OPTOELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
First Claim
1. An optoelectronic device, comprising:
- a lead frame having a reflective structure, wherein the reflective structure has an opening;
an optoelectronic element disposed in the opening;
at least one electrode disposed in the lead frame and electrically connected to the optoelectronic element;
a lens disposed on the lead frame and comprising an adhesive portion having a holding surface, an alignment surface, and an adhesive surface, wherein the adhesive surface has a convex surface or a concave surface; and
a covering adhesive layer filling a region surrounded by the reflective structure and covering the optoelectronic element, wherein the lens is adhered to the lead frame through the adhesive portion of the lens.
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Accused Products
Abstract
According to an embodiment of the invention, an optoelectronic device is provided. The optoelectronic device includes: a lead frame having a reflective structure, wherein the reflective structure has an opening; an optoelectronic element disposed in the opening; at least one electrode disposed in the lead frame and electrically connected to the optoelectronic element; a lens disposed on the lead frame and having an adhesive portion having a holding surface, an alignment surface, and an adhesive surface, wherein the adhesive surface has a convex surface or a concave surface; and a covering adhesive layer filling a region defined by the reflective structure, covering the optoelectronic element, and adhering the lens to the lead frame through the adhesive portion of the lens.
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Citations
27 Claims
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1. An optoelectronic device, comprising:
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a lead frame having a reflective structure, wherein the reflective structure has an opening; an optoelectronic element disposed in the opening; at least one electrode disposed in the lead frame and electrically connected to the optoelectronic element; a lens disposed on the lead frame and comprising an adhesive portion having a holding surface, an alignment surface, and an adhesive surface, wherein the adhesive surface has a convex surface or a concave surface; and a covering adhesive layer filling a region surrounded by the reflective structure and covering the optoelectronic element, wherein the lens is adhered to the lead frame through the adhesive portion of the lens. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12)
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2. The optoelectronic device as claimed in claim I, wherein the reflective structure comprises plastics, silicone resin, epoxy resin, multiple coatings, polymer materials, ceramic materials, semiconductor materials, metal materials, or combinations thereof.
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3. The optoelectronic device as claimed in claim I, wherein the holding surface is in direct contact with a surface of the reflective structure, the alignment surface is in direct contact with a sidewall of the reflective structure, and the covering adhesive layer is in direct contact with the adhesive surface of the lens.
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13. An optoelectronic device, comprising:
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a lead frame having a reflective structure, wherein the reflective structure has an opening; an optoelectronic element disposed in the opening; at least one electrode disposed in the lead frame and electrically connected to the optoelectronic element; a lens disposed on the lead frame and comprising an adhesive portion having a holding surface, an alignment surface, and an adhesive surface, wherein the adhesive surface has an adhesive sidewall, and an adhesive bottom surface; and a covering adhesive layer filling a region surrounded by the reflective structure and covering the optoelectronic element, wherein the lens is adhered to the lead frame through the adhesive portion of the lens. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A manufacturing method of an optoelectronic device, comprising:
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providing a lead frame; disposing an optoelectronic element on the lead frame; filling a covering adhesive layer in a region surrounded by the reflective structure, wherein the covering adhesive layer covers the optoelectronic element; disposing a lens on an opening of the lead frame and the covering adhesive layer, wherein the lens comprises a holding surface, an alignment surface and an adhesive surface, and the adhesive surface has a convex surface or a concave surface; and curing the covering adhesive layer. - View Dependent Claims (24)
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25. A manufacturing method of an optoelectronic device, comprising:
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providing a lead frame; disposing an optoelectronic element on the lead frame; filling a covering adhesive layer in a region surrounded by the reflective structure, wherein the covering adhesive layer covers the optoelectronic element; disposing a lens on an opening of the lead frame and the covering adhesive layer, wherein the lens comprises a holding surface, an alignment surface and an adhesive surface, wherein the adhesive surface has an adhesive sidewall and an adhesive bottom surface; and curing the covering adhesive layer. - View Dependent Claims (26, 27)
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Specification