MANUFACTURING CONTROL APPARATUS, MANUFACTURING CONTROL SYSTEM, AND MANUFACTURING CONTROL PROGRAM OF ELECTRONIC DEVICE

• US 20130338810A1
• Filed: 03/15/2013
• Published: 12/19/2013
• Est. Priority Date: 06/13/2012
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: HUANG, Linting
• Granted Patent: US 9,442,483 B2
• Time in Patent Office: Days
• US Class Current: 700/108
• CPC Class Codes: G05B 13/02 electric
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/32179 Quality control, monitor production tool with multiple sensors
• CPC Class Codes: G05B 2219/32191 Real time statistical process monitoring
• CPC Class Codes: G05B 2219/32201 Build statistical model of past normal proces, compare with actual process
• CPC Class Codes: G05B 23/024 Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
• CPC Class Codes: G06F 17/16 Matrix or vector computation , e.g. matrix-matrix or matrix-vector multiplication, matrix factorization matrix transposition G06F7/78
• CPC Class Codes: G06F 17/18 for evaluating statistical data , e.g. average values, frequency distributions, probability functions, regression analysis forecasting specially adapted for a specific administrative, business or logistic context G06Q10/04
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A manufacturing control apparatus of an electronic device is configured to implement processing to generate a first model function relating to a relationship between a characteristic of a component included in the electronic device. The apparatus is configured to implement processing to determine a first manufacturing condition value to obtain the characteristic of the component based on the first model function. The apparatus is configured to implement processing to calculate a squared prediction error of a measured value of the characteristic of the component. The apparatus is configured to implement processing to determine a second manufacturing condition value of the next electronic device according to the calculated squared prediction error.

Claims

1. A manufacturing control apparatus of an electronic device, the apparatus being configured to implement:

processing to generate, using a first database, a first model function relating to a relationship between a characteristic of a component included in the electronic device and first neighboring condition values of a manufacturing condition value relating to the component, the first neighboring condition values including a predetermined first processing condition value and a plurality of processing condition values near the first processing condition value, the characteristic including at least one selected from a value relating to a thickness of the component and a value relating to a dimension of the component when manufactured using the manufacturing condition value, the manufacturing condition value and the characteristic being stored with a mutual correlation in the first database;

processing to determine a first manufacturing condition value to obtain the characteristic of the component based on the first model function;

processing to calculate a squared prediction error of a measured value of the characteristic of the component for the first model function using the measured value of the characteristic and a measured value of the first manufacturing condition value when actually forming the component of the electronic device using the determined first manufacturing condition value; and

processing to set, in the case where the calculated squared prediction error is greater than a predetermined reference value, the first manufacturing condition value to be a second manufacturing condition value of the next electronic device without correcting the first model function, and to determine, in the case where the calculated squared prediction error is not more than the reference value, the second manufacturing condition value to obtain the characteristic of the component based on a second model function by generating the second model function using the first database including the addition of the measured value of the first manufacturing condition value and the measured value of the characteristic of the component of the actual forming.

2. The apparatus according to claim 1, configured to further implement processing to generate a virtual database when modifying a specification of the electronic device by converting values of the first database to reflect a change of the characteristic of the component according to the modification of the specification.

3. The apparatus according to claim 2, configured to further implement:

processing to generate, using the virtual database, a next-generation model function relating to a relationship between the characteristic of the component and next-generation neighboring condition values of the manufacturing condition value including a predetermined next-generation processing condition value and a plurality of processing condition values near the next-generation processing condition value;

processing to determine a next-generation manufacturing condition value to obtain the characteristic of the component based on the next-generation model function;

processing to actually form the component of the electronic device using the determined next-generation manufacturing condition value; and

processing to add a measured value of the next-generation manufacturing condition value and a measured value of the characteristic of the component of the actual forming to the virtual database and erase a combination of the manufacturing condition value of the virtual database nearest the next-generation manufacturing condition value and the value of the characteristic of the component corresponding to the nearest manufacturing condition value.

4. The apparatus according to claim 3, wherein the processing to erase the combination of the manufacturing condition value and the value of the characteristic is configured to use the values of a database of the entirety including the first database, the virtual database, and the newly-obtained next-generation measurement data as a reference space, calculate a model function of the reference space, calculate the squared prediction error of the virtual database for the model function, delete the data of the virtual database having the largest calculated squared prediction error, and add the actual measurement data to replace the deleted data.

5. The apparatus according to claim 4, configured to further implement processing to calculate a centroid of a group of the actual measurement data and perform a translation of a centroid of the virtual database to the position of the centroid of the group of the actual measurement data.

6. The apparatus according to claim 1, wherein the apparatus can communicate with a formation apparatus configured to form the component included in the electronic device.

7. The apparatus according to claim 1, wherein the apparatus can communicate with a measuring apparatus configured to measure the characteristic.

8. The apparatus according to claim 1, wherein the component includes an insulating film.

9. The apparatus according to claim 8, wherein the manufacturing condition value includes at least a temperature of film formation and a pressure of a processing chamber.

10. The apparatus according to claim 1, wherein the processing to determine the first manufacturing condition value is configured to calculate the manufacturing condition value by matrix inversion using the first model function and determine the calculated manufacturing condition value as the first manufacturing condition value.

11. The apparatus according to claim 1, wherein the processing to calculate the squared prediction error further includes processing to calculate the T² value of the measured value of the characteristic for the first model function using the measured value of the first manufacturing condition value and the measured value of the characteristic of the component when actually forming the component of the electronic device using the determined first manufacturing condition value, and at least one selected from the squared prediction error and the T² value is calculated.

