POLISHING COMPOSITION

• US 20130324015A1
• Filed: 02/20/2012
• Published: 12/05/2013
• Est. Priority Date: 02/21/2011
• Status: Active Grant

• Current Assignee: Fujimi Incorporated
• Original Assignee: Fujimi Incorporated
• Inventors: Asano, Hiroshi, Tamai, Kazusei, Okada, Yasunori
• Granted Patent: US 9,662,763 B2
• Time in Patent Office: Days
• US Class Current: 451/59
• CPC Class Codes: B24B 37/044 characterised by the composition of the lapping agent
• CPC Class Codes: C09G 1/02 containing abrasives or grinding agents abrasives as such C09K3/14; polishing of semi-conductors H01L
• CPC Class Codes: C09K 3/1463 Aqueous liquid suspensions
• CPC Class Codes: H01L 21/02024 Mirror polishing

Abstract

Provided is a polishing composition containing at least aluminum oxide abrasive grains and water, and having a pH of 8.5 or higher. The aluminum oxide abrasive grains have a specific surface area of 20 m²/g or less. It is preferable for the aluminum oxide abrasive grains to have an average secondary particle size of 0.1 μm or more and 20 μm or less. The polishing composition is used for polishing hard and brittle materials having a Vickers hardness of 1,500 Hv or higher, such as sapphire, silicon carbide, and gallium nitride.

Claims

1. A polishing composition used for polishing a hard and brittle material having a Vickers hardness of 1,500 Hv or higher, comprising at least aluminum oxide abrasive grains and water, wherein the polishing composition has a pH of 8.5 or higher, and wherein the aluminum oxide abrasive grains have a specific surface area of 20 m²/g or less.

2. The polishing composition according to claim 1, wherein the aluminum oxide abrasive grains have an average secondary particle size of 0.1 μ

m or more and 20 μ

m or less.

3. The polishing composition according to claim 1, wherein the hard and brittle material is sapphire, silicon carbide, or gallium nitride.

6. The polishing composition according to claim 2, wherein the hard and brittle material is sapphire, silicon carbide, or gallium nitride.

4. A polishing method comprising:

providing a hard and brittle material; and

polishing the hard and brittle material with a polishing composition, wherein the polishing composition contains at least aluminum oxide abrasive grains and water, wherein the polishing composition has a pH of 8.5 or higher, and wherein the aluminum oxide abrasive grains have a specific surface area of 20 m²/g or less.

5. A method for producing a polished substrate composed of a hard and brittle material, comprising:

providing a substrate composed of a hard and brittle material; and

polishing the substrate with a polishing composition, wherein the polishing composition contains at least aluminum oxide abrasive grains and water, wherein the polishing composition has a pH of 8.5 or higher, and wherein the aluminum oxide abrasive grains have a specific surface area of 20 m²/g or less.