Circuit Board, LED Light Strip and Method for Making the LED Light Strip

• US 20130314910A1
• Filed: 05/31/2012
• Published: 11/28/2013
• Est. Priority Date: 05/22/2012
• Status: Abandoned Application

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Huang, Chong, Hsiao, Yu-chun, Kuo, Yi-cheng
• Application Number:
  US13/519,352
• Publication Number:
  US 20130314910A1
• Time in Patent Office: Days
• US Class Current: 362/218
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

The present invention discloses a printed circuit board, a LED light strip and a method for making the LED light strip. A LED light source is disposed on the printed circuit board, and at least a portion thereof is covered with a layer of white heat dissipating paint. By way of this arrangement, the printed circuit board is partially deployed with a layer of heat dissipating material so as to increase the heat dissipation thereof. As a result, the heat built-up from LED light source on the printed circuit board can be effectively dissipated.

Claims

1. An LED light strip, characterized in that the LED light strip includes a printed circuit, and a LED light source disposed on the printed circuit board, the printed circuit board is a metal core printed circuit board, and at least a portion thereof is covered with a layer of white heat dissipating paint.

2. The LED light strip as recited in claim 1, characterized in that the layer of white heat dissipation paint is deployed on a surface in which the LED light source is mounted.

3. The LED light strip as recited in claim 1, characterized in that the surface area of the printed circuit board is completely deployed with white heat dissipating paint.

4. The LED light strip as recited in claim 1, characterized in that at least a portion of the LED light source is covered with the white heat dissipating paint.

5. The LED light strip as recited in claim 4, characterized in that the LED light source includes a bracket, a LED chip disposed on the bracket, and lead frame disposed on the bracket and interconnected with the LED chip, wherein the white heat dissipating paint is deployed onto the surfaces of the bracket and the lead frame.

6. A printed circuit board used for fixing a LED light source thereon, characterized in that at least a portion of the printed circuit board is deployed with a layer of heat dissipation material.

7. The LED light strip as recited in claim 6, characterized in that the printed circuit board is a metal core printed circuit board.

8. The LED light strip as recited in claim 6, characterized in that the layer of white heat dissipation paint is deployed on a surface in which the LED light source is mounted.

9. The LED light strip as recited in claim 6, characterized in that the surface area of the printed circuit board is completely deployed with white heat dissipating paint.

10. A method for making a LED light strip, characterized in that the method includes the steps of:

1) deploying a layer of heat dissipating material over at least a portion of a printed circuit board; and

2) mounting the LED source onto the printed circuit board.