COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY

• US 20130321237A1
• Filed: 09/11/2012
• Published: 12/05/2013
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Bryan P. Kiple, David A. Pakula, Tang Y. Tan
• Inventors: Woodhull, Charles B., Pakula, David A., Tan, Tang Y., Weber, Douglas Joseph, Prest, Christopher D., Kiple, Bryan P., Memering, Dale N.
• Granted Patent: US 9,578,769 B2
• Time in Patent Office: Days
• US Class Current: 343/872
• CPC Class Codes: B23C 2220/04 Milling with the axis of the cutter inclined to the surface being machined
• CPC Class Codes: B23C 2220/16 Chamferring
• CPC Class Codes: B23C 2220/20 Deburring
• CPC Class Codes: B23C 2220/28 Finishing
• CPC Class Codes: B23C 2220/48 Methods of milling not otherwise provided for
• CPC Class Codes: B23C 2226/31 Diamond
• CPC Class Codes: B23C 2226/315 polycrystalline [PCD]
• CPC Class Codes: B23C 5/00 Milling-cutters for cutting gear-teeth B23F21/12
• CPC Class Codes: B23C 5/1081 with permanently fixed cutting inserts B23C5/1018 and B23C5/1063 take precedence
• CPC Class Codes: B23P 11/00 Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00
• CPC Class Codes: B23P 17/00 Metal-working operations, not covered by a single other subclass or another group in this subclass
• CPC Class Codes: B23P 17/02 Single metal-working processes; Machines or apparatus therefor
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 11/022 Anodisation on selected surface areas
• CPC Class Codes: C25D 11/12 Anodising more than once, e.g. in different baths
• CPC Class Codes: C25D 11/246 for sealing layers
• CPC Class Codes: C25D 11/34 of metals or alloys not provided for in groups C25D11/04 - C25D11/32
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 : Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0254 : comprising one or a plurality of mechanically detachable modules
• CPC Class Codes: H04M 1/11 : Supports for sets, e.g. incorporating armrests
• CPC Class Codes: H05K 13/00 : Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/02 : Details
• CPC Class Codes: H05K 5/0217 : Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0243 : for decorative purposes
• CPC Class Codes: H05K 5/0247 : Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 : Covers
• CPC Class Codes: H05K 5/04 : Metal casings
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 29/47 : Burnishing
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 407/1906 : including holder [i.e., head] having seat for inserted tool
• CPC Class Codes: Y10T 409/300896 : with sensing of numerical information and regulation without mechanical connection between sensing means and regulated means [i.e., numerical control]
• CPC Class Codes: Y10T 409/303752 : Process
• CPC Class Codes: Y10T 409/30952 : with cutter holder

Abstract

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Claims

1. A method for forming a housing of an electronic device, the method comprising:

coupling cover plates to coupling members accessible via a backside of the housing of the electronic device with an adhesive;

placing the backside of the housing against a planar datum surface;

biasing the housing of the electronic device, including the cover plates, against the planar datum surface with one or more biasing mechanisms; and

allowing the adhesive to dry while the housing of the electronic device is biased against the planar datum surface.

2. The method of claim 1, wherein the adhesive is an epoxy.

3. The method of claim 1, wherein the backside of the housing comprises a planar outer surface of the electronic device, and wherein outer surfaces of the cover plates are flush with the planar outer surface of the electronic device after the adhesive dries.

4. The method of claim 1, wherein the planar datum surface is a flat surface external to the electronic device.

5. The method of claim 1, wherein the biasing mechanisms that bias the cover plates against the planar datum surface are inserted through holes formed in the coupling members.

6. The method of claim 1, wherein a separate biasing module controls each biasing mechanism.

7. A system for coupling cover plates to a housing of an electronic device, comprising:

a planar datum surface; and

a plurality of biasing mechanisms controlled by one or more biasing modules, wherein the biasing mechanisms are configured to bias at least one object towards the planar datum surface.

8. The system of claim 7, wherein the biasing mechanisms are configured to bias the cover plates and the housing of the electronic device against the planar datum surface.

9. The system of claim 8, wherein the cover plates and the housing each comprise at least one planar outer surface that is biased against the planar datum surface by the biasing mechanisms.

10. The system of claim 9, wherein the biasing mechanisms are configured to bias the housing and the cover plates for a period of time suitable for an adhesive for coupling the cover plates to the housing to dry.

11. The system of claim 8, wherein a separate biasing module controls each biasing mechanism.

12. The system of claim 8, wherein a single biasing module controls more than one biasing mechanism.

13. An electronic device comprising:

a housing;

an antenna disposed within the housing; and

a cover plate coupled to the housing proximate to the antenna, wherein the cover plate is transparent to light at frequencies used by the antenna for wireless communication, and wherein the cover plate is opaque to light at visible frequencies.

14. The electronic device of claim 13, wherein the cover plate comprises one of pigmented glass, ceramic glass, and sapphire.

15. The electronic device of claim 13, further comprising a cover glass coupled to a first side of the housing, wherein the cover plate is coupled to a second side of the housing opposite the first side.

16. The electronic device of claim 15, wherein the cover glass comprises 50% to 100% of a surface area of the first side.

17. The electronic device of claim 15, wherein the cover plate comprises 1% to 50% of a surface area of the second side.

18. The electronic device of claim 13, wherein at least one side of the cover plate is painted.

19. The electronic device of claim 15, further comprising a second cover plate coupled to the second side of the housing.

20. The electronic device of claim 13, wherein the second cover plate is transparent to light at frequencies used by a second antenna for wireless communication, and wherein the second cover plate is opaque to light at visible frequencies.

21. The electronic device of claim 13, wherein the frequencies used by the antenna for wireless communication are from about 500-6500 MHz.