GUIDE WIRE ARRANGEMENT, STRIP ARRANGEMENT AND METHODS OF FORMING THE SAME
First Claim
Patent Images
1. A guide wire arrangement, comprising:
- a strip;
a sensor being disposed on a first portion of the strip;
a chip being disposed next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip;
wherein the strip is folded at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions.
1 Assignment
0 Petitions
Accused Products
Abstract
A guide wire arrangement, a strip arrangement, a method of forming a guide wire arrangement, and a method of forming a strip arrangement are provided. The guide wire arrangement includes a strip; a sensor being disposed on a first portion of the strip; a chip being disposed next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip; wherein the strip is folded at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions.
24 Citations
44 Claims
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1. A guide wire arrangement, comprising:
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a strip; a sensor being disposed on a first portion of the strip; a chip being disposed next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip; wherein the strip is folded at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions. - View Dependent Claims (2, 3, 4, 5, 6, 9, 10, 11, 12, 14, 16, 18, 21, 22, 24, 25, 27)
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7. (canceled)
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8. (canceled)
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13. (canceled)
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15. (canceled)
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17. (canceled)
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19. (canceled)
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20. (canceled)
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23. (canceled)
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26. (canceled)
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28. A method of forming a guide wire arrangement, the method comprising:
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providing a strip; disposing a sensor on a first portion of the strip; disposing a chip next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip; folding the strip at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions.
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29-42. -42. (canceled)
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43. A strip arrangement, comprising:
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a strip having a first surface and a second surface; at least one first wire being disposed on the second surface of the strip and electrically connected to the strip via a through-hole formed in the strip; at least one second wire being disposed on the first surface of the strip and electrically connected to the strip.
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44-53. -53. (canceled)
Specification