FIRMWARE CLEANUP DEVICE

• US 20130304962A1
• Filed: 04/08/2013
• Published: 11/14/2013
• Est. Priority Date: 05/10/2012
• Status: Abandoned Application

• Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: YIN, Xiao-Gang, ZHANG, Wan-Hong
• Application Number:
  US13/858,095
• Publication Number:
  US 20130304962A1
• Time in Patent Office: Days
• US Class Current: 711/102
• CPC Class Codes: G06F 12/0246 in block erasable memory, e.g. flash memory
• CPC Class Codes: G06F 8/62 Uninstallation

Abstract

A firmware cleanup device includes a solid state disk (SSD) and an operation member. The SSD includes two pads and a connection portion, the connection portion defines two contacting pins respectively and electronically connected to the two pads. The operation member is detachably connected to the connection portion, the operation member includes two interconnected connection lines, and the two connection lines are respectively and electronically connected to the two contacting pins.

Claims

1. A firmware cleanup device, comprising:

a solid state disk (SSD) comprising two pads and a connection portion, the connection portion defining two contacting pins respectively and electronically connected to the two pads; and

an operation member detachably connected to the connection portion, the operation member including two interconnected connection lines, the two connection lines configured to be respectively and electronically connected to the two contacting pins.

2. The firmware cleanup device as claimed in claim 1, wherein the SSD further includes a controller electronically connected to the two pads, the controller stores firmware, when the two pads are interconnected, the firmware is force downloaded/removed from the controller.

3. The firmware cleanup device as claimed in claim 1, wherein the connection portion further includes a plurality of connection pins electronically connected to the controller.

4. The firmware cleanup device as claimed in claim 3, wherein the SSD includes a first surface and a second surface, the connection portion includes a top surface coplanar with the first surface and a bottom surface coplanar with the second surface, the connection pins are positioned at the top surface, and the contacting pins are positioned at the bottom surface.

5. The firmware cleanup device as claimed in claim 4, wherein the two pads are positioned at the second surface.

6. The firmware cleanup device as claimed in claim 1, wherein the operation member further includes a port to receive the connection portion.

7. A firmware cleanup device, comprising:

an operation member; and

a solid state disk (SSD), the SSD comprising;

a controller storing firmware;

two pads electronically connected to the controller; and

two contacting pins respectively and electronically connected to the two pads;

wherein manipulation of the operation member causes the SSD to be electronically connected to the operation member, and the two pads are interconnected to force download of or remove of the firmware.

8. The firmware cleanup device as claimed in claim 7, wherein the SSD further includes a connection portion;

the two contacting pins are positioned at the connection portion.

9. The firmware cleanup device as claimed in claim 8, wherein the operation member includes a port to receive the connection portion.

10. The firmware cleanup device as claimed in claim 9, wherein the operation member further includes two interconnected connection lines, the two connection lines are respectively and electronically connect to the two contacting pins.

11. The firmware cleanup device as claimed in claim 8, wherein the connection portion further includes a plurality of connection pins electronically connected to the controller.

12. The firmware cleanup device as claimed in claim 11, wherein the SSD includes a first surface and a second surface, the connection portion includes a top surface coplanar with the first surface and a bottom surface coplanar with the second surface, the connection pins are positioned at the top surface, and the contacting pins are positioned at the bottom surface.

13. The firmware cleanup device as claimed in claim 12, wherein the two pads are positioned at the second surface.