SOLDERING NOZZLE FOR DELIVERING MOLTEN SOLDER TO THE UNDERSIDE OF A PCB, METHOD OF REDUCING THE RATE OF OCCURENCE OF DEWETTING OF A SOLDER NOZZLE
First Claim
1. A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having an outer surface configured to support a return flow of molten solder, wherein the outer surface of the nozzle comprises a slotted or recessed feature located about at least a part of the nozzle outlet for accommodating at least a part of the return flow of solder.
1 Assignment
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Accused Products
Abstract
The present invention provides an improved soldering nozzle (61, 81) for delivering molten solder to the underside of a PCB. The nozzle (61, 81) comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle (61, 81) having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle (61, 81) comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle (61, 81) of the present invention achieves an improved dewetting performance.
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Citations
41 Claims
- 1. A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having an outer surface configured to support a return flow of molten solder, wherein the outer surface of the nozzle comprises a slotted or recessed feature located about at least a part of the nozzle outlet for accommodating at least a part of the return flow of solder.
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12. (canceled)
- 17. A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet and first and second stackable parts configured such that in use they will be fluidly connected to allow molten solder to be pumped therethrough to overflow the nozzle outlet.
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22. (canceled)
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23. (canceled)
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33. (canceled)
- 34. A nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet and a nozzle body, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having a nozzle tip at the end of which the nozzle outlet is located, the nozzle outlet having an inner width dimension of between 1.5 and 2.5 mm.
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41-47. -47. (canceled)
Specification