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METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS

  • US 20130320503A1
  • Filed: 03/13/2013
  • Published: 12/05/2013
  • Est. Priority Date: 06/04/2004
  • Status: Active Grant
First Claim
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1. An electrical device comprising:

  • a first electrode;

    a second electrode; and

    a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure and wherein said printable semiconductor element provides a fill factor between said first and second electrodes greater than or equal to about 20%.

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