LIGHTING DEVICE

• US 20130320365A1
• Filed: 01/26/2012
• Published: 12/05/2013
• Est. Priority Date: 02/14/2011
• Status: Active Grant

• Current Assignee: LEDVANCE GmbH (MLS Co. Ltd.)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Breidenassel, Nicole, Eckert, Klaus, Hoechtl, Johannes, Streppel, Henrike
• Granted Patent: US 10,290,791 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 17/164 the parts being subjected to bending, e.g. snap joints
• CPC Class Codes: F21V 29/506 of globes, bowls or cover glasses
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A lighting device includes a heat sink, through which air can flow transversely to its longitudinal extension and a plurality of semiconductor light sources, in particular light-emitting diodes, arranged on the heat sink, wherein at least two of the semiconductor light sources are aligned in different directions.

Claims

1. A lighting device, comprising:

a heat sink, through which air can flow transversely to its longitudinal extension and

a plurality of semiconductor light sources arranged on the heat sink,

wherein at least two of the semiconductor light sources are aligned in different directions.

2. The lighting device as claimed in claim 1, wherein

the lighting device has a light-transmissive cover for covering the semiconductor light sources and

a cooling structure of the heat sink, comprising a plurality of cooling struts, protrudes into a longitudinal section of the lighting device in which the cover is also located.

3. The lighting device as claimed in claim 2, wherein parts of the cooling structure of the heat sink and semiconductor light sources are arranged alternately in a circumferential direction of the lighting device.

4. The lighting device as claimed in claim 2, wherein

the heat sink has a front support region for arranging at least one of the semiconductor light sources,

a plurality of cooling struts extend to the rear from the upper support region,

a plurality of lateral support regions for respectively at least one of the semiconductor light sources project from the upper support region,

wherein the upper support regions and the lateral support regions are aligned differently and

wherein the lateral support regions are arranged between respective cooling struts.

5. The lighting device as claimed in claim 2, wherein adjacent lateral support regions and cooling struts are connected to one another.

6. The lighting device as claimed in claim 4, wherein the cover overlaps the front support region and the lateral support regions while leaving the cooling struts free.

7. The lighting device as claimed in claim 4, wherein the cover has a plurality of tab-shaped regions, which each overlap one of the lateral support regions and which run together at a tip of the cover.

8. The lighting device as claimed in claim 4, wherein at least the front support region, at least a part of the cooling struts, and the lateral support regions are integrally connected to one another or form an integral part.

9. The lighting device as claimed in claim 8, wherein the heat sink is implemented in two parts.

10. The lighting device as claimed in claim 9, wherein the heat sink has outer cooling struts and inner cooling struts, wherein the outer cooling struts are arranged further to the outside in the radial direction than the inner cooling struts.

11. The lighting device as claimed in claim 2, wherein the cover can be latched onto the heat sink.

12. The lighting device as claimed in claim 1, wherein

the lighting device has a light-transmissive cover for covering the semiconductor light sources and

the lighting device has, in a longitudinal section of the lighting device, in which the cover is also located, at least one air passage, which allows an air flow through the lighting device in the longitudinal section substantially parallel to the longitudinal extension of the lighting device.

13. The lighting device as claimed in claim 1, wherein a housing region having a driver cavity is arranged at least partially inside a bulb space.

14. The lighting device as claimed in claim 13, wherein a thermally insulating layer is provided between a housing region, which has a driver cavity, and the heat sink.

15. The lighting device as claimed in claim 1, wherein the lighting device is a retrofit lamp.

16. The lighting device as claimed in claim 1, wherein the semiconductor light sources are light-emitting diodes.

17. The lighting device as claimed in claim 1, wherein the lighting device is an incandescent lamp retrofit lamp.