PACKAGE STRUCTURE OF OPTICAL APPARATUS
First Claim
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1. A package structure of an optical apparatus, comprising:
- a substrate;
a light emitting device for emitting light, the light emitting device being disposed on the substrate;
a light sensing device disposed on the substrate, for receiving light reflected by an object, wherein the light sensing device is a chip scale package (CSP) device; and
a light barrier member, which is disposed around a periphery of the light sensing device.
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Abstract
The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.
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15 Claims
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1. A package structure of an optical apparatus, comprising:
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a substrate; a light emitting device for emitting light, the light emitting device being disposed on the substrate; a light sensing device disposed on the substrate, for receiving light reflected by an object, wherein the light sensing device is a chip scale package (CSP) device; and a light barrier member, which is disposed around a periphery of the light sensing device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification