SUBSTRATE-BONDING APPARATUS FOR DISPLAY DEVICE AND METHOD FOR MANUFACTURING BONDED SUBSTRATE

• US 20130312907A1
• Filed: 11/19/2012
• Published: 11/28/2013
• Est. Priority Date: 05/23/2012
• Status: Abandoned Application

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: OH, Jae Young, LEE, Dae Hoon, JO, Jae Duk, LEE, Jae Won, PARK, Young Kwang, KWON, Ki Hyun
• Application Number:
  US13/681,015
• Publication Number:
  US 20130312907A1
• Time in Patent Office: Days
• US Class Current: 156/285
• CPC Class Codes: B32B 2037/0092 in which absence of adhesives is explicitly presented as an advantage
• CPC Class Codes: B32B 2309/12 Pressure
• CPC Class Codes: B32B 2309/68 Vacuum
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 37/003 to avoid air inclusion
• CPC Class Codes: B32B 38/1858 using vacuum
• CPC Class Codes: B32B 38/1866 conforming the layers or laminate to a convex or concave profile

Abstract

A substrate-bonding apparatus for a display device, and which includes a chamber unit configured to bond a carrier substrate to a substrate for manufacturing the display device; a first surface plate provided inside the chamber unit and configured to support the substrate; a supporting unit provided inside the chamber unit and configured bring the carrier substrate into contact with the substrate supported by the first surface plate; and a pressure-adjusting unit communicating with the chamber unit and configured to change a vacuum pressure from a low vacuum pressure to a high pressure in multiple steps inside the chamber unit while the carrier substrate is brought into contact with the substrate to bond the carrier substrate to the substrate without adhesive material between the carrier substrate and the substrate.

Claims

1. A substrate-bonding apparatus for a display device, the apparatus comprising:

a chamber unit configured to bond a carrier substrate to a substrate for manufacturing the display device;

a first surface plate provided inside the chamber unit and configured to support the substrate;

a supporting unit provided inside the chamber unit and configured bring the carrier substrate into contact with the substrate supported by the first surface plate; and

a pressure-adjusting unit communicating with the chamber unit and configured to change a vacuum pressure from a low vacuum pressure to a high pressure in multiple steps inside the chamber unit while the carrier substrate is brought into contact with the substrate to bond the carrier substrate to the substrate without adhesive material between the carrier substrate and the substrate.

2. The substrate-bonding apparatus according to claim 1, wherein the supporting unit includes a supporting member having a hollow portion allowing a first area of the carrier substrate to protrude towards the substrate and contact the substrate before a second area corresponding to a remaining area except the first area of the carrier substrate contacts the substrate.

3. The substrate-bonding apparatus according to claim 2, further comprising:

an elevating unit configured to raise and lower the supporting member supporting the carrier substrate; and

a moving unit configured to move the supporting member towards and away from the carrier substrate,

wherein the elevating unit lowers the supporting member to bring the first area protruding through the hollow porting into contact with the substrate supported by the first surface plate, and

wherein the moving unit moves the supporting member away from the carrier substrate when the first area contacts the substrate so that the second area is gradually brought into contact with the substrate.

4. The substrate-bonding apparatus according to claim 2, wherein the supporting member includes a diagonal member having a gradually-decreased thickness toward the hollow portion so the first area of the carrier substrate sags by its own weight and simultaneously protrudes through the hollow portion.

5. The substrate-bonding apparatus according to claim 1, further comprising:

a suction unit communicating with the chamber unit and configured to provide a suction force so as to attach the carrier substrate to the supporting unit,

wherein the suction unit adjusts the suction force to make a pressure between the carrier substrate and the supporting unit gradually increase from a first area of the carrier substrate to a second area excluding the first area so that the first area of the carrier substrate first contacts the substrate and then a second area of the carrier substrate is brought into contact with the substrate, and

wherein the pressure-adjusting unit increases the lower vacuum pressure to the higher vacuum pressure in multiple steps inside the chamber unit so as to make the first area first separated from the supporting unit before the second area is separated from the supporting unit.

6. The substrate-bonding apparatus according to claim 1, wherein the chamber unit includes at least one exhaust hole formed at a wall of the chamber unit, and

wherein the pressure-adjusting unit is connected with the at least one exhaust hole so as to change the vacuum pressure inside the chamber unit by discharging gas through both sides of a gap between the substrate and the carrier substrate.

7. The substrate-bonding apparatus according to claim 1, further comprising:

a rotating unit disposed between the first surface plate and the supporting unit and configured to rotate the first surface plate and the supporting unit in opposite directions so that a first area of the carrier substrate first contacts the substrate and then a second area of the carrier substrate excluding the first area contacts the substrate supported by the first surface plate.

8. The substrate-bonding apparatus according to claim 1, wherein the supporting unit includes:

an attaching unit movably provided in the supporting unit and configured to be attached to the carrier substrate; and

a first elevating device connected to the attaching unit and configured to lower and raise the attaching unit,

wherein the first elevating device raises the attaching unit to be retreated to the inside of the supporting unit so that the carrier substrate separated from the attaching unit falls freely toward the substrate supported by the first surface plate.

9. The substrate-bonding apparatus according to claim 8, wherein the first elevating device raises the attaching unit to a contact position where the carrier substrate is brought into contact with the supporting unit, and then continues to raise the attaching unit to a retreat position inside of the supporting unit, and

wherein the supporting includes a retreat groove into which the attaching unit raised to the retreat position is inserted.

10. The substrate-bonding apparatus according to claim 8, wherein the attaching unit includes an attaching member and an attaching pin connecting the elevating device with the attaching member, and

wherein the attaching member includes an adhesive rubber configured to attach the carrier substrate to the attaching unit.

11. The substrate-bonding apparatus according to claim 8, wherein the attaching unit includes an attaching member and an attaching pin connecting the elevating device with the attaching member, and

wherein the attaching member includes an electrode configured to attach the carrier substrate to the attaching member using an electrostatic force.

12. The substrate-bonding apparatus according to claim 8, wherein the supporting unit includes a diaphragm, a pushing member configured to push the diaphragm, and a second elevating device configured to raise and lower the pushing member,

wherein the pushing member brings the diaphragm into surface-contact with the carrier substrate, and

wherein the second elevating device lowers the pushing member to a position where the carrier substrate is separated from the attaching unit and is separated from the substrate supported by the first surface place.

13. A method of bonding a carrier substrate and a substrate for a display device, the method comprising:

supporting, via a first surface plate provided inside the chamber unit, the substrate;

bringing, via using a supporting unit provided inside the chamber unit, the carrier substrate into contact with the substrate supported by the first surface plate; and

changing, via a pressure-adjusting unit communicating with the chamber unit, a vacuum pressure from a low vacuum pressure to a high pressure in multiple steps inside the chamber unit while the carrier substrate is brought into contact with the substrate to bond the carrier substrate to the substrate without adhesive material between the carrier substrate and the substrate.

14. The method according to claim 13, wherein the bringing step further comprises:

allowing, via a supporting member having a hollow portion in the supporting unit, a first area of the carrier substrate to protrude towards the substrate and contact the substrate before a second area corresponding to a remaining area except the first area of the carrier substrate contacts the substrate.

15. The method according to claim 14, wherein the bringing step further comprises:

raising and lowering, via an elevating unit, the supporting member supporting the carrier substrate; and

moving, via a moving unit, the supporting member towards and away from the carrier substrate,

wherein the elevating unit lowers the supporting member to bring the first area protruding through the hollow porting into contact with the substrate supported by the first surface plate, and

wherein the moving unit moves the supporting member away from the carrier substrate when the first area contacts the substrate so that the second area is gradually brought into contact with the substrate.

16. The method according to claim 13, wherein the bringing step further comprises:

providing, via a suction unit communicating with the chamber unit, a suction force so as to attach the carrier substrate to the supporting unit;

adjusting, via the suction unit, the suction force to make a pressure between the carrier substrate and the supporting unit gradually increase from a first area of the carrier substrate to a second area excluding the first area so that the first area of the carrier substrate first contacts the substrate and then a second area of the carrier substrate is brought into contact with the substrate; and

increasing, via the pressure-adjusting unit, the lower vacuum pressure to the higher vacuum pressure in multiple steps inside the chamber unit so as to make the first area first separated from the supporting unit before the second area is separated from the supporting unit.

17. The method according to claim 13, wherein the bringing step further comprises:

rotating, via a rotating unit disposed between the first surface plate and the supporting unit, the first surface plate and the supporting unit in opposite directions so that a first area of the carrier substrate first contacts the substrate and then a second area of the carrier substrate excluding the first area contacts the substrate supported by the first surface plate.

18. The method according to claim 13,

wherein the supporting step further comprises attaching, via a attaching unit of the supporting unit, the carrier substrate;

wherein the bringing step further comprises separating the carrier substrate from the attaching unit; and

wherein the separating step further comprises raising, via a first elevating device connected to the attaching unit and configured to lower and raise the attaching unit, the attaching unit so as to make the attaching unit retreated to the inside of the supporting unit.

19. The method according to claim 18, wherein the separating step further comprises:

raising, via the first elevating device, the attaching unit to a contact position where the carrier substrate is brought into contact with the supporting unit, and

raising, via the first elevating device, the attaching unit to a retreat position inside of the supporting unit.

20. The method according to claim 18, wherein the separating step further comprises:

lowering, via a second elevating device configured to raise and lower a pushing member, the pushing member for pushing a diaphragm so as to make the diaphragm push the carrier substrate in a surface-contact state; and

stopping, via the second elevating device, the pushing member when the carrier substrate is separated from the attaching unit and is separated from the substrate supported by the first surface place.