SOLDERING NOZZLE FOR DELIVERING MOLTEN SOLDER TO THE UNDERSIDE OF A PCB, METHOD OF REDUCING THE RATE OF OCCURENCE OF DEWETTING OF A SOLDER NOZZLE

• US 20130306711A1
• Filed: 09/01/2011
• Published: 11/21/2013
• Est. Priority Date: 09/01/2010
• Status: Abandoned Application

• Current Assignee: Pillarhouse International Limited
• Original Assignee: Pillarhouse International Limited
• Inventors: Ciniglio, Alexander J.
• Application Number:
  US13/819,684
• Publication Number:
  US 20130306711A1
• Time in Patent Office: Days
• US Class Current: 228/57
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/085 Wave soldering
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 3/025 Bits or tips
• CPC Class Codes: B23K 3/0653 with wave generating means, e.g. nozzles, jets, fountains
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 3/3468 Applying molten solder

Abstract

The present invention provides an improved soldering nozzle (61, 81) for delivering molten solder to the underside of a PCB. The nozzle (61, 81) comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle (61, 81) having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle (61, 81) comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle (61, 81) of the present invention achieves an improved dewetting performance.

Claims

1. A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having an outer surface configured to support a return flow of molten solder, wherein the outer surface of the nozzle comprises a slotted or recessed feature located about at least a part of the nozzle outlet for accommodating at least a part of the return flow of solder.

2. A nozzle according to claim 1, wherein the nozzle has an axial-symmetric shape which defines a nozzle axis.

3. A nozzle according to claim 2, wherein the nozzle has a substantially bell-like shape.

4. A nozzle according to claim 3, wherein the nozzle outlet is located, in use, on the top of said substantially bell-like shape.

5. A nozzle according to claim 1, wherein the inner bore and the nozzle are substantially co-axial.

6. A nozzle according to claim 1, wherein the slotted or recessed feature extends around at least a part of the nozzle outlet.

7. A nozzle according to claim 1, wherein the slotted or recessed feature extends all around the outlet.

8. A nozzle according to claim 1, wherein the slotted or recessed feature extends, in use, substantially horizontally.

9. A nozzle according to claim 1, wherein the slotted or recessed feature is an annular groove.

10. A nozzle according to claim 9, wherein the groove has a rectangular depth profile.

11. A nozzle according to claim 1, wherein the groove has a depth in the range between 0.1 and 0.5 mm, and a width in range between 0.5 and 2 mm.

13. A nozzle according to claim 1, wherein the groove and the outlet define a distance therebetween, the distance being measured in the nozzle'"'"'s axial direction as being in the range of between 1 and 4 mm.

14. A nozzle according to claim 1, wherein the nozzle comprises a further groove located adjacent to said first groove.

15. A nozzle according to claim 14, wherein the further groove has a substantially similar aspect ratio compared to said first groove.

16. A nozzle according to claim 15, wherein the further groove and said first groove define a groove-spacing distance in the nozzle'"'"'s axial direction, the groove-spacing distance being in the range of between 1 and 5 mm, measured from the groove centres.

40. A nozzle according to claim 1, wherein the wall of the nozzle, at the outlet, is between 0.25 and 1 mm thick,

12. (canceled)

17. A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet and first and second stackable parts configured such that in use they will be fluidly connected to allow molten solder to be pumped therethrough to overflow the nozzle outlet.

18. A nozzle according to claim 17, the nozzle also being adapted to release excess molten solder by having defined therein at least one aperture through which an excess of molten solder can be released.

19. A nozzle according to claim 18, wherein the first and second stackable parts cooperate to define the or each aperture therebetween.

20. A nozzle according to claim 18, wherein the stackable parts, once stacked, are retained together so as not to separate.

21. A nozzle according to claim 20, wherein the stackable parts are retained together by an interference fit, or a threaded fit, or they interlock together.

24. A nozzle according to claim 17, wherein the nozzle has an axial-symmetric shape which defines a nozzle axis.

25. A nozzle according to claim 17, wherein each of the first and second stackable parts has a bore defining a bore axis, and wherein, in use, the two bore axes are substantially aligned.

26. A nozzle according to claim 25, wherein the axes of the bores and the axis of the nozzle are substantially coaxial.

27. A nozzle according to claim 17, wherein at least one of the first and second stackable parts has generally a substantially bell-like or flask-like shape.

28. A nozzle according to claim 17, wherein, in use, a wide, base portion of one of the parts is stacked over a narrow, neck portion on the other of the parts.

29. A nozzle according to claim 28, wherein the stacked-over part is generally smaller than the other part.

30. A nozzle according to claim 29, wherein each of the first and second stackable parts has a bore defining a bore axis, and wherein in use, the two bore axes are substantially aligned and the bore of the stacked-over part is generally narrower than the bore of the other part.

31. A nozzle according to claim 30, wherein the nozzle is adapted to release excess molten solder by having defined therein at least one aperture through which an excess of molten solder can be released and the first and second stackable parts cooperate to define the or each aperture therebetween and the part on which the other part is stacked-over comprises a castellated feature.

32. A nozzle according to claim 31, wherein the castellation forms the aperture between the two parts.

22. (canceled)

23. (canceled)

33. (canceled)

34. A nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet and a nozzle body, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having a nozzle tip at the end of which the nozzle outlet is located, the nozzle outlet having an inner width dimension of between 1.5 and 2.5 mm.

35. A nozzle according to claim 34, wherein the nozzle has a base with an outer width dimension of at least 15 mm and preferably between 15 and 25 mm.

36. A nozzle according to claim 34, wherein the nozzle additionally has one or more additional apertures around its side, with the nozzle'"'"'s outlet being above that or those aperture(s).

37. A nozzle according to claim 36, wherein the or each aperture points its outlet generally downwards with respect to the upwards directed upper outlet.

38. A nozzle according to claim 34, wherein there are multiple apertures, each spaced around the perimeter of the nozzle.

39. A nozzle according to claim 34, wherein the width dimension of the nozzle above the or each aperture is between 6 and 13 mm.

41-47. -47. (canceled)