12. The apparatus according to claim 11, wherein the processing to determine the second manufacturing condition value is configured to set, in the case where the calculated T² value is greater than a predetermined reference value, the first manufacturing condition value to be the second manufacturing condition value of the next electronic device without correcting the model function, and determine, in the case where the calculated T² value is not more than the reference value, the second manufacturing condition value to obtain the characteristic of the component based on the second model function by generating the second model function using the first database including the addition of the measured value of the first manufacturing condition value and the measured value of the characteristic of the component of the actual forming.

13. The apparatus according to claim 1, wherein the first model function is expressed as Y=a·

X, where the manufacturing condition value is X, the characteristic is Y, and a coefficient of the manufacturing condition value is a.

14. A manufacturing control system of an electronic device, the system comprising

a manufacturing control apparatus of the electronic device, the manufacturing control apparatus being configured to implement:

processing to generate, using a first database, a first model function relating to a relationship between a characteristic of a component included in the electronic device and first neighboring condition values of a manufacturing condition value relating to the component, the first neighboring condition values including a predetermined first processing condition value and a plurality of processing condition values near the first processing condition value, the characteristic including at least one selected from a value relating to a thickness of the component and a value relating to a dimension of the component when manufactured using the manufacturing condition value, the manufacturing condition value and the characteristic being stored with a mutual correlation in the first database;

processing to determine a first manufacturing condition value to obtain the characteristic of the component based on the first model function;

processing to calculate a squared prediction error of a measured value of the characteristic of the component for the first model function using the measured value of the characteristic and a measured value of the first manufacturing condition value when actually forming the component of the electronic device using the determined first manufacturing condition value; and

processing to set, in the case where the calculated squared prediction error is greater than a predetermined reference value, the first manufacturing condition value to be a second manufacturing condition value of the next electronic device without correcting the first model function, and to determine, in the case where the calculated squared prediction error is not more than the reference value, the second manufacturing condition value to obtain the characteristic of the component based on a second model function by generating the second model function using the first database including the addition of the measured value of the first manufacturing condition value and the measured value of the characteristic of the component of the actual forming, and

a formation apparatus configured to form the component included in the electronic device.

15. The system according to claim 14, wherein the manufacturing control apparatus is configured to further implement processing to generate a virtual database when modifying a specification of the electronic device by converting values of the first database to reflect a change of the characteristic of the component according to the modification of the specification.

16. The system according to claim 15, wherein the manufacturing control apparatus is configured to further implement:

processing to generate, using the virtual database, a next-generation model function relating to a relationship between the characteristic of the component and next-generation neighboring condition values of the manufacturing condition value including a predetermined next-generation processing condition value and a plurality of processing condition values near the next-generation processing condition value;

processing to determine a next-generation manufacturing condition value to obtain the characteristic of the component based on the next-generation model function;

processing to actually form the component of the electronic device using the determined next-generation manufacturing condition value; and

processing to add the measured value of the next-generation manufacturing condition value and the measured value of the characteristic of the component of the actual forming to the virtual database and erase a combination of the manufacturing condition value of the virtual database nearest the next-generation manufacturing condition value and the value of the characteristic of the component corresponding to the nearest manufacturing condition value.

17. The system according to claim 14, further comprising a measuring apparatus configured to measure the characteristic.

18. A manufacturing control program of an electronic device, the program being configured to:

cause a computer to implement processing to generate, using a first database, a first model function relating to a relationship between a characteristic of a component included in the electronic device and first neighboring condition values of a manufacturing condition value relating to the component, the first neighboring condition values including a predetermined first processing condition value and a plurality of processing condition values near the first processing condition value, the characteristic including at least one selected from a value relating to a thickness of the component and a value relating to a dimension of the component when manufactured using the manufacturing condition value, the manufacturing condition value and the characteristic being stored with a mutual correlation in the first database;

cause the computer to implement processing to determine a first manufacturing condition value to obtain the characteristic of the component based on the first model function;

cause the computer to implement processing to calculate a squared prediction error of a measured value of the characteristic of the component for the first model function using the measured value of the characteristic and a measured value of the first manufacturing condition value when actually forming the component of the electronic device using the determined first manufacturing condition value; and

cause the computer to implement processing to set, in the case where the calculated squared prediction error is greater than a predetermined reference value, the first manufacturing condition value to be a second manufacturing condition value of the next electronic device without correcting the first model function, and to determine, in the case where the calculated squared prediction error is not more than the reference value, the second manufacturing condition value to obtain the characteristic of the component based on a second model function by generating the second model function using the first database including the addition of the measured value of the first manufacturing condition value and the measured value of the characteristic of the component of the actual forming.

19. The program according to claim 18, configured to further cause the computer to implement processing to generate a virtual database when modifying a specification of the electronic device by converting values of the first database to reflect a change of the characteristic of the component according to the modification of the specification.

20. The program according to claim 19, configured to further cause the computer to implement:

processing to generate, using the virtual database, a next-generation model function relating to a relationship between the characteristic of the component and next-generation neighboring condition values of the manufacturing condition value including a predetermined next-generation processing condition value and a plurality of processing condition values near the next-generation processing condition value;

processing to determine a next-generation manufacturing condition value to obtain the characteristic of the component based on the next-generation model function;

processing to actually form the component of the electronic device using the determined next-generation manufacturing condition value; and

processing to add the measured value of the next-generation manufacturing condition value and the measured value of the characteristic of the component of the actual forming to the virtual database and erase a combination of the manufacturing condition value of the virtual database nearest the next-generation manufacturing condition value and the value of the characteristic of the component corresponding to the nearest manufacturing condition value.