CHASSIS SYSTEM AND METHOD FOR HOLDING AND PROTECTING ELECTRONIC MODULES

• US 20130329372A1
• Filed: 06/11/2012
• Published: 12/12/2013
• Est. Priority Date: 06/11/2012
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Wilkins, Donald Frank
• Granted Patent: US 8,873,238 B2
• Time in Patent Office: Days
• US Class Current: 361/725
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A chassis system includes a body, a lid, a cavity, a backplane, and an electrically conductive connector. The lid is removably attached to the body such that when the lid is attached to the body a cavity within the body is completely enclosed by the body and the attached lid. The lid and the body are made of at least one material that does not allow electromagnetic waves to enter the cavity. The backplane is attached to the body or the lid. The electrically conductive connector is attached to the body or lid. The connector is in wired or wireless communication with the backplane for allowing electricity or data to flow between the electrically conductive connector and the backplane. The chassis system may be used to environmentally protect one or more electronic modules inserted into the cavity of the chassis system.

Claims

1. A chassis system comprising:

a body;

a lid removably attached to the body such that when the lid is attached to the body a cavity within the body is completely enclosed by the body and the attached lid, the lid and the body made of at least one material that does not allow electromagnetic waves to enter the cavity;

a backplane attached to the body or the lid; and

an electrically conductive connector attached to the body or lid, wherein the connector is in wired or wireless communication with the backplane for allowing electricity or data to flow between the electrically conductive connector and the backplane.

2. The chassis system of claim 1 wherein the lid or the body is thermally conductive.

3. The chassis system of claim 1 wherein the lid or the body is made of a metamaterial or a composite material.

4. The chassis system of claim 1 further comprising a plurality of spaced-apart thermally conductive rails attached to the body within the cavity.

5. The chassis system of claim 4 further comprising another thermally conductive rail extending between and in contact with the plurality of spaced-apart thermally conductive rails.

6. The chassis system of claim 4 further comprising at least one electronic module contained within the cavity between the plurality of spaced-apart thermally conductive rails and in contact with the backplane.

7. The chassis system of claim 1 further comprising at least one electronic module contained within the cavity and in contact with the backplane with the at least one electronic module in wireless communication with the backplane.

8. The chassis system of claim 7 wherein the at least one electronic module is at least partially enclosed within a thermally conductive shell.

9. The chassis system of claim 1 wherein the chassis system comprises a portion of a vehicle or aircraft.

10. The chassis system of claim 1 further comprising at least one metamaterial isolator attached to the lid or the body for reducing vibration of the chassis system.

11. The chassis system of claim 1 further comprising a thermoelectric layer and a shape memory alloy layer both attached to the lid or body, wherein the shape memory alloy layer generates heat when compressed and the thermoelectric layer converts the heat generated by the shape memory alloy layer into electricity.

12. A chassis system comprising:

a body;

a lid removably attached to the body such that when the lid is attached to the body a cavity within the body is completely enclosed by the body and the attached lid, the lid and the body made of at least one material that does not allow electromagnetic waves to enter the cavity;

a plurality of spaced-apart thermally conductive rails attached to the body within the cavity;

a backplane attached to the body or the lid;

at least one electronic module contained within the cavity between the plurality of spaced-apart thermally conductive rails and in contact with the backplane; and

an electrically conductive connector attached to the body or lid, wherein the electrically conductive connector is in wired or wireless communication with the backplane for allowing electricity or data to flow between the electrically conductive connector and the backplane.

13. The chassis system of claim 12 wherein the lid or the body is thermally conductive.

14. The chassis system of claim 12 wherein the lid or the body is made of a metamaterial or a composite material.

15. The chassis system of claim 12 wherein the at least one electronic module is at least partially enclosed within a thermally conductive shell.

16. A method of manufacturing a chassis comprising:

forming a chassis comprising a body, a cavity within the body, and a lid such that when the lid is attached to the body the cavity is completely enclosed by the body and the lid;

molding at least one electrical connector to the lid or the body;

molding at least one module securement member to the lid or the body;

attaching a backplane to the lid or the body; and

connecting, wired or wirelessly, the backplane to the at least one electrical connector to allow electricity or data to flow between the at least one electrical connector and the backplane.

17. The method of claim 16 further comprising forming the chassis using 3D printing.

18. The method of claim 16 further comprising forming the body and the lid out of at least one material that does not allow electromagnetic waves to enter the cavity.

19. The method of claim 16 further comprising forming the body or the lid out of a thermally conductive material.

20. The method of claim 16 further comprising forming the body or the lid out of a metamaterial or a composite material.

21. The method of claim 16 further comprising disposing at least one electronic module within the cavity such that it is secured by the at least one module securement member, is in contact with the backplane, and is in wireless communication with the backplane.

22. The method of claim 21 further comprising at least partially enclosing the electronic module within a thermally conductive shell.

23. The method of claim 16 further comprising installing the chassis in a vehicle.

24. The method of claim 16 further comprising attaching at least one metamaterial isolator to the lid or the body to reduce vibration of the chassis.

25. The method of claim 16 further comprising attaching a thermoelectric layer and a shape memory alloy layer to the lid or body, with the shape memory alloy layer configured to generate heat when compressed and the thermoelectric layer configured to convert the heat generated by the shape memory alloy layer into electricity.