POWER CONVERSION APPARATUS
First Claim
1. A power conversion apparatus having a configuration in which a filter capacitor accumulating direct-current power and a semiconductor device module performing a switching operation that converts the direct-current power accumulated in the filter capacitor to alternating-current power are electrically connected with each other through a laminated bus bar,wherein the laminated bus bar, in which a plurality of connection conductors are laminated through an insulator, has a heat radiating portion formed by exposing a conductor in a part of an area other than respective areas connecting to the semiconductor device module and the filter capacitor, andevery surface of the exposed conductor of the heat radiating portion is formed to be along a vertical direction.
1 Assignment
0 Petitions
Accused Products
Abstract
A filter capacitor accumulating direct-current power and a semiconductor device module performing a switching operation that converts the direct-current power accumulated in the filter capacitor to alternating-current power are electrically connected with each other through a laminated bus bar. The laminated bus bar has a first bus bar and a second bus bar in which a plurality of connection conductors are laminated through an insulator. The second bus bar is provided with heat radiating portions that are formed by exposing a part of the conductor in each flat plate surface.
12 Citations
8 Claims
-
1. A power conversion apparatus having a configuration in which a filter capacitor accumulating direct-current power and a semiconductor device module performing a switching operation that converts the direct-current power accumulated in the filter capacitor to alternating-current power are electrically connected with each other through a laminated bus bar,
wherein the laminated bus bar, in which a plurality of connection conductors are laminated through an insulator, has a heat radiating portion formed by exposing a conductor in a part of an area other than respective areas connecting to the semiconductor device module and the filter capacitor, and every surface of the exposed conductor of the heat radiating portion is formed to be along a vertical direction.
-
2. (canceled)
Specification