WAFER LEVEL PACKAGE RESISTANCE MONITOR SCHEME
First Claim
Patent Images
1. An integrated circuit, comprising:
- a monitoring circuit;
a monitored circuit connected with the monitoring circuit; and
the monitoring circuit operable to determine during fabrication if a resistance of a connection between an in-fab redistribution layer connector and a post-fab redistribution layer connector exceeds a threshold.
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Accused Products
Abstract
An integrated circuit includes a monitoring circuit and a monitored circuit connected with the monitoring circuit. The monitoring circuit is operable to determine during fabrication if a resistance of a connection between an in-fab redistribution layer connector and a post-fab redistribution layer connector exceeds a threshold.
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Citations
20 Claims
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1. An integrated circuit, comprising:
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a monitoring circuit; a monitored circuit connected with the monitoring circuit; and the monitoring circuit operable to determine during fabrication if a resistance of a connection between an in-fab redistribution layer connector and a post-fab redistribution layer connector exceeds a threshold. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An integrated circuit, comprising:
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an in-fab redistribution layer connector; a post-fab redistribution layer connector connected with the in-fab redistribution layer connector to make an electrical connection; an oxide layer located between the in-fab redistribution layer connector and the post-fab redistribution layer connector, the oxide layer providing a connector resistance to the electrical connection; and a monitoring circuit connected with the oxide layer, the monitoring circuit to determine if a resistance between the in-fab redistribution layer connector and the post-fab redistribution layer caused by the oxide layer exceed a threshold. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A monitoring circuit for an integrated circuit, comprising:
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an in-fab trace; a post-fab trace connected with the in-fab trace; an oxide layer positioned between the in-fab trace and the post-fab trace; and a fuse trace connected with the in-fab trace, where the fuse trace is operable to break if a resistance caused by the oxide layer exceeds a threshold. - View Dependent Claims (18, 19, 20)
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Specification