface of the substrate;
forming one or more second contact pads over the insulating material, at least one of the second contact pads being coupled to at least one of the first contact pads; and
obtaining a desired electrical parameter for an integrated circuit device attached to the interposer comprising;
selectively connecting the vertical interconnect of at least one of the array of semiconductor devices to at least one of the second contact pads; and
selectively connecting the vertical interconnect of at least one of the array of semiconductor devices to the vertical interconnect of at least one other of the array of semiconductor devices.
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Accused Products
Abstract
Various structures of a programmable semiconductor interposer for electronic packaging are described. An array of semiconductor devices having various values is formed in the interposer. A user can program the interposer and form a “virtual” device having a desired value by selectively connecting various one of the array of devices to contact pads formed on the surface of the interposer. An inventive electronic package structure includes a standard interposer having an array of unconnected devices of various values and a device selection unit, which selectively connects various one of the array of devices in the standard interposer to an integrated circuit die encapsulated in the electronic package. Methods of forming the programmable semiconductor interposer and the electronic package are also illustrated.
36 Citations
20 Claims
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1. A method of forming a semiconductor interposer, the method comprising:
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forming an array of semiconductor devices having a plurality of electrical parameters in an insulating material on a first surface of a substrate, each semiconductor device of the array of semiconductor devices having a vertical interconnect extending to a first surface of the insulating material; forming one or more first contact pads on a second surface of the substrate; forming one or more second contact pads over the insulating material, at least one of the second contact pads being coupled to at least one of the first contact pads; and obtaining a desired electrical parameter for an integrated circuit device attached to the interposer comprising; selectively connecting the vertical interconnect of at least one of the array of semiconductor devices to at least one of the second contact pads; and selectively connecting the vertical interconnect of at least one of the array of semiconductor devices to the vertical interconnect of at least one other of the array of semiconductor devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a semiconductor interposer, the method comprising:
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forming an array of semiconductor devices having a plurality of electrical parameters in an insulating material on a first surface of a substrate, each semiconductor device of the array of semiconductor devices having a vertical interconnect extending to a first surface of the insulating material; forming one or more first contact pads on a second surface of the substrate; forming a device selection unit on the insulating material; and forming one or more second contact pads over the device selection unit, wherein the device selection unit is capable of; selectively connecting the vertical interconnect of at least one of the array of semiconductor devices to at least one of the second contact pads; and selectively connecting the vertical interconnect of at least one of the array of semiconductor devices to the vertical interconnect of at least one other of the array of semiconductor devices. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method of forming an electronic package, the method comprising:
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forming a programmable semiconductor interposer comprising; forming an array of semiconductor devices having a plurality of electrical parameters in an insulating material on a substrate; and forming a device selection unit on the insulating material; forming a plurality of first contact pads on a first surface of the programmable semiconductor interposer; forming a plurality of second contact pads on a second surface of the programmable semiconductor interposer, the second surface being opposite the first surface; programming the device selection unit, the programming comprising; connecting at least two of the array of semiconductor devices to form a custom device; and connecting at least one of the array of semiconductor devices to at least one of the plurality of first contact pads; and bonding an integrated circuit die to the first contact pads, the custom device having a desired electrical parameter for the integrated circuit die. - View Dependent Claims (17, 18, 19, 20)
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Specification