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SOLDERING NOZZLE FOR DELIVERING MOLTEN SOLDER TO THE UNDERSIDE OF A PCB, METHOD OF REDUCING THE RATE OF OCCURENCE OF DEWETTING OF A SOLDER NOZZLE

  • US 20130306711A1
  • Filed: 09/01/2011
  • Published: 11/21/2013
  • Est. Priority Date: 09/01/2010
  • Status: Abandoned Application
First Claim
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1. A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having an outer surface configured to support a return flow of molten solder, wherein the outer surface of the nozzle comprises a slotted or recessed feature located about at least a part of the nozzle outlet for accommodating at least a part of the return flow of solder.

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