CHIP INDUCTOR

• US 20130341758A1
• Filed: 05/31/2013
• Published: 12/26/2013
• Est. Priority Date: 05/31/2012
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LEE, Hwan Soo, CHA, Hye Yeon, PARK, Jung Min, HUR, Kang Heon, PARK, Moon Soo
• Granted Patent: US 9,472,608 B2
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01L 28/10 Inductors

Abstract

Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a through-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

Claims

1. A chip inductor, comprising:

a substrate on which a through-hole is formed;

a conductive coil that is formed on the substrate;

an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate;

a lower resin composite magnetic layer that is formed on a bottom portion of the substrate; and

an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

2. The chip inductor according to claim 1, wherein the substrate is made of a nonmagnetic material of resin or a ceramic material.

3. The chip inductor according to claim 2, wherein the through-hole formed on the substrate is formed in the center portion.

4. The chip inductor according to claim 1, wherein the upper and lower resin composite magnetic layers are made of a mixture of a metal magnetic material and a polymer material.

5. The chip inductor according to claim 1, wherein the upper and lower resin composite magnetic layers is made of ferrite or any one of metal materials of Mo-permalloy, permalloy, Fe—

Si—

Al alloy, Fe—

Si alloy, and amorphous.

6. The chip inductor according to claim 1, wherein an insulating layer is further formed outside the conductive coil, so that the upper resin composite magnetic layer and the conductive coil are insulated from each other.

7. The chip inductor according to claim 1, wherein the conductive coil is extended in two directions symmetrical to a quadrant of the substrate to thereby be electrically connected with the external electrode.

8. The chip inductor according to claim 1, wherein at least one of the through-hole is further formed on four edges of the substrate.

9. A chip inductor, comprising:

a substrate on which at least one through-hole is formed at four edges thereof;

a conductive coil that is formed on the substrate in the form of a spiral coil;

an insulating layer that is formed outside the conductive coil;

an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate;

a lower resin composite magnetic layer that is formed on a bottom portion of the substrate; and

an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

10. The chip inductor according to claim 9, wherein the upper and lower resin composite magnetic layers are separated from each other with respect to the substrate to thereby be made of a mixture of a metal magnetic material and a polymer material, and are made of the same material.

11. The chip inductor according to claim 9, wherein the substrate is made of a nonmagnetic material of resin or a ceramic material.

12. The chip inductor according to claim 9, wherein the upper and lower resin composite magnetic layers are made of ferrite or any one of metal materials of Mo-permalloy, permalloy, Fe—

Si—

Al alloy, Fe—

Si alloy, and amorphous.

13. The chip inductor according to claim 9, wherein the conductive coil is extended in two directions symmetric to a quadrant of the substrate to thereby be electrically connected with the external electrode.

14. The chip inductor according to claim 9, wherein the through-hole is further formed on the center portion of the substrate.