OVER-CURRENT PROTECTION FUSES

• US 20130314201A1
• Filed: 05/23/2012
• Published: 11/28/2013
• Est. Priority Date: 05/23/2012
• Status: Abandoned Application

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Inventors: Tan, Leng Hoo, Poh, Tzye Perng, Ng, Kah Hoe
• Application Number:
  US13/478,239
• Publication Number:
  US 20130314201A1
• Time in Patent Office: Days
• US Class Current: 337/297
• CPC Class Codes: H01H 69/022 of printed circuit fuses
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits
• CPC Class Codes: Y10T 29/49107 Fuse making

Abstract

A method of forming a fusible link on a printed circuit board. The method comprises integrally forming a first end pad, a second end pad, and a fusible link between the first and the second end pads on the printed circuit board; wherein the cross-sectional area of the fusible link is smaller than that of the first and second end pads.

Claims

1. An over-current protection fuse comprising a current fusible link deposited on an insulating substrate.

2. An over-current protection fuse according to claim 1, wherein the fusible link is a fuse track extending between two end pads which are deposited on the insulating substrate, and the width of the fuse track being smaller than that of the end pads.

3. An over-current protection fuse according to claim 2, wherein the two end pads are spaced such that end terminals of a discrete fuse device are mountable or solderable on the two end pads to provide a backup current path between the two end pads.

4. An over-current protection fuse according to claim 3, wherein conductive brackets for detachably mounting a discrete fuse are formed on the two end pads, the discrete fuse providing a backup current path between the two end pads when mounted on the conductive brackets.

5. An over-current protection fuse according to claim 1, wherein the insulating substrate is made of alumina, silica, glass-polytetrafluoroethylene (PTFE), impregnated paper, woven fiber glass, or materials suitable for forming a printed circuit board.

6. An over-current protection fuse according to claim 1, wherein the fusible link is integrally formed on a printed circuit board.

7. An over-current protection fuse according to claim 6, wherein the fusible link is formed as an integral part of printed circuit traces on the printed circuit board.

8. An over-current protection fuse according to claim 6, wherein the fusible link comprises a fusible track extending between two end pads, the fusible track having a cross sectional area that is smaller from the cross sectional area of the end pads.

9. An over-current protection fuse according to claim 6, wherein the fusible link comprises a fusible track extending between two end pads, the fusible track having a thickness that is smaller than the thickness of the two end pads.

10. An over-current protection fuse according to claim 6, wherein the fusible link provides serial electrical connection between first and second printed end portions on the printed circuit board, and wherein first and second fuse mounting brackets are provided respectively on the first and second printed end portions for receiving end terminals of a discrete fuse, and wherein a current path is established between the first and second printed end portions when a discrete fuse is mounted on the fuse mounting brackets after the fusible link between the first and second printed electronic circuit portions has broken.

11. An over-current protection fuse according to claim 6, wherein the fusible link is between layers of printed circuit board substrate.

12. A printed circuit board comprising an over-current protection fuse according to claim 1.

13. An electronic apparatus comprising a printed circuit board according to claim 12.

14. A method of forming a fusible link on a printed circuit board, the method comprising integrally forming a first end pad, a second end pad, and a fusible link between the first and the second end pads on the printed circuit board;

wherein the cross-sectional area of the fusible link is smaller than that of the first and second end pads.

15. A method according to claim 14, wherein the fusing properties of the fusible link is I=0.188A/t^0.5, where I is the fusing current rating, A is the cross sectional area in mils, and t is the time to melt.