SENSOR ASSEMBLY

• US 20130315036A1
• Filed: 05/23/2012
• Published: 11/28/2013
• Est. Priority Date: 05/23/2012
• Status: Active Grant

• Current Assignee: Reflection Marine Norge AS
• Original Assignee: WesternGeco LLC
• Inventors: Paulson, Hans, Husom, Vidar A., Goujon, Nicolas
• Granted Patent: US 9,103,930 B2
• Time in Patent Office: Days
• US Class Current: 367/153
• CPC Class Codes: B81B 2207/09 Packages
• CPC Class Codes: G01V 1/184 Multi-component geophones
• CPC Class Codes: G01V 1/20 Arrangements of receiving elements, e.g. geophone pattern
• CPC Class Codes: G01V 1/38 specially adapted for water-covered areas G01V1/28 takes precedence
• CPC Class Codes: G01V 1/3808 Seismic data acquisition, e.g. survey design
• CPC Class Codes: G10K 11/006 Transducer mounting in underwater equipment, e.g. sonobuoys
• CPC Class Codes: H01L 23/02 Containers; Seals H01L23/12, H01L23/34, H01L23/48, H01L23/552, H01L23/66 take precedence; for memories G11C
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A multiple axis sensor assembly includes an enclosure and encapsulated microelectromechanical system (MEMS) sensors. The encapsulated sensors are disposed inside the enclosure and are mounted in different orientations, which correspond to different axes of the sensor assembly. A controller of the sensor assembly is disposed in the enclosure and electrically coupled to the MEMS sensors.

Claims

1. A multiple axis sensor assembly, comprising:

an enclosure;

encapsulated microelectromechanical system (MEMS) sensors, the encapsulated sensors being disposed inside the enclosure and mounted in different orientations corresponding to different axes of the sensor assembly; and

a controller disposed in the enclosure and electrically coupled to the MEMS sensors.

2. The method of claim 1, wherein the MEMS sensors are identical.

3. The method of claim 1, wherein

a first MEMS sensor of the MEMS sensors comprises a face having electrical connection terminals,

a second MEMS sensor of the MEMS sensors comprises a face having electrical connection terminals,

the face of the first MEMS sensor is mounted to the enclosure, and

a face other than the face of the second MEMS sensor is mounted to the enclosure.

4. The method of claim 3, further comprising a right angle connector to electrically couple the second MEMS sensor to the controller.

5. The method of claim 1, wherein the enclosure comprises at least one conductive layer, further comprising wire bonding to electrically couple the MEMS sensors to the at least one conductive layer.

6. The method of claim 1, wherein the enclosure comprises a tray comprising an opening to receive the MEMS sensors and a lid to close the opening.

7. The method of claim 6, wherein the lid is hermetically sealed to the tray, the assembly further comprising a gas charge disposed inside the enclosure.