METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
First Claim
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1. An electrical device comprising:
- a first electrode;
a second electrode; and
a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure and wherein said printable semiconductor element provides a fill factor between said first and second electrodes greater than or equal to about 20%.
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Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
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Citations
71 Claims
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1. An electrical device comprising:
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a first electrode; a second electrode; and a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure and wherein said printable semiconductor element provides a fill factor between said first and second electrodes greater than or equal to about 20%. - View Dependent Claims (2, 3, 4, 5)
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6-35. -35. (canceled)
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36. A method for assembling a printable semiconductor element on a receiving surface of a substrate, said method comprising the steps of:
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providing said printable semiconductor element comprising a unitary inorganic semiconductor structure; contacting said printable semiconductor element with a conformable transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor element binds said printable semiconductor element to said contact surface, thereby forming said contact surface having said printable semiconductor element disposed thereon; contacting said printable semiconductor element disposed on said contact surface with said receiving surface of said substrate; and separating said contact surface of said conformable transfer device and said printable semiconductor element, wherein said printable semiconductor element is transferred onto said receiving surface, thereby assembling said printable semiconductor element on said receiving surface of said substrate. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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48-67. -67. (canceled)
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68. A method for fabricating a printable semiconductor element connected to a mother wafer via one or more alignment maintaining elements, said method comprising the steps of:
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providing said mother wafer having an external surface, said wafer comprising an inorganic semiconductor material; masking a selected region of said external surface by applying a mask; etching said external surface of said wafer, thereby generating a relief structure and at least one exposed surface of said wafer, wherein said relief structure has a masked side and one or more unmasked sides; etching said exposed surfaces of said wafer; and stopping etching of said exposed surfaces so that complete release of said relief structure is prevented, thereby fabricating said printable semiconductor element connected to a mother wafer via one or more alignment maintaining elements. - View Dependent Claims (69, 70)
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71-87. -87. (canceled)
Specification