IMAGE-SENSING MODULE FOR REDUCING ITS WHOLE THICKNESS

• US 20130307105A1
• Filed: 06/23/2012
• Published: 11/21/2013
• Est. Priority Date: 05/16/2012
• Status: Abandoned Application

• Current Assignee: Azurewave Technologies, Inc.
• Original Assignee: Azurewave Technologies, Inc.
• Inventors: HSU, CHI-HSING
• Application Number:
  US13/531,498
• Publication Number:
  US 20130307105A1
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216

Abstract

An image-sensing module for reducing its whole thickness includes a substrate unit, a carrier unit, an image-sensing unit and a lens unit. The substrate unit includes a substrate body and a through opening passing through the substrate body. The carrier unit includes a carrier body disposed on the bottom surface of the substrate body and corresponding to the through opening. The image-sensing unit includes an image-sensing element disposed on the top surface of the carrier body and embedded in the through opening. The lens unit includes an opaque frame disposed on the top surface of the carrier body to surround the image-sensing element and a lens connected to the opaque frame and positioned above the image-sensing element. Hence, the whole thickness of the image-sensing module can be reduced due to the design of placing the substrate body, the image-sensing element and the opaque frame on the carrier body.

Claims

1. An image-sensing module for reducing its whole thickness, comprising:

a substrate unit including a substrate body and at least one through opening passing through the substrate body;

a carrier unit including a carrier body disposed on the bottom surface of the substrate body and corresponding to the at least one through opening, wherein the carrier body is electrically connected to the substrate body;

an image-sensing unit including at least one image-sensing element disposed on the top surface of the carrier body and embedded in the at least one through opening, wherein the at least one image-sensing element is electrically connected to the carrier body and surrounded by the substrate body; and

a lens unit including an opaque frame disposed on the top surface of the carrier body to surround the at least one image-sensing element and a lens connected to the opaque frame and positioned above the at least one image-sensing element.

2. The image-sensing module of claim 1, further comprising:

a first conductive unit and a second conductive unit, wherein the first conductive unit includes a plurality of first conductive elements electrically connected between the at least one image-sensing element and the carrier body, and the second conductive unit includes a plurality of second conductive elements electrically connected between the carrier body and the substrate body.

3. The image-sensing module of claim 2, wherein the carrier unit includes a plurality of first top conductive tracks disposed on the top surface of the carrier body, the image-sensing unit includes a plurality of conductive pads disposed on the top surface of the at least one image-sensing element and respectively corresponding to the first top conductive tracks, and each conductive pad of the image-sensing unit is electrically connected to each corresponding first top conductive track of the carrier unit through each corresponding first conductive element.

4. The image-sensing module of claim 3, wherein the substrate unit includes a plurality of second bottom conductive tracks disposed on the bottom surface of the substrate body and respectively corresponding to the first top conductive tracks, and each first top conductive track of the carrier unit is electrically connected to each corresponding second bottom conductive track of the substrate unit through each corresponding second conductive element.

5. The image-sensing module of claim 3, wherein the substrate unit includes a plurality of second bottom conductive tracks disposed on the bottom surface of the substrate body and respectively corresponding to the first top conductive tracks, a plurality of second top conductive tracks disposed on the top surface of the substrate body and respectively corresponding to the second bottom conductive tracks, and a plurality of second inner conductive channels embedded in the substrate body, each second inner conductive channel is electrically connected between each corresponding second bottom conductive track and each corresponding second top conductive track, and each first top conductive track of the carrier unit is electrically connected to each corresponding second bottom conductive track of the substrate unit through each corresponding second conductive element.

6. The image-sensing module of claim 3, wherein the substrate unit includes a plurality of second bottom conductive tracks disposed on the bottom surface of the substrate body and respectively corresponding to the first top conductive tracks, a plurality of second top conductive tracks disposed on the top surface of the substrate body and respectively corresponding to the second bottom conductive tracks, a plurality of second outer conductive tracks disposed on the bottom surface of the substrate body and respectively corresponding to the second top conductive tracks, a plurality of second inner conductive channels embedded in the substrate body, and a plurality of second outer conductive channels embedded in the substrate body, each second inner conductive channel is electrically connected between each corresponding second bottom conductive track and each corresponding second top conductive track, each second outer conductive channel is electrically connected between each corresponding second top conductive track and each corresponding second outer conductive track, and each first top conductive track of the carrier unit is electrically connected to each corresponding second bottom conductive track of the substrate unit through each corresponding second conductive element.

7. The image-sensing module of claim 2, wherein the carrier unit includes a plurality of first top conductive tracks disposed on the top surface of the carrier body, a plurality of first bottom conductive tracks disposed on the bottom surface of the carrier body and respectively corresponding to the first top conductive tracks, a plurality of first outer conductive tracks disposed on the top surface of the carrier body and respectively corresponding to the first bottom conductive tracks, a plurality of first inner conductive channels embedded in the carrier body, and a plurality of first outer conductive channels embedded in the carrier body, each first inner conductive channel is electrically connected between each corresponding first top conductive track and each corresponding first bottom conductive track, each first outer conductive channel is electrically connected between each corresponding first bottom conductive track and each corresponding first outer conductive track, the image-sensing unit includes a plurality of conductive pads disposed on the top surface of the at least one image-sensing element and respectively corresponding to the first top conductive tracks, and each conductive pad of the image-sensing unit is electrically connected to each corresponding first top conductive track of the carrier unit through each corresponding first conductive element.

8. The image-sensing module of claim 7, wherein the substrate unit includes a plurality of second bottom conductive tracks disposed on the bottom surface of the substrate body and respectively corresponding to the first top conductive tracks, and each first top conductive track of the carrier unit is electrically connected to each corresponding second bottom conductive track of the substrate unit through each corresponding second conductive element.

9. The image-sensing module of claim 7, wherein the substrate unit includes a plurality of second bottom conductive tracks disposed on the bottom surface of the substrate body and respectively corresponding to the first top conductive tracks, a plurality of second top conductive tracks disposed on the top surface of the substrate body and respectively corresponding to the second bottom conductive tracks, and a plurality of second inner conductive channels embedded in the substrate body, each second inner conductive channel is electrically connected between each corresponding second bottom conductive track and each corresponding second top conductive track, and each first top conductive track of the carrier unit is electrically connected to each corresponding second bottom conductive track of the substrate unit through each corresponding second conductive element.

10. The image-sensing module of claim 7, wherein the substrate unit includes a plurality of second bottom conductive tracks disposed on the bottom surface of the substrate body and respectively corresponding to the first top conductive tracks, a plurality of second top conductive tracks disposed on the top surface of the substrate body and respectively corresponding to the second bottom conductive tracks, a plurality of second outer conductive tracks disposed on the bottom surface of the substrate body and respectively corresponding to the second top conductive tracks, a plurality of second inner conductive channels embedded in the substrate body, and a plurality of second outer conductive channels embedded in the substrate body, each second inner conductive channel is electrically connected between each corresponding second bottom conductive track and each corresponding second top conductive track, each second outer conductive channel is electrically connected between each corresponding second top conductive track and each corresponding second outer conductive track, and each first top conductive track of the carrier unit is electrically connected to each corresponding second bottom conductive track of the substrate unit through each corresponding second conductive element.