METHOD TO RESOLVE HOLLOW METAL DEFECTS IN INTERCONNECTS
First Claim
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1. The method of repairing an interconnect, the method comprising:
- forming a mask;
opening the mask over a first portion of an interconnect and over a dielectric layer adjacent the first portion of the interconnect thereby forming a recess in the dielectric layer;
forming a local metal cap on the first portion of the interconnect; and
forming a dielectric cap.
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Abstract
A method of repairing hollow metal void defects in interconnects and resulting structures. After polishing interconnects, hollow metal void defects become visible. The locations of the defects are largely predictable. A repair method patterns a mask material to have openings over the interconnects (and, sometimes, the adjacent dielectric layer) where defects are likely to appear. A local metal cap is formed in the mask openings to repair the defect. A dielectric cap covers the local metal cap and any recesses formed in the adjacent dielectric layer.
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Citations
20 Claims
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1. The method of repairing an interconnect, the method comprising:
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forming a mask; opening the mask over a first portion of an interconnect and over a dielectric layer adjacent the first portion of the interconnect thereby forming a recess in the dielectric layer; forming a local metal cap on the first portion of the interconnect; and forming a dielectric cap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A structure comprising:
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an interconnect having a first portion wherein the first portion has a local metal cap; a dielectric layer adjacent the interconnect, wherein the dielectric layer has a recess abutting the first portion of the interconnect. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A structure comprising:
an interconnect having a first portion and a second portion, wherein the first portion has a local metal and the second portion lacks a local metal.
Specification