CARBOXYL GROUP-CONTAINING POLYIMIDE, THERMOSETTING RESIN COMPOSITION AND FLEXIBLE METAL-CLAD LAMINATE

• US 20130310486A1
• Filed: 05/30/2012
• Published: 11/21/2013
• Est. Priority Date: 05/31/2011
• Status: Active Grant

• Current Assignee: Toyobo Company Limited
• Original Assignee: Toyobo Company Limited
• Inventors: Kawakusu, Tetsuo
• Granted Patent: US 9,365,717 B2
• Time in Patent Office: Days
• US Class Current: 523/451
• CPC Class Codes: C08G 18/346 having four carboxylic acid groups
• CPC Class Codes: C08G 18/7621 being toluene diisocyanate including isomer mixtures
• CPC Class Codes: C08G 18/7671 containing only one alkylene bisphenyl group
• CPC Class Codes: C08G 73/1035 from tetracarboxylic acids or derivatives and diisocyanates
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Abstract

The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide.

Claims

1-19. -19. (canceled)

20. A thermosetting resin composition to be used as a resist layer of a printed circuit board which is characterized in that it contains a carboxyl group-containing polyimide and an oxirane ring-containing compound, and in that said carboxyl group-containing polyimide has such a structure where the chain of a terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound, wherein said terminal acid anhydride group-containing imide prepolymer has been produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound.

21. The thermosetting resin composition according to claim 20, wherein the using amount of an oxirane ring-containing compound is 2 to 100 parts by weight to 100 parts by weight of the carboxyl group-containing polyimide.

22. The thermosetting resin composition according to claim 20, wherein it further contains a phosphorus atom-containing organic filler.

23. The thermosetting resin composition according to claim 22, wherein the ratio by weight of the carboxyl group-containing polyimide, the oxirane ring-containing compound and the phosphorus atom-containing organic filler is 30 to 95/1 to 50/2 to 55.

24. The thermosetting resin composition according to claim 22, wherein the total weight of the carboxyl group-containing polyimide, the oxirane ring-containing compound and the phosphorus atom-containing organic filler in the thermosetting resin composition is not less than 20% by weight.

25. The thermosetting resin composition according to claim 20, wherein it further contains a curing promoter.