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ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURING THE SAME

  • US 20130334683A1
  • Filed: 09/14/2012
  • Published: 12/19/2013
  • Est. Priority Date: 06/13/2012
  • Status: Active Grant
First Claim
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1. An electronic device package comprising:

  • a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post;

    an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and

    a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

